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  • H05K2201/09563
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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/09563Metal filled via
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD FOR PRODUCING LAYERED BODY, LAYERED BODY, AND MULTILAYERED BODY
    • Publication number 20240096774
    • Publication date Mar 21, 2024
    • Toyobo Co., Ltd.
    • Tetsuo OKUYAMA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SYSTEM AND METHOD TO ELIMINATE VIA STRIPING
    • Publication number 20240080978
    • Publication date Mar 7, 2024
    • Dell Products L.P.
    • Sandor FARKAS
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHODS OF REDUCING DEFECTS FROM PATTERN MISALIGNMENT
    • Publication number 20240080994
    • Publication date Mar 7, 2024
    • Samsung Electronics Co., Ltd.
    • Gun Lee
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SUBSTRATES WITH CONTINUOUS SLOT VIAS
    • Publication number 20240074055
    • Publication date Feb 29, 2024
    • Micron Technology, Inc.
    • Walter L. Moden
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE
    • Publication number 20240064893
    • Publication date Feb 22, 2024
    • Huawei Digital Power Technologies Co., Ltd.
    • Wei TAO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHODS TO FILL THROUGH-HOLES OF A SUBSTRATE WITH METAL PASTE
    • Publication number 20240049397
    • Publication date Feb 8, 2024
    • Reophotonics, Ltd.
    • Michael Zenou
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240040698
    • Publication date Feb 1, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Sang Min AHN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240040697
    • Publication date Feb 1, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Jin Young Choi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20230397335
    • Publication date Dec 7, 2023
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD, SEMICONDUCTOR DEVICE, AND WIRING BOARD MANUFACTURING...
    • Publication number 20230397342
    • Publication date Dec 7, 2023
    • Shinko Electric Industries Co., Ltd.
    • Masayuki Mizuno
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    THIN DIELECTRIC SUBSTRATE FOR LOW THERMAL RESISTANCE AND LOW PARASI...
    • Publication number 20230352384
    • Publication date Nov 2, 2023
    • Lumentum Operations LLC
    • Wei SHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Through Package Vertical Interconnect and Method of Making Same
    • Publication number 20230343687
    • Publication date Oct 26, 2023
    • Chipletz, Inc.
    • Bryan Black
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CAPACITOR IN A SUBSTRATE VIA
    • Publication number 20230319997
    • Publication date Oct 5, 2023
    • Intel Corporation
    • Aslam HASWAREY
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20230319992
    • Publication date Oct 5, 2023
    • Shinko Electric Industries Co., Ltd.
    • Koichi Nishimura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20230300983
    • Publication date Sep 21, 2023
    • KYOCERA CORPORATION
    • Motohiro UMEHARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MULTI-LAYER PRINTED CIRCUIT BOARD
    • Publication number 20230292437
    • Publication date Sep 14, 2023
    • JESS-LINK PRODUCTS CO., LTD.
    • Yu-Liang LIU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COMPONENT-EMBEDDED SUBSTRATE
    • Publication number 20230232532
    • Publication date Jul 20, 2023
    • FUJIKURA LTD.
    • Masakazu Sato
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20230199974
    • Publication date Jun 22, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Chan Hoon KO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20230180386
    • Publication date Jun 8, 2023
    • IBIDEN CO., LTD.
    • Naoki MIZUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20230145004
    • Publication date May 11, 2023
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20230147912
    • Publication date May 11, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Sang Hoon Kim
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ADDITIVE MANUFACTURING TECHNOLOGY MICROWAVE VERTICAL LAUNCH
    • Publication number 20230121347
    • Publication date Apr 20, 2023
    • Raytheon Company
    • Andrew R. Southworth
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING BOARD AND MANUFACTURING METHOD OF WIRING BOARD
    • Publication number 20230089948
    • Publication date Mar 23, 2023
    • Shinko Electric Industries Co., Ltd.
    • Takashi Kasuga
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20230092816
    • Publication date Mar 23, 2023
    • PanelSemi Corporation
    • CHIN-TANG LI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Forming Through Hole in Component Carrier by Laser Drilling Blind H...
    • Publication number 20230085035
    • Publication date Mar 16, 2023
    • AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    • Abderrazzaq IFIS
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CERAMIC-BASED CIRCUIT BOARD ASSEMBLIES FORMED USING METAL NANOPARTI...
    • Publication number 20230065796
    • Publication date Mar 2, 2023
    • Kuprion Inc.
    • Alfred A. ZINN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE WHICH INCLUDE MULTI...
    • Publication number 20230042852
    • Publication date Feb 9, 2023
    • HYEJIN KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
    • Publication number 20230007782
    • Publication date Jan 5, 2023
    • Avary Holding (Shenzhen) Co., Limited.
    • CHAO PENG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20220418107
    • Publication date Dec 29, 2022
    • LG Innotek Co., Ltd.
    • Kyo Hun KOO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20220408559
    • Publication date Dec 22, 2022
    • Samsung Electro-Mechanics Co., Ltd.
    • Hee-Joon CHUN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR