The present invention relates to a connecting structure, especially relates to a flexible connecting structure for transmitting a plurality of signals between electronic devices.
U.S. Pat. No. 7,950,953 disclosed a multicore cable connector, the multicore cable connector 1 includes a cable fixing member 2, an aggregate cable 3 fixed in the cable fixing member 2, an aligning plate 4 for aligning the signal lines included in the aggregate cable 3 and a substrate 5 conductively connected with the signal lines of the aggregate cable 3.
The aggregate cable 3 includes a plurality of single cables each having two signal lines 312. The aggregate cable 3 further includes conductive drain wires 32 arranged along the outer periphery of a plurality of the single cables 31.
The substrate 5 has a front surface 51 and a back surface 52, each formed with a wiring pattern 53. An end of each wiring pattern 53 is formed with a land 54 making up a contact point with a socket (not shown) to be fitted with the connector 1, and the other end of each wiring pattern 53 is formed with a signal line mounting unit 55 making up a contact point with the signal lines 312 and a drain wire mounting unit 56 making up a contact point with the drain wire 32.
The disadvantage for the prior art is the plurality of cables used as the partial structure of the connector which is bulky and adverse to minimizing the connector between electronic devices.
The present invention relates to a connecting structure for transmitting a plurality of signals between electronic devices. For example, a connector for transmitting signals between a mother board and an Electro-Optical Circuit Board (EOCB).
A plurality of first metal pads P11 are configured on a right bottom surface of the first circuit board B11. Each first metal pad P11 is electrically coupled with a corresponding first signal trace T11. A plurality of second metal pads P12 are configured on a right top of the first circuit board B11. Each second metal pad P12 is electrically coupled with a corresponding first metal pad P11 through a corresponding metal via configured between them. A ground metal GND is configured on a top surface of the first circuit board B11.
A second circuit board B12 is configured on a bottom side of the first circuit board B11. A plurality of first metal vias V11 are configured at a left end of the second circuit board B12. Each first metal via V11 is electrically coupled with a corresponding first signal trace T11 through a corresponding first metal ball 101 and a metal pad configured between them. A plurality of second signal traces T12 are longitudinally configured on a bottom of the second circuit board B12. A plurality of third metal pads P13 are configured on a right bottom of the second circuit board B12. Each third metal pad P13 is electrically coupled with a corresponding second signal trace T12. A plurality of fourth metal pads P14 are configured on a right top of the second circuit board B12. Each fourth metal pad P14 is electrically coupled with a corresponding third metal pad P13 through a corresponding metal via configured between them. A ground metal GND is configured on a top surface of the second circuit board B12.
The left end of the first circuit board B11 and the left end of the second circuit board B12 are fixed with each other through a plurality of first metal balls 101. The right end of the first circuit board B11 floats up and down, and the right end of the second circuit board B12 floats, deflectable up and down.
A third circuit board B13 is configured on a bottom side of the second circuit board B12. A plurality of second metal vias V12 and third metal vias V13 are configured at a left end of the third circuit board B13. Each second metal via V12 is aligned with and electrically coupled with a corresponding first metal via V11 through a corresponding second metal ball 102 configured between them, and each third metal via V13 is electrically coupled with a corresponding second signal trace T12 through a corresponding third metal ball 103 configured between them. Each second metal ball 102 is electrically coupled with a corresponding first metal via V11 through a metal pad configured between them. Each third metal ball 103 is electrically coupled with a corresponding second signal trace T12. A plurality of fifth metal pads P15 are configured on a right bottom of the third circuit board B13. Each fifth metal pad P15 is electrically coupled with a corresponding third signal trace T13. A plurality of sixth metal pads P16 are configured on the right top of the third circuit board B13. Each sixth metal pad P16 is electrically coupled with a corresponding fifth metal pad P15 through a corresponding metal via configured between them. A ground metal GND is configured on a top surface of the third circuit board B13.
The left end of the second circuit board B12 and the left end of the third circuit board B13 are fixed with each other through a plurality of second metal balls 102 and third metal balls 103, and the right end of the third circuit board B13 floats, deflectable up and down. A fourth circuit board B14 is configured on a bottom side of the third circuit board B13. A plurality of fourth metal vias V14, fifth metal vias V15, and sixth metal vias V16 are configured at a left end of the fourth circuit board B14. Each fourth metal via V14 is aligned with and electrically coupled with a corresponding second metal via V12 through a corresponding fourth metal ball 104 configured between them. Each fifth metal via V15 is aligned with and electrically coupled with a corresponding third metal via V13 through a corresponding fifth metal ball 105 configured between them. Each sixth metal via V16 is electrically coupled with a corresponding third signal trace T13 through a corresponding sixth metal ball 106 and a metal pad configured between them. Each fourth metal ball 104 is electrically coupled with a corresponding second metal via V12 through a metal pad configured between them. Each fifth metal ball 105 is electrically coupled with a corresponding third metal via V13 through a metal pad configured between them. Each sixth metal ball 106 is electrically coupled with a corresponding third signal trace T13. A plurality of seventh metal pads P17 are configured on a right bottom of the fourth circuit board B14. Each seventh metal pad P17 is electrically coupled with a corresponding fourth signal trace T14. A plurality of eighth metal pads P18 are configured on the right top of the fourth circuit board B14. Each eighth metal pad P18 is electrically coupled with a corresponding seventh metal pad P17 through a corresponding metal via configured between them. A ground metal GND is configured on a top surface of the fourth circuit board B14.
The left end of the third circuit board B13 and the left end of the fourth circuit board B14 are fixed with each other through a plurality of fourth metal balls 104, fifth metal balls 105, and sixth metal balls 106, and the right end of the fourth circuit board B14 floats, deflectable up and down. A plurality of ninth metal pads P19, a plurality of tenth metal pads P20, a plurality of eleventh metal pads P21, and a plurality of twelfth metal pads P22 are configured on a bottom surface of the fourth circuit board B14. Each ninth metal pad P11 is configured on a bottom side of a corresponding fourth metal via V14. Each tenth metal pad P12 is configured on a bottom side of a corresponding fifth metal via V15. Each eleventh metal pad P13 is configured on a bottom side of a corresponding sixth metal via V16. Each twelfth metal pad P14 is configured on a left end of a corresponding fourth signal trace T14.
The bottom view shows the plurality of ninth metal pads P19, tenth metal pads P20, eleventh metal pads P21, twelfth metal pads P22, the plurality of fourth signal traces T14, and the plurality of seventh metal pads P17. Each twelfth metal pad P22 is electrically coupled with a corresponding seventh metal pad P17 through a corresponding fourth signal trace T14. A ground pad GND is configured between each two seventh metal pads P17.
A mother board B200 can be configured on a bottom side of the flexible connecting structure of
When the mother board B200 is configured on a bottom of the flexible connecting structure, each thirteenth metal pad P23 is aligned with and electrically coupling with a corresponding seventh metal ball 107, each fourteenth metal pad P24 is aligned with and electrically coupling with a corresponding eighth metal ball 108, each fifteenth metal pad P25 is aligned with and electrically coupling with a corresponding ninth metal ball 109. Each sixteenth metal pad P26 is aligned with and electrically coupling with a corresponding tenth metal ball 110. Each first signal S1 is transmitted upward to a corresponding first signal trace T11 through a corresponding thirteenth metal pad P23. Each second signal S2 is transmitted upward to a corresponding second signal trace T12 through a corresponding fourteenth metal pad P24. Each third signal S3 is transmitted upward to a corresponding third signal trace T13 through a corresponding fifteenth metal pad P25. Each fourth signal S4 is transmitted upward to a corresponding fourth signal trace T14 through a corresponding sixteenth metal pad P26.
For the first clamp C11, each upper right V-shaped metal pin K111 is electrically coupled with a corresponding first signal trace T11 for transmitting a corresponding first signal S1. Each lower right inverted V-shaped metal pin K112 is electrically coupled with a corresponding second signal trace T12 for transmitting a corresponding second signal S2. For the second clamp C12, each upper right V-shaped metal pin K113 is electrically coupled with a corresponding third signal trace T13 for transmitting a corresponding third signal S3. Each lower right inverted V-shaped metal pin K114 is electrically coupled with a corresponding fourth signal trace T14 for transmitting a corresponding fourth signal S4.
A plurality of bottom first metal pads P301 are configured on a bottom side of the circuit board B300. Each first bottom metal pad P301 is electrically coupled with a central metal of a corresponding first coaxial metal via V31. A plurality of second bottom metal pads P302 are configured on a bottom side of the circuit board B300. Each second bottom metal pad P302 is electrically coupled with a central metal of a corresponding second coaxial metal via V32. A plurality of third bottom metal pads P303 are configured on a bottom side of the circuit board B300. Each third bottom metal pad P303 is electrically coupled with a central metal of a corresponding third coaxial metal via V33. A plurality of fourth bottom metal pads P304 are configured on a bottom side of the circuit board B300. Each fourth bottom metal pad P304 is electrically coupled with a corresponding first signal trace T31 through metal via or vias configured between them. A plurality of fifth bottom metal pads P305 are configured on a bottom side of the circuit board B300. Each fifth bottom metal pad P305 is electrically coupled with a corresponding second signal trace T32.
A plurality of sixth bottom metal pads P306 are configured on a right bottom side of the circuit board B300. Each sixth bottom metal pad P306 is electrically coupled with a corresponding second signal trace T32. A plurality of first signal traces T31 are longitudinally configured on a first layer of the circuit board B300. A plurality of second signal traces T32 are longitudinally configured on a second layer of the circuit board B300.
A plurality of first metal pads P31 and second metal pads P32 are configured on a third layer in the right side of the circuit board 300.
Each first metal pad P31 is electrically coupled with a corresponding first signal trace T31 through metal via or vias between them. Each second metal pad P32 is electrically coupled with a corresponding second signal trace T32 through metal via or vias between them. In a section view as shown in
The section view shows the plurality of first coaxial metal vias V31, second coaxial metal vias V32, third coaxial metal vias V33 configured in the left. The plurality of first signal traces T31 are configured in the center, and the plurality of first metal pads P31 and the second metal pads P32 are configured in the right.
Each upper right outer V-shaped metal pin K321 is electrically coupled with a corresponding upper left inner U-shaped metal bracket K32. Each upper right inner V-shaped metal pin K311 is electrically coupled with a corresponding upper left outer metal pin K31. Each lower right outer inverted V-shaped metal pin K341 is electrically coupled with a corresponding lower left inner U-shaped metal bracket K34. Each lower right inner inverted V-shaped metal pin K331 is electrically coupled with a corresponding lower left outer metal pin K33.
For the first circuit board B31, a plurality of first signal traces T31 are configured on a top of the circuit board B31. For the second circuit board B32, a plurality of first coaxial metal vias V21 are configured in the left, and a plurality of second signal traces T32 are configured on a bottom of the second circuit board B32. For the third circuit board B33, a plurality of second coaxial metal vias V22 and third coaxial metal vias V23 are configured in the left. A plurality of third signal traces T33 are configured on a bottom of the third circuit board B33. For the fourth circuit board B34, a plurality of fourth coaxial metal vias V24, fifth coaxial metal vias V25, sixth coaxial metal vias V26 are configured in the left. A plurality of fourth signal traces T34 are configured on a bottom of the fourth circuit board B34. Each fourth coaxial metal via V24 is aligned with and electrically coupled with a corresponding second coaxial metal via V22. Each second coaxial metal via V22 is aligned with and electrically coupled with a corresponding first coaxial metal via V21.
Each first coaxial metal via V21 is electrically coupled with a corresponding first signal trace T31. Each fifth coaxial metal via V25 is aligned with and electrically coupled with a corresponding third coaxial metal via V23. Each third coaxial metal via V23 is electrically coupled with a corresponding second signal trace T32. Each sixth coaxial metal via V26 is electrically coupled with a corresponding third signal trace T33.
The second circuit board B62 has a flexible portion FP configured in a right side. Both the right end of the first circuit board B61 and the right end of the second circuit board B62 float, bendable up and down. A mother board B200 can be electrically coupled with the flexible connecting structure from bottom. A plurality of first signals S1, second signals S2, third signals S3, and fourth signals S4 are generated from the mother board B200. When the mother board B200 is configured on a bottom side of the flexible connecting structure, each first signal S1 can be transmitted through a corresponding second coaxial metal via V62, a corresponding first metal via V61, and a corresponding first signal trace T61. Each second signal S2 can be transmitted through a corresponding third coaxial metal via V63 and a corresponding second signal trace T62. Each third signal S3 can be transmitted through a corresponding fourth metal via V64 and a corresponding third signal trace T63. Each fourth signal S4 can be transmitted through a corresponding fourth signal trace T64.
Each tenth coaxial metal via V70 is aligned with and electrically coupled with a corresponding fifth coaxial metal via V65, each fifth coaxial metal via V65 is aligned with and electrically coupled with a corresponding second coaxial metal via V62, each second coaxial metal via V62 is aligned with and electrically coupled with a corresponding first metal via V61, and each first metal via V61 is electrically coupled with a corresponding first signal trace T61. Each eleventh coaxial metal via V71 is aligned with and electrically coupled with a corresponding sixth coaxial metal via V66, each sixth coaxial metal via V66 is aligned with and electrically coupled with a corresponding third coaxial metal via V63, each third coaxial metal via V63 is electrically coupled with a corresponding second signal trace T62. Each twelfth coaxial metal via V72 is aligned with and electrically coupled with a corresponding seventh coaxial metal via V67, each seventh coaxial metal via V67 is aligned with and electrically coupled with a corresponding fourth metal via V64, each fourth metal via V64 is electrically coupled with a corresponding third signal trace T63. Each thirteenth coaxial metal via V73 is aligned with and electrically coupled with a corresponding eighth coaxial metal via V68, each eighth coaxial metal via V68 is electrically coupled with a corresponding fourth signal trace T64. Each fourteenth coaxial metal via V74 is electrically coupled with a corresponding fifth signal trace T65. Each fifteenth coaxial metal via V75 is electrically coupled with a corresponding sixth signal trace T66. A plurality of first bottom metal pads P601 and second bottom metal pads P602 are configured on a bottom surface of the fourth circuit board B64.
Each first bottom metal pad P601 is electrically coupled with a corresponding seventh signal trace T67. Each second bottom metal pad P602 is electrically coupled with a corresponding eighth signal trace T68. Totally eight plurality of signals can be transmitted through the flexible connecting structure.
The left end of the second circuit board B62 and the left end of the third circuit board B63 are fixed with each other through a plurality of metal balls configured between them, and the right end of the third circuit board B63 floats, deflectable up and down. The left end of the third circuit board B63 and the left end of the fourth circuit board B64 are fixed with each other through a plurality of metal balls configured between them, and the right end of the fourth circuit board B64 floats, deflectable up and down.
Each top first metal finger F61 is electrically coupled with a corresponding one upper right inner V-shaped metal pin K311. Each top second metal finger F62 is electrically coupled with a corresponding one upper right outer V-shaped metal pin K321. Each bottom first metal finger F63 is electrically coupled with a corresponding one lower right inner inverted V-shaped metal pin K331. Each bottom second metal finger F64 is electrically coupled with a corresponding one lower right outer inverted V-shaped metal pin K341.
The metal via in the embodiment can be one of plated through hole, metal filled via, and a coaxial metal via.
While several embodiments have been described by way of example, it will be apparent to those skilled in the art that various modifications may be configured without departs from the spirit of the present invention. Such modifications are all within the scope of the present invention, as defined by the appended claims.