Metal coated solder

Industry

CPC
H05K2203/0435

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0435Metal coated solder

Industries

Patents Grantslast 30 patents

Information Patent Grant
Composite solder balls metallised on the surface and calibrated for...
- Patent number 12,030,138
- Issue date Jul 9, 2024
- LIPCO INDUSTRIE
- Constantin Iacob
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead free solder columns and methods for making same
- Patent number 10,937,752
- Issue date Mar 2, 2021
- TOPLINE CORPORATION
- Martin B. Hart
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package base, package, electronic device, electronic apparatus, and...
- Patent number 9,769,934
- Issue date Sep 19, 2017
- Seiko Epson Corporation
- Tetsuro Miyao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 8,759,958
- Issue date Jun 24, 2014
- Samsung Electronics Co., Ltd.
- Dong-Ki Ho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder joint reliability in microelectronic packaging
- Patent number 8,436,470
- Issue date May 7, 2013
- Intel Corporation
- Daewoong Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder structure, method for forming the solder structure, and semi...
- Patent number 8,344,522
- Issue date Jan 1, 2013
- Sanyo Electric Co., LTD
- Hideki Mizuhara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder joint reliability in microelectronic packaging
- Patent number 8,018,063
- Issue date Sep 13, 2011
- Intel Corporation
- Daewoong Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a circuit board
- Patent number 7,992,291
- Issue date Aug 9, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Hoe-Ku Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder joint reliability in microelectronic packaging
- Patent number 7,700,476
- Issue date Apr 20, 2010
- Intel Corporation
- Daewoong Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for soldering electronic component and soldering structure o...
- Patent number 7,632,710
- Issue date Dec 15, 2009
- Panasonic Corporation
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low temperature solder chip attach structure and process to produce...
- Patent number 6,994,243
- Issue date Feb 7, 2006
- International Business Machines Corporation
- Joseph M. Milewski
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low temperature solder chip attach structure
- Patent number 6,847,118
- Issue date Jan 25, 2005
- International Business Machines Corporation
- Joseph M. Milewski
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making lead-free solder and solder paste with improved we...
- Patent number 6,680,128
- Issue date Jan 20, 2004
- Agilent Technologies, Inc.
- Zequn Mei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
MATERIAL FOR ELECTRONIC COMPONENTS, METHOD OF CONNECTING MATERIAL F...
- Patent number 6,603,205
- Issue date Aug 5, 2003
- FCM Co., Ltd.
- Shigeki Miura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming reflowed solder ball with low melting point meta...
- Patent number 6,344,234
- Issue date Feb 5, 2002
- International Business Machines Corportion
- Hormazdyar Minocher Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process to produce a high temperature interconnection
- Patent number 6,330,967
- Issue date Dec 18, 2001
- International Business Machines Corporation
- Joseph M. Milewski
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for enhancing fatigue life of ball grid arrays
- Patent number 6,283,359
- Issue date Sep 4, 2001
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating an electronic circuit device and apparatus fo...
- Patent number 6,227,436
- Issue date May 8, 2001
- Hitachi, Ltd.
- Toru Nishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for enhancing fatigue life of ball grid arrays
- Patent number 6,158,644
- Issue date Dec 12, 2000
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capped solder bumps which form an interconnection with a tailored r...
- Patent number 6,127,731
- Issue date Oct 3, 2000
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for joining a chip to a circuit card
- Patent number 6,121,069
- Issue date Sep 19, 2000
- International Business Machines Corporation
- Christina M. Boyko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spheres useful in a detachable connective medium for ball grid arra...
- Patent number 6,037,065
- Issue date Mar 14, 2000
- The Westaim Corporation
- Karel Hajmrle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated solder preform array having a tin outer coating
- Patent number 5,957,364
- Issue date Sep 28, 1999
- Indium Corporation of America
- Paul A. Socha
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball limiting metal mask and tin enrichment of high melting point s...
- Patent number 5,953,623
- Issue date Sep 14, 1999
- International Business Machines Corporation
- Christina M. Boyko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating an electronic circuit device
- Patent number 5,865,365
- Issue date Feb 2, 1999
- Hitachi, Ltd.
- Toru Nishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating electronic circuit device and apparatus for p...
- Patent number 5,816,473
- Issue date Oct 6, 1998
- Hitachi, Ltd.
- Toru Nishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated solder column
- Patent number 5,641,990
- Issue date Jun 24, 1997
- Intel Corporation
- George W. Chiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for forming solder balls and solder columns
- Patent number 5,542,174
- Issue date Aug 6, 1996
- Intel Corporation
- George W. Chiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering method and apparatus for use in connecting electronic cir...
- Patent number 5,516,031
- Issue date May 14, 1996
- Hitachi, Ltd.
- Toru Nishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite transversely plastic interconnect for microchip carrier
- Patent number 5,409,157
- Issue date Apr 25, 1995
- Voddarahalli K. Nagesh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COMPOSITE SOLDER BALLS METALLISED ON THE SURFACE AND CALIBRATED FOR...
- Publication number 20220339742
- Publication date Oct 27, 2022
- LIFCO INDUSTRIE
- Constantin IACOB
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID SOLDER AND FILLED PASTE IN MICROELECTRONIC PACKAGING
- Publication number 20140291843
- Publication date Oct 2, 2014
- Hongjin Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board with buried circuit pattern
- Publication number 20110259627
- Publication date Oct 27, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Hoe-Ku Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER STRUCTURE, METHOD FOR FORMING THE SOLDER STRUCTURE, AND SEMI...
- Publication number 20110127669
- Publication date Jun 2, 2011
- Hideki Mizuhara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER JOINT RELIABILITY IN MICROELECTRONIC PACKAGING
- Publication number 20110051376
- Publication date Mar 3, 2011
- INTEL, INC.
- Daewoong Suh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor package and method of manufacturing the same
- Publication number 20100213591
- Publication date Aug 26, 2010
- Samsaung Electronics Co., Ltd.
- Dong-Ki Ho
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SOLDER JOINT RELIABILITY IN MICROELECTRONIC PACKAGING
- Publication number 20100044848
- Publication date Feb 25, 2010
- Daewoong Suh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENTS AND ITS METHOD OF MANU...
- Publication number 20090246911
- Publication date Oct 1, 2009
- IBIDEN, CO., LTD.
- Hiroyuki Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SOLDERING ELECTRONIC COMPONENT AND SOLDERING STRUCTURE O...
- Publication number 20090233117
- Publication date Sep 17, 2009
- Matsushita Electric Industrial Co., Ltd.
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method And Device For Enhancing Solderability
- Publication number 20090050470
- Publication date Feb 26, 2009
- Industrial Technology Research Institute
- Tao-Chih Chang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Solder joint reliability in microelectronic packaging
- Publication number 20080115968
- Publication date May 22, 2008
- Daewoong Suh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Circuit board and manufacturing method thereof
- Publication number 20080101045
- Publication date May 1, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Hoe-Ku Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PASTE
- Publication number 20070278456
- Publication date Dec 6, 2007
- Matsushita Electric Industrial Co., Ltd.
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method And Device For Enhancing Solderability
- Publication number 20070036952
- Publication date Feb 15, 2007
- Industrial Technology Research Institute
- Tao-Chih Chang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Low temperature solder chip attach structure and process to produce...
- Publication number 20050109820
- Publication date May 26, 2005
- International Business Machines Corporation
- Joseph M. Milewski
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making lead-free solder and solder paste with improved we...
- Publication number 20030059642
- Publication date Mar 27, 2003
- Zequn Mei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Structure and method for depositing solder bumps on a wafer
- Publication number 20020151164
- Publication date Oct 17, 2002
- Hunt Hang Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Material for electronic components, method of connecting material f...
- Publication number 20020071961
- Publication date Jun 13, 2002
- Shigeki Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low temperature solder chip attach structure
- Publication number 20020036227
- Publication date Mar 28, 2002
- Joseph M. Milewski
- H01 - BASIC ELECTRIC ELEMENTS

Metal coated solder

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Composite solder balls metallised on the surface and calibrated for...

Lead free solder columns and methods for making same

Package base, package, electronic device, electronic apparatus, and...

Semiconductor package and method of manufacturing the same

Solder joint reliability in microelectronic packaging

Solder structure, method for forming the solder structure, and semi...

Solder joint reliability in microelectronic packaging

Method of manufacturing a circuit board

Solder joint reliability in microelectronic packaging

Method for soldering electronic component and soldering structure o...

Low temperature solder chip attach structure and process to produce...

Low temperature solder chip attach structure

Method of making lead-free solder and solder paste with improved we...

MATERIAL FOR ELECTRONIC COMPONENTS, METHOD OF CONNECTING MATERIAL F...

Method for forming reflowed solder ball with low melting point meta...

Process to produce a high temperature interconnection

Method for enhancing fatigue life of ball grid arrays

Method of fabricating an electronic circuit device and apparatus fo...

Method for enhancing fatigue life of ball grid arrays

Capped solder bumps which form an interconnection with a tailored r...

Interconnect structure for joining a chip to a circuit card

Spheres useful in a detachable connective medium for ball grid arra...

Integrated solder preform array having a tin outer coating

Ball limiting metal mask and tin enrichment of high melting point s...

Method of fabricating an electronic circuit device

Method of fabricating electronic circuit device and apparatus for p...

Laminated solder column

Method and apparatus for forming solder balls and solder columns

Soldering method and apparatus for use in connecting electronic cir...

Composite transversely plastic interconnect for microchip carrier

Patents Applicationslast 30 patents

COMPOSITE SOLDER BALLS METALLISED ON THE SURFACE AND CALIBRATED FOR...

HYBRID SOLDER AND FILLED PASTE IN MICROELECTRONIC PACKAGING

Circuit board with buried circuit pattern

SOLDER STRUCTURE, METHOD FOR FORMING THE SOLDER STRUCTURE, AND SEMI...

SOLDER JOINT RELIABILITY IN MICROELECTRONIC PACKAGING

Semiconductor package and method of manufacturing the same

SOLDER JOINT RELIABILITY IN MICROELECTRONIC PACKAGING

SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENTS AND ITS METHOD OF MANU...

METHOD FOR SOLDERING ELECTRONIC COMPONENT AND SOLDERING STRUCTURE O...

Method And Device For Enhancing Solderability

Solder joint reliability in microelectronic packaging

Circuit board and manufacturing method thereof

SOLDER PASTE

Method And Device For Enhancing Solderability

Low temperature solder chip attach structure and process to produce...

Method of making lead-free solder and solder paste with improved we...

Structure and method for depositing solder bumps on a wafer

Material for electronic components, method of connecting material f...

Low temperature solder chip attach structure