Metal filled via

Industry

CPC
H05K2201/09563

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09563Metal filled via

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate
- Patent number 12,167,535
- Issue date Dec 10, 2024
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Technologies for power tunnels on circuit boards
- Patent number 12,156,331
- Issue date Nov 26, 2024
- Intel Corporation
- Khai Ern See
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semi-flex component carrier with dielectric material surrounding an...
- Patent number 12,127,338
- Issue date Oct 22, 2024
- AT&S(China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and preparation method thereof
- Patent number 12,114,424
- Issue date Oct 8, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Mei Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board comprising via
- Patent number 12,108,531
- Issue date Oct 1, 2024
- LG Innotek Co., Ltd
- Kyo Hun Koo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method therefor
- Patent number 12,101,891
- Issue date Sep 24, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Chao Peng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,101,880
- Issue date Sep 24, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hee-Joon Chun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-hole electrode substrate
- Patent number 12,080,637
- Issue date Sep 3, 2024
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to metallization of ceramic substrates...
- Patent number 12,058,806
- Issue date Aug 6, 2024
- Skyworks Solutions, Inc.
- Shaul Branchevsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board
- Patent number 12,041,729
- Issue date Jul 16, 2024
- Ibiden Co., Ltd.
- Satoru Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring circuit board
- Patent number 12,035,484
- Issue date Jul 9, 2024
- Nitto Denko Corporation
- Kenya Takimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic-based circuit board assemblies formed using metal nanoparti...
- Patent number 12,016,118
- Issue date Jun 18, 2024
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component-embedded substrate
- Patent number 11,979,986
- Issue date May 7, 2024
- Fujikura Ltd.
- Masakazu Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board for transmitting high-frequency signal and method for...
- Patent number 11,950,357
- Issue date Apr 2, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Fu-Yun Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 11,864,316
- Issue date Jan 2, 2024
- Fujikura Ltd.
- Naoki Oyaizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plated metallization structures
- Patent number 11,862,518
- Issue date Jan 2, 2024
- Analog Devices International Unlimited Company
- Jan Kubik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,832,397
- Issue date Nov 28, 2023
- Ibiden Co., Ltd.
- Masashi Awazu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 11,758,653
- Issue date Sep 12, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sang Hoon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with blind hole filled with an electrically condu...
- Patent number 11,700,690
- Issue date Jul 11, 2023
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method of manufacturing the wiring substrate
- Patent number 11,683,886
- Issue date Jun 20, 2023
- Shinko Electric Industries Co., Ltd.
- Toshiki Shirotori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method thereof
- Patent number 11,665,833
- Issue date May 30, 2023
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Ming-Jaan Ho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component-embedded substrate
- Patent number 11,638,351
- Issue date Apr 25, 2023
- Fujikura Ltd.
- Masakazu Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring body and method for manufacturing same
- Patent number 11,564,313
- Issue date Jan 24, 2023
- Nippon Mektron, Ltd.
- Fumihiko Matsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Passive thermal management for semiconductor laser based lidar tran...
- Patent number 11,539,183
- Issue date Dec 27, 2022
- BEIJING VOYAGER TECHNOLOGY CO., LTD.
- Yu-Ching Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and manufacture method of the circuit board
- Patent number 11,483,925
- Issue date Oct 25, 2022
- Unimicron Technology Corp.
- Chun Hung Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor substrate and method for manufacturing the same
- Patent number 11,398,421
- Issue date Jul 26, 2022
- Advanced Semiconductor Engineering, Inc.
- Chun-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate
- Patent number 11,362,028
- Issue date Jun 14, 2022
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic wiring board and method for producing the same
- Patent number 11,350,523
- Issue date May 31, 2022
- Murata Manufacturing Co., Ltd.
- Takahiro Sumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240422908
- Publication date Dec 19, 2024
- LG Innotek Co., Ltd.
- Kyo Hun KOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20240414844
- Publication date Dec 12, 2024
- LG Innotek Co., Ltd.
- Yong Suk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20240404934
- Publication date Dec 5, 2024
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20240407095
- Publication date Dec 5, 2024
- LG Innotek Co., Ltd.
- Han Sang KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240314932
- Publication date Sep 19, 2024
- Unimicron Technology Corp.
- Chen-An TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC-BASED CIRCUIT BOARD ASSEMBLIES FORMED USING METAL NANOPARTI...
- Publication number 20240292531
- Publication date Aug 29, 2024
- Kuprion Inc.
- Alfred A. ZINN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, MANUFACTURING METHOD, AND DISPLAY MODULE
- Publication number 20240284608
- Publication date Aug 22, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Gang Yuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240234289
- Publication date Jul 11, 2024
- Shinko Electric Industries Co., Ltd.
- Toshiki SHIROTORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single Step Electrolytic Method of Filling Through-Holes in Printed...
- Publication number 20240224432
- Publication date Jul 4, 2024
- MacDermid Enthone Inc.
- Donald Desalvo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240215157
- Publication date Jun 27, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Ki Ran PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240215165
- Publication date Jun 27, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Myong Keun Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS COATING TO MINIMIZE ROUGHNESS INSIDE THROUGH GLASS VIAS
- Publication number 20240188225
- Publication date Jun 6, 2024
- Intel Corporation
- Vinith BEJUGAM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PRODUCING LAYERED BODY, LAYERED BODY, AND MULTILAYERED BODY
- Publication number 20240096774
- Publication date Mar 21, 2024
- Toyobo Co., Ltd.
- Tetsuo OKUYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD TO ELIMINATE VIA STRIPING
- Publication number 20240080978
- Publication date Mar 7, 2024
- Dell Products L.P.
- Sandor FARKAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF REDUCING DEFECTS FROM PATTERN MISALIGNMENT
- Publication number 20240080994
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Gun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATES WITH CONTINUOUS SLOT VIAS
- Publication number 20240074055
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE
- Publication number 20240064893
- Publication date Feb 22, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Wei TAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS TO FILL THROUGH-HOLES OF A SUBSTRATE WITH METAL PASTE
- Publication number 20240049397
- Publication date Feb 8, 2024
- Reophotonics, Ltd.
- Michael Zenou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240040698
- Publication date Feb 1, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Sang Min AHN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240040697
- Publication date Feb 1, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jin Young Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20230397335
- Publication date Dec 7, 2023
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE, AND WIRING BOARD MANUFACTURING...
- Publication number 20230397342
- Publication date Dec 7, 2023
- Shinko Electric Industries Co., Ltd.
- Masayuki Mizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN DIELECTRIC SUBSTRATE FOR LOW THERMAL RESISTANCE AND LOW PARASI...
- Publication number 20230352384
- Publication date Nov 2, 2023
- Lumentum Operations LLC
- Wei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Package Vertical Interconnect and Method of Making Same
- Publication number 20230343687
- Publication date Oct 26, 2023
- Chipletz, Inc.
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR IN A SUBSTRATE VIA
- Publication number 20230319997
- Publication date Oct 5, 2023
- Intel Corporation
- Aslam HASWAREY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20230319992
- Publication date Oct 5, 2023
- Shinko Electric Industries Co., Ltd.
- Koichi Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230300983
- Publication date Sep 21, 2023
- KYOCERA CORPORATION
- Motohiro UMEHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER PRINTED CIRCUIT BOARD
- Publication number 20230292437
- Publication date Sep 14, 2023
- JESS-LINK PRODUCTS CO., LTD.
- Yu-Liang LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT-EMBEDDED SUBSTRATE
- Publication number 20230232532
- Publication date Jul 20, 2023
- FUJIKURA LTD.
- Masakazu Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230199974
- Publication date Jun 22, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Chan Hoon KO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Metal filled via

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring substrate

Technologies for power tunnels on circuit boards

Hermetic metallized via with improved reliability

Semi-flex component carrier with dielectric material surrounding an...

Circuit board and preparation method thereof

Circuit board comprising via

Circuit board and manufacturing method therefor

Printed circuit board

Through-hole electrode substrate

Devices and methods related to metallization of ceramic substrates...

Printed wiring board

Wiring circuit board

Ceramic-based circuit board assemblies formed using metal nanoparti...

Component-embedded substrate

Circuit board for transmitting high-frequency signal and method for...

Wiring substrate

Plated metallization structures

Printed wiring board and method for manufacturing printed wiring board

Circuit board structure and method for manufacturing a circuit boar...

Printed circuit board

Component carrier with blind hole filled with an electrically condu...

Wiring substrate and method of manufacturing the wiring substrate

Circuit board and manufacturing method thereof

Component-embedded substrate

Wiring body and method for manufacturing same

Passive thermal management for semiconductor laser based lidar tran...

Circuit board and manufacture method of the circuit board

Semiconductor substrate and method for manufacturing the same

Through-hole electrode substrate

Ceramic wiring board and method for producing the same

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

THROUGH-HOLE ELECTRODE SUBSTRATE

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

EMBEDDED INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

CERAMIC-BASED CIRCUIT BOARD ASSEMBLIES FORMED USING METAL NANOPARTI...

CIRCUIT BOARD, MANUFACTURING METHOD, AND DISPLAY MODULE

WIRING SUBSTRATE

Single Step Electrolytic Method of Filling Through-Holes in Printed...

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD

GLASS COATING TO MINIMIZE ROUGHNESS INSIDE THROUGH GLASS VIAS

METHOD FOR PRODUCING LAYERED BODY, LAYERED BODY, AND MULTILAYERED BODY

SYSTEM AND METHOD TO ELIMINATE VIA STRIPING

METHODS OF REDUCING DEFECTS FROM PATTERN MISALIGNMENT

SUBSTRATES WITH CONTINUOUS SLOT VIAS

CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE

METHODS TO FILL THROUGH-HOLES OF A SUBSTRATE WITH METAL PASTE

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD

WIRING SUBSTRATE

WIRING BOARD, SEMICONDUCTOR DEVICE, AND WIRING BOARD MANUFACTURING...

THIN DIELECTRIC SUBSTRATE FOR LOW THERMAL RESISTANCE AND LOW PARASI...

Through Package Vertical Interconnect and Method of Making Same

CAPACITOR IN A SUBSTRATE VIA

WIRING SUBSTRATE

CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

MULTI-LAYER PRINTED CIRCUIT BOARD

COMPONENT-EMBEDDED SUBSTRATE

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME