Metal foils

Industry

CPC
H05K2201/0355

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0355Metal foils

Industries

Patents Grantslast 30 patents

Information Patent Grant
Cyclic imide resin composition, prepreg, copper-clad laminate and p...
- Patent number 12,146,057
- Issue date Nov 19, 2024
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Iguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heater having flexible printed wiring board and method for manufact...
- Patent number 12,144,068
- Issue date Nov 12, 2024
- Nippon Mektron, Ltd.
- Garo Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low-roughness surface-treated copper foil with low bending deformat...
- Patent number 12,144,124
- Issue date Nov 12, 2024
- Lotte Energy Materials Corporation
- Chang Yol Yang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Reel mechanism and winding device for flexible copper clad laminate
- Patent number 12,120,828
- Issue date Oct 15, 2024
- AAC Technologies (Nanjing) Co., Ltd.
- Rui Pan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting electronic component, substrate and an optical s...
- Patent number 12,114,434
- Issue date Oct 8, 2024
- Canon Kabushiki Kaisha
- Shunsuke Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,114,417
- Issue date Oct 8, 2024
- Sumitomo Bakelite Co., Ltd.
- Nobuo Tagashira
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic-copper composite, ceramic circuit board, power module, and...
- Patent number 12,109,640
- Issue date Oct 8, 2024
- DENKA COMPANY LIMITED
- Akimasa Yuasa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Electronic device
- Patent number 12,082,349
- Issue date Sep 3, 2024
- HONOR DEVICE CO., LTD.
- Xiaoyong Dong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface-treated copper foil, copper-clad laminate and printed wirin...
- Patent number 12,063,747
- Issue date Aug 13, 2024
- Fukuda Metal Foil & Powder Co., Ltd.
- Takeshi Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer body
- Patent number 12,058,819
- Issue date Aug 6, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Rintaro Ishii
- B32 - LAYERED PRODUCTS
Information Patent Grant
Embedded circuit board, electronic device, and fabrication method t...
- Patent number 12,016,115
- Issue date Jun 18, 2024
- SHENNAN CIRCUITS CO., LTD.
- Beilei Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method of manufacturing the same
- Patent number 12,016,128
- Issue date Jun 18, 2024
- LG Innotek Co., Ltd
- Min Young Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for high-frequency printed wiring board
- Patent number RE49929
- Issue date Apr 16, 2024
- Sumitomo Electric Industries, Ltd.
- Shingo Kaimori
Information Patent Grant
Circuit board for transmitting high-frequency signal and method for...
- Patent number 11,950,357
- Issue date Apr 2, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Fu-Yun Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier-foil-attached ultra-thin copper foil
- Patent number 11,917,755
- Issue date Feb 27, 2024
- Lotte Energy Materials Corporation
- Won Jin Beom
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,917,768
- Issue date Feb 27, 2024
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper-clad laminate, wiring board, and copper foil provided with r...
- Patent number 11,895,770
- Issue date Feb 6, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yuki Inoue
- B32 - LAYERED PRODUCTS
Information Patent Grant
Printed circuit board
- Patent number 11,877,397
- Issue date Jan 16, 2024
- Sumitomo Electric Industries, Ltd.
- Junichi Motomura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper-clad laminate plate, resin-attached copper foil, and circuit...
- Patent number 11,866,536
- Issue date Jan 9, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yuki Kitai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Stretchable laminate, material for stretchable device, and stretcha...
- Patent number 11,864,310
- Issue date Jan 2, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takatoshi Abe
- A41 - WEARING APPAREL
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing electrolytic copper foil
- Patent number 11,773,501
- Issue date Oct 3, 2023
- TEX TECHNOLOGY INC.
- Ryoichi Oguro
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Surface-treated copper foil, and copper-clad laminate plate, resin-...
- Patent number 11,770,904
- Issue date Sep 26, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yuki Kitai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil with carrier
- Patent number 11,765,840
- Issue date Sep 19, 2023
- Mitsui Mining & Smelting Co., Ltd.
- Rintaro Ishii
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thermosetting resin composition, prepreg, resin sheet, metal foil-c...
- Patent number 11,760,871
- Issue date Sep 19, 2023
- Mitsubishi Gas Chemical Company, Inc.
- Yoshihiro Nakazumi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Low-dielectric adhesive composition
- Patent number 11,732,164
- Issue date Aug 22, 2023
- TOYOBO MC CORPORATION
- Ryo Sonoda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for manufacturing an electronic module and electronic module
- Patent number 11,716,816
- Issue date Aug 1, 2023
- IMBERATEK, LLC
- Antti Iihola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module
- Patent number 11,706,905
- Issue date Jul 18, 2023
- Murata Manufacturing Co., Ltd.
- Koji Furutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FPCB/FCCL replacing tinned-copper welding strip as photovoltaic mod...
- Patent number 11,677,034
- Issue date Jun 13, 2023
- GOLDEN SOLAR (QUANZHOU) NEW ENERGY TECHNOLOGY CO., LTD.
- Hsin-Wang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced reverse treated electrodeposited copper foil and copper cl...
- Patent number 11,655,555
- Issue date May 23, 2023
- CO-TECH DEVELOPMENT CORP.
- Yun-Hsing Sung
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
Printed Circuit Board, Manufacturing Method Thereof, and Battery Pa...
- Publication number 20240397616
- Publication date Nov 28, 2024
- LG ENERGY SOLUTION, LTD.
- Jae Young Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLIES WITH ALUMINUM PCB SUBSTRATES IN HO...
- Publication number 20240373543
- Publication date Nov 7, 2024
- GUANGZHOU ON-BRIGHT ELECTRONICS CO., LTD.
- XIAOKUI CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER CLAD LAMINATE AND PRINTED WIRING BOARD
- Publication number 20240349422
- Publication date Oct 17, 2024
- SONY GROUP CORPORATION
- Kenji UEDA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METAL FOIL, CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CIRCUIT BOARD
- Publication number 20240349423
- Publication date Oct 17, 2024
- GUANGZHOU FANGBANG ELECTRONICS CO., LTD.
- Meijuan Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD LAYER BUILD-UP PROCESS WITH ENHANCED POSITIONING PREC...
- Publication number 20240314942
- Publication date Sep 19, 2024
- Chia-Ming LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240298410
- Publication date Sep 5, 2024
- LG Innotek Co., Ltd.
- Min Young HWANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for preparing novel material layer structure of high-frequen...
- Publication number 20240244757
- Publication date Jul 18, 2024
- LongKai LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE-TREATED COPPER FOIL, COPPER-CLAD LAMINATE AND PRINTED WIRIN...
- Publication number 20240215172
- Publication date Jun 27, 2024
- Fukuda Metal Foil & Powder Co., Ltd.
- Takeshi OKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Copper Foil, Laminate, and Flexible Printed Wiring Board
- Publication number 20240215153
- Publication date Jun 27, 2024
- JX Metals Corporation
- Yuji Ishino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRA-THIN COPPER FOIL WITH CARRIER FOIL AND METHOD FOR MANUFACTURI...
- Publication number 20240206062
- Publication date Jun 20, 2024
- Lotte Energy Materials Corporation
- Chang Yol YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROUGHENED COPPER FOIL, COPPER-CLADDED LAMINATE BOARD, AND PRINTED W...
- Publication number 20240172359
- Publication date May 23, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Ayumu TATEOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible Printed Wiring Board and Method for Manufacturing Same
- Publication number 20240155763
- Publication date May 9, 2024
- Nippon Mektron, Ltd.
- Yoshihiko Narisawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL MODULE AND METHOD OF MANUFACTURING AN ELECTRICAL MODULE
- Publication number 20240145323
- Publication date May 2, 2024
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Uwe Waltrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device
- Publication number 20240130048
- Publication date Apr 18, 2024
- Honor Device Co., Ltd.
- Xiaoyong Dong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW-ROUGHNESS SURFACE-TREATED COPPER FOIL WITH LOW BENDING DEFORMAT...
- Publication number 20240121902
- Publication date Apr 11, 2024
- Lotte Energy Materials Corporation
- Chang Yol YANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
RESIN COMPOSITION, COPPER FOIL WITH RESIN, AND PRINTED WIRING BOARD
- Publication number 20240101858
- Publication date Mar 28, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Kazuhiro OOSAWA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240098880
- Publication date Mar 21, 2024
- KMW Inc.
- Bae Mook JEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD CONNECTION STRUCTURE AND PREPARATION METHOD THEREFOR
- Publication number 20240098908
- Publication date Mar 21, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHIH-CHIEH FU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING THROUGH-VIA METAL WIRING
- Publication number 20240080993
- Publication date Mar 7, 2024
- EXTOLCO.,LTD.
- Sung Woong KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240040697
- Publication date Feb 1, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jin Young Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL FOIL, METAL FOIL WITH CARRIER COMPRISING SAME, AND PRINTED CI...
- Publication number 20240015885
- Publication date Jan 11, 2024
- YMT CO., LTD.
- Sung Wook CHUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT AND ANTENNA STRUCTURE
- Publication number 20230363089
- Publication date Nov 9, 2023
- WISTRON NEWEB CORPORATION
- Li-Kai KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUORORESIN FILM, COPPER-CLAD LAMINATE AND SUBSTRATE FOR CIRCUIT
- Publication number 20230363090
- Publication date Nov 9, 2023
- DAIKIN INDUSTRIES, LTD.
- Hirokazu KOMORI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND PREPARATION METHOD THEREOF, AND ELECTRONI...
- Publication number 20230354506
- Publication date Nov 2, 2023
- Huawei Technologies Co., Ltd
- Feng GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER FOIL, FLEXIBLE COPPER-CLAD LAMINATE, AND PRINTED CIRCUIT MAD...
- Publication number 20230354517
- Publication date Nov 2, 2023
- DUPONT ELECTRONICS, INC.
- Shih-Ching LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHODS FOR COPPER-CLAD LAMINATE AND PRINTED WIRING B...
- Publication number 20230276579
- Publication date Aug 31, 2023
- Mitsui Mining and Smelting Co., Ltd.
- Daisuke NAKAJIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER-CLAD LAMINATE PLATE AND PRINTED WIRING BOARD
- Publication number 20230276571
- Publication date Aug 31, 2023
- Mitsui Mining and Smelting Co., Ltd.
- Daisuke NAKAJIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Curable Compositions
- Publication number 20230265275
- Publication date Aug 24, 2023
- AGC Multi Material America, Inc.
- Tomoaki Nakanishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING PROCESS FOR EMBEDDED CHIPS
- Publication number 20230230929
- Publication date Jul 20, 2023
- Guangdong ZECHENG Technology Co., LTD
- CHIA-MING LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Asymmetric Build-Up And Methods for Determin...
- Publication number 20230217589
- Publication date Jul 6, 2023
- AT&S (China) Co. Ltd.
- Diego LORENZONI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Metal foils

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Cyclic imide resin composition, prepreg, copper-clad laminate and p...

Heater having flexible printed wiring board and method for manufact...

Low-roughness surface-treated copper foil with low bending deformat...

Reel mechanism and winding device for flexible copper clad laminate

Method of mounting electronic component, substrate and an optical s...

Circuit board

Ceramic-copper composite, ceramic circuit board, power module, and...

Electronic device

Surface-treated copper foil, copper-clad laminate and printed wirin...

Multilayer body

Embedded circuit board, electronic device, and fabrication method t...

Circuit board and method of manufacturing the same

Substrate for high-frequency printed wiring board

Circuit board for transmitting high-frequency signal and method for...

Carrier-foil-attached ultra-thin copper foil

Single-layer circuit board, multi-layer circuit board, and manufact...

Copper-clad laminate, wiring board, and copper foil provided with r...

Printed circuit board

Copper-clad laminate plate, resin-attached copper foil, and circuit...

Stretchable laminate, material for stretchable device, and stretcha...

Circuit board structure and method for manufacturing a circuit boar...

Method for producing electrolytic copper foil

Surface-treated copper foil, and copper-clad laminate plate, resin-...

Copper foil with carrier

Thermosetting resin composition, prepreg, resin sheet, metal foil-c...

Low-dielectric adhesive composition

Method for manufacturing an electronic module and electronic module

Module

FPCB/FCCL replacing tinned-copper welding strip as photovoltaic mod...

Advanced reverse treated electrodeposited copper foil and copper cl...

Patents Applicationslast 30 patents

Printed Circuit Board, Manufacturing Method Thereof, and Battery Pa...

PRINTED CIRCUIT BOARD ASSEMBLIES WITH ALUMINUM PCB SUBSTRATES IN HO...

COPPER CLAD LAMINATE AND PRINTED WIRING BOARD

METAL FOIL, CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CIRCUIT BOARD

CIRCUIT BOARD LAYER BUILD-UP PROCESS WITH ENHANCED POSITIONING PREC...

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Method for preparing novel material layer structure of high-frequen...

SURFACE-TREATED COPPER FOIL, COPPER-CLAD LAMINATE AND PRINTED WIRIN...

Copper Foil, Laminate, and Flexible Printed Wiring Board

ULTRA-THIN COPPER FOIL WITH CARRIER FOIL AND METHOD FOR MANUFACTURI...

ROUGHENED COPPER FOIL, COPPER-CLADDED LAMINATE BOARD, AND PRINTED W...

Flexible Printed Wiring Board and Method for Manufacturing Same

ELECTRICAL MODULE AND METHOD OF MANUFACTURING AN ELECTRICAL MODULE

Electronic Device

LOW-ROUGHNESS SURFACE-TREATED COPPER FOIL WITH LOW BENDING DEFORMAT...

RESIN COMPOSITION, COPPER FOIL WITH RESIN, AND PRINTED WIRING BOARD

ELECTRONIC DEVICE

CIRCUIT BOARD CONNECTION STRUCTURE AND PREPARATION METHOD THEREFOR

METHOD FOR FORMING THROUGH-VIA METAL WIRING

PRINTED CIRCUIT BOARD

METAL FOIL, METAL FOIL WITH CARRIER COMPRISING SAME, AND PRINTED CI...

FLEXIBLE PRINTED CIRCUIT AND ANTENNA STRUCTURE

FLUORORESIN FILM, COPPER-CLAD LAMINATE AND SUBSTRATE FOR CIRCUIT

PRINTED CIRCUIT BOARD AND PREPARATION METHOD THEREOF, AND ELECTRONI...

COPPER FOIL, FLEXIBLE COPPER-CLAD LAMINATE, AND PRINTED CIRCUIT MAD...

MANUFACTURING METHODS FOR COPPER-CLAD LAMINATE AND PRINTED WIRING B...

COPPER-CLAD LAMINATE PLATE AND PRINTED WIRING BOARD

Curable Compositions

PACKAGING PROCESS FOR EMBEDDED CHIPS

Component Carrier With Asymmetric Build-Up And Methods for Determin...