Metallic balls

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CPC
H05K2201/10234

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10234Metallic balls

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Ceramic electronic component, substrate arrangement, and method of...
- Patent number 12,198,859
- Issue date Jan 14, 2025
- Taiyo Yuden Co., Ltd.
- Yasutomo Suga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure
- Patent number 12,200,861
- Issue date Jan 14, 2025
- Unimicron Technology Corp.
- Guang-Hwa Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shielded interconnect system
- Patent number 12,167,582
- Issue date Dec 10, 2024
- GITech, Inc.
- John Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Massage roller and conductive structure thereof
- Patent number 12,090,108
- Issue date Sep 17, 2024
- Xiamen High Top Electronic Technology Co., Ltd.
- Liangsan Zhao
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Overlapping printed circuit boards and electronic device including...
- Patent number 11,812,555
- Issue date Nov 7, 2023
- Samsung Electronics Co., Ltd.
- Jinyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of circuit carrier board structure
- Patent number 11,678,441
- Issue date Jun 13, 2023
- Unimicron Technology Corp.
- Wei-Ti Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnetic matrix connector for high density, soft neural interface
- Patent number 11,417,987
- Issue date Aug 16, 2022
- Northeastern University
- Hui Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overlapping printed circuit boards and electronic device including...
- Patent number 11,330,716
- Issue date May 10, 2022
- Samsung Electronics Co., Ltd.
- Jinyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,264,742
- Issue date Mar 1, 2022
- Samsung Display Co., Ltd.
- Chan Yoon Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit carrier board and manufacturing method thereof
- Patent number 11,032,917
- Issue date Jun 8, 2021
- Unimicron Technology Corp.
- Wei-Ti Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit carrier board structure and manufacturing method thereof
- Patent number 10,888,001
- Issue date Jan 5, 2021
- Unimicron Technology Corp.
- Wei-Ti Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite substrate structure and manufacturing method thereof
- Patent number 10,863,618
- Issue date Dec 8, 2020
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, electronic device, method of manufacturing se...
- Patent number 10,595,412
- Issue date Mar 17, 2020
- Fujitsu Limited
- Shinya Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device containing and method of providing carbon covered copper layer
- Patent number 10,546,826
- Issue date Jan 28, 2020
- Intel IP Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive ball and electronic device
- Patent number 10,446,512
- Issue date Oct 15, 2019
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer-capped rechargeable power source
- Patent number 10,446,331
- Issue date Oct 15, 2019
- Analog Devices, Inc.
- Baoxing Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive particle, and connection material, connection structure,...
- Patent number 10,412,838
- Issue date Sep 10, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Arata Kishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board interconnection structure and circuit board interconn...
- Patent number 10,080,298
- Issue date Sep 18, 2018
- Panasonic Corporation
- Hideki Eifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, method of manufacturing the same, element housing pac...
- Patent number 9,954,160
- Issue date Apr 24, 2018
- Seiko Epson Corporation
- Hideki Ishigami
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Light guiding device and electronic device having light conducting...
- Patent number 9,903,754
- Issue date Feb 27, 2018
- NANNING FUGUI PRECISION INDUSTRIAL CO., LTD.
- Xiao-Hu Tang
- G01 - MEASURING TESTING
Information Patent Grant
Light emitting device and method of manufacturing the same
- Patent number 9,905,740
- Issue date Feb 27, 2018
- Nichia Corporation
- Satoshi Shirahama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded buffer circuit compensation scheme for integrated circuits
- Patent number 9,813,046
- Issue date Nov 7, 2017
- Intel Corporation
- Sameer Shekhar
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Clamp interconnect
- Patent number 9,711,879
- Issue date Jul 18, 2017
- Infinera Corporation
- John Michael Coronati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump electrode, board which has bump electrodes, and method for man...
- Patent number 9,662,730
- Issue date May 30, 2017
- Senju Metal Industry Co., Ltd.
- Takahiro Hattori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic wave shielding film and method for producing a circ...
- Patent number 9,609,792
- Issue date Mar 28, 2017
- GUANGZHOU FANG BANG ELECTRONICS CO., LTD.
- Zhi Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Array substrate assembly and display device
- Patent number 9,560,756
- Issue date Jan 31, 2017
- Hefei BOE Optoelectronics Technology Co., Ltd.
- Juncai Ma
- G02 - OPTICS
Information Patent Grant
Package structure
- Patent number 9,485,868
- Issue date Nov 1, 2016
- Nantong Fujitsu Microelectronics Co., Ltd.
- Yujuan Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 9,456,504
- Issue date Sep 27, 2016
- Shinko Electric Industries Co., Ltd.
- Tomoki Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wireless module and production method for wireless module
- Patent number 9,437,535
- Issue date Sep 6, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Maki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump-on-trace methods and structures in packaging
- Patent number 9,385,097
- Issue date Jul 5, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun Yi Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC SUB-ASSEMBLY INCLUDING CERAMIC SUBSTRATE WITH CONDUCTIVE...
- Publication number 20240407096
- Publication date Dec 5, 2024
- MELLANOX TECHNOLOGIES, LTD.
- Ihab KHOURY
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20240397623
- Publication date Nov 28, 2024
- KYOCERA CORPORATION
- Keizou SAKURAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE
- Publication number 20240235071
- Publication date Jul 11, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE
- Publication number 20240188226
- Publication date Jun 6, 2024
- Innolux Corporation
- Wei-Lun Shieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE
- Publication number 20240136739
- Publication date Apr 25, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CONNECTING STRUCTURE
- Publication number 20240128665
- Publication date Apr 18, 2024
- Min Di Consultants Ltd.
- Chi-Di LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230387026
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- SEONGHO SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20230371182
- Publication date Nov 16, 2023
- MURATA MANUFACTURING CO., LTD.
- Yoshiki TOBITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20230115957
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- KIJU LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE
- Publication number 20230046699
- Publication date Feb 16, 2023
- Unimicron Technology Corp.
- Guang-Hwa Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC ELECTRONIC COMPONENT, SUBSTRATE ARRANGEMENT, AND METHOD OF...
- Publication number 20220301778
- Publication date Sep 22, 2022
- Taiyo Yuden Co., Ltd.
- Yasutomo SUGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Massage Roller and Conductive Structure thereof
- Publication number 20220031561
- Publication date Feb 3, 2022
- Xiamen High Top Electronic Technology Co.,Ltd.
- Liangsan ZHAO
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Shielded Interconnect System
- Publication number 20220022348
- Publication date Jan 20, 2022
- GITech, Inc.
- John Williams
- G01 - MEASURING TESTING
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT CARRIER BOARD
- Publication number 20210282277
- Publication date Sep 9, 2021
- Unimicron Technology Corp.
- Wei-Ti Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT CARRIER BOARD STRUCTURE
- Publication number 20210076508
- Publication date Mar 11, 2021
- Unimicron Technology Corp.
- Wei-Ti Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE
- Publication number 20210066828
- Publication date Mar 4, 2021
- SAMSUNG DISPLAY CO., LTD.
- Chan Yoon WOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for Manufacturing Electronic Devices
- Publication number 20200352034
- Publication date Nov 5, 2020
- Thomas Bemmerl
- B22 - CASTING POWDER METALLURGY
Information Patent Application
COMPOSITE SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200196440
- Publication date Jun 18, 2020
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA LOW-COST, LOW LEADTIME, AND HIGH DENSITY SPACE TRANSFORMER FO...
- Publication number 20200072871
- Publication date Mar 5, 2020
- Intel Corporation
- Pooya Tadayon
- G01 - MEASURING TESTING
Information Patent Application
DEVICE CONTAINING AND METHOD OF PROVIDING CARBON COVERED COPPER LAYER
- Publication number 20200006263
- Publication date Jan 2, 2020
- Intel IP Corporation
- Georg Seidemann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT CARRIER BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20190380211
- Publication date Dec 12, 2019
- Unimicron Technology Corp.
- Wei-Ti Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT CARRIER BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20190380210
- Publication date Dec 12, 2019
- Unimicron Technology Corp.
- Wei-Ti Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OVERLAPPING PRINTED CIRCUIT BOARDS AND ELECTRONIC DEVICE INCLUDING...
- Publication number 20190373729
- Publication date Dec 5, 2019
- Samsung Electronics Co., Ltd.
- Jinyong PARK
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CONDUCTIVE BALL AND ELECTRONIC DEVICE
- Publication number 20190013285
- Publication date Jan 10, 2019
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY MODULE WITH INTEGRATED CONFORMAL SHIELD ANTENNA
- Publication number 20180294558
- Publication date Oct 11, 2018
- SKYWORKS SOLUTIONS, INC.
- Dinhphuoc Vu Hoang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BALL
- Publication number 20180240568
- Publication date Aug 23, 2018
- Little Device Corporation
- Akimichi TAKIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST SOCKET, TEST SOCKET MANUFACTURING METHOD, AND JIG ASSEMBLY FOR...
- Publication number 20180188290
- Publication date Jul 5, 2018
- OKINS ELECTRONICS CO.,LTD
- Sung Gye PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD
- Publication number 20180160533
- Publication date Jun 7, 2018
- KINSUS INTERCONNECT TECHNOLOGY CORP.
- Ting-Hao LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, METHOD OF MANUFACTURING SE...
- Publication number 20180063960
- Publication date Mar 1, 2018
- Fujitsu Limited
- Shinya Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT GUIDING DEVICE AND ELECTRONIC DEVICE
- Publication number 20170350751
- Publication date Dec 7, 2017
- NANNING FUGUI PRECISION INDUSTRIAL CO., LTD.
- XIAO-HU TANG
- G01 - MEASURING TESTING

Metallic balls

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Ceramic electronic component, substrate arrangement, and method of...

Circuit board structure

Shielded interconnect system

Massage roller and conductive structure thereof

Overlapping printed circuit boards and electronic device including...

Manufacturing method of circuit carrier board structure

Magnetic matrix connector for high density, soft neural interface

Overlapping printed circuit boards and electronic device including...

Display device

Circuit carrier board and manufacturing method thereof

Circuit carrier board structure and manufacturing method thereof

Composite substrate structure and manufacturing method thereof

Semiconductor device, electronic device, method of manufacturing se...

Device containing and method of providing carbon covered copper layer

Conductive ball and electronic device

Wafer-capped rechargeable power source

Conductive particle, and connection material, connection structure,...

Circuit board interconnection structure and circuit board interconn...

Wiring board, method of manufacturing the same, element housing pac...

Light guiding device and electronic device having light conducting...

Light emitting device and method of manufacturing the same

Embedded buffer circuit compensation scheme for integrated circuits

Clamp interconnect

Bump electrode, board which has bump electrodes, and method for man...

Electromagnetic wave shielding film and method for producing a circ...

Array substrate assembly and display device

Package structure

Electronic device

Wireless module and production method for wireless module

Bump-on-trace methods and structures in packaging

Patents Applicationslast 30 patents

ELECTRONIC SUB-ASSEMBLY INCLUDING CERAMIC SUBSTRATE WITH CONDUCTIVE...

WIRING BOARD

CIRCUIT MODULE

MANUFACTURING METHOD OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE

CIRCUIT MODULE

FLEXIBLE CONNECTING STRUCTURE

SEMICONDUCTOR PACKAGE

WIRING BOARD

SEMICONDUCTOR PACKAGES

CIRCUIT BOARD STRUCTURE

CERAMIC ELECTRONIC COMPONENT, SUBSTRATE ARRANGEMENT, AND METHOD OF...

Massage Roller and Conductive Structure thereof

Shielded Interconnect System

MANUFACTURING METHOD OF CIRCUIT CARRIER BOARD

MANUFACTURING METHOD OF CIRCUIT CARRIER BOARD STRUCTURE

DISPLAY DEVICE

Methods for Manufacturing Electronic Devices

COMPOSITE SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

ULTRA LOW-COST, LOW LEADTIME, AND HIGH DENSITY SPACE TRANSFORMER FO...

DEVICE CONTAINING AND METHOD OF PROVIDING CARBON COVERED COPPER LAYER

CIRCUIT CARRIER BOARD AND MANUFACTURING METHOD THEREOF

CIRCUIT CARRIER BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

OVERLAPPING PRINTED CIRCUIT BOARDS AND ELECTRONIC DEVICE INCLUDING...

CONDUCTIVE BALL AND ELECTRONIC DEVICE

RADIO-FREQUENCY MODULE WITH INTEGRATED CONFORMAL SHIELD ANTENNA

CONDUCTIVE BALL

TEST SOCKET, TEST SOCKET MANUFACTURING METHOD, AND JIG ASSEMBLY FOR...

MULTILAYER PRINTED CIRCUIT BOARD

SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, METHOD OF MANUFACTURING SE...

LIGHT GUIDING DEVICE AND ELECTRONIC DEVICE