Metallic plating catalysts

Industry

CPC
H05K2203/0716

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0716Metallic plating catalysts

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Laminated film structure and method for manufacturing laminated fil...
- Patent number 12,069,809
- Issue date Aug 20, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kazuya Shimada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Laminate
- Patent number 11,946,143
- Issue date Apr 2, 2024
- Arisawa Mfg. Co., Ltd.
- Kenji Nakamura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plated metallization structures
- Patent number 11,862,518
- Issue date Jan 2, 2024
- Analog Devices International Unlimited Company
- Jan Kubik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Laminated film structure and method for manufacturing laminated fil...
- Patent number 11,825,608
- Issue date Nov 21, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kazuya Shimada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing wiring board
- Patent number 11,665,829
- Issue date May 30, 2023
- Toyota Jidosha Kabushiki Kaisha
- Haruki Kondoh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Application specific electronics packaging systems, methods and dev...
- Patent number 11,503,718
- Issue date Nov 15, 2022
- Molex, LLC
- Marko Spiegel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Catalytic laminate with conductive traces formed during lamination
- Patent number 11,477,893
- Issue date Oct 18, 2022
- CATLAM, LLC
- Kenneth S Bahl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring substrate and method of manufacturing the wiring substrate
- Patent number 11,178,758
- Issue date Nov 16, 2021
- Seiko Epson Corporation
- Yutaka Yamazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board using non-catalytic laminate with catalytic adhesive...
- Patent number 10,959,329
- Issue date Mar 23, 2021
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Application specific electronics packaging systems, methods and dev...
- Patent number 10,905,014
- Issue date Jan 26, 2021
- Molex, LLC
- Marko Spiegel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Catalytic laminate with conductive traces formed during lamination
- Patent number 10,827,624
- Issue date Nov 3, 2020
- CATLAM, LLC
- Kenneth S Bahl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Catalytic circuit board with traces and vias
- Patent number 10,806,029
- Issue date Oct 13, 2020
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plated metallization structures
- Patent number 10,699,948
- Issue date Jun 30, 2020
- Analog Devices Global Unlimited Company
- Jan Kubik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Application specific electronics packaging systems, methods and dev...
- Patent number 10,667,407
- Issue date May 26, 2020
- Molex, LLC
- Marko Spiegel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Application specific electronics packaging systems, methods and dev...
- Patent number 10,433,428
- Issue date Oct 1, 2019
- Molex, LLC
- Marko Spiegel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with catalytic adhesive
- Patent number 10,306,756
- Issue date May 28, 2019
- Sierra Circuits, Inc.
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for forming embedded traces
- Patent number 9,631,279
- Issue date Apr 25, 2017
- Sierra Circuits, Inc.
- Kenneth S. Bahl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming traces of a printed circuit board
- Patent number 9,380,700
- Issue date Jun 28, 2016
- Sierra Circuits, Inc.
- Konstantine Karavakis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plating catalyst and method
- Patent number 9,234,282
- Issue date Jan 12, 2016
- Rohm and Haas Electronic Materials LLC
- Maria Anna Rzeznik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming low-resistance metal pattern, patterned metal str...
- Patent number 9,136,047
- Issue date Sep 15, 2015
- Samsung Display Co., Ltd.
- Ki Yong Song
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method to manufacture a flexible cable for a disk drive
- Patent number 8,702,998
- Issue date Apr 22, 2014
- Western Digital Technologies, Inc.
- Albert J. Guerini
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plating catalyst and method
- Patent number 8,591,637
- Issue date Nov 26, 2013
- Rohm and Haas Electronic Materials LLC
- Maria Anna Rzeznik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of nickel-gold plating and printed circuit board
- Patent number 7,982,138
- Issue date Jul 19, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Jin-Hak Choi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacturable CoWP metal cap process for copper interconnects
- Patent number 7,407,605
- Issue date Aug 5, 2008
- International Business Machines Corporation
- Darryl D. Restaino
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacturable CoWP metal cap process for copper interconnects
- Patent number 7,253,106
- Issue date Aug 7, 2007
- International Business Machines Corporation
- Darryl D. Restaino
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metallization process and component
- Patent number 6,174,647
- Issue date Jan 16, 2001
- Shipley Company, L.L.C.
- John P. Cahalen
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Electroless plating process for the manufacture of printed circuit...
- Patent number 5,648,125
- Issue date Jul 15, 1997
- Frank N. Cane
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Palladium sulfate solution for the selective seeding of the metal i...
- Patent number 5,380,560
- Issue date Jan 10, 1995
- International Business Machines Corporation
- Suryanarayana Kaja
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Direct metallization process
- Patent number 5,376,248
- Issue date Dec 27, 1994
- Enthone-OMI, Inc.
- Jay B. Conrod
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating process and composition
- Patent number 5,276,290
- Issue date Jan 4, 1994
- Shipley Company Inc.
- John J. Bladon
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
LAMINATED FILM STRUCTURE AND METHOD FOR MANUFACTURING LAMINATED FIL...
- Publication number 20230389189
- Publication date Nov 30, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Kazuya SHIMADA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LAMINATED FILM STRUCTURE AND METHOD FOR MANUFACTURING LAMINATED FIL...
- Publication number 20230156924
- Publication date May 18, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Kazuya SHIMADA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20220046806
- Publication date Feb 10, 2022
- IBIDEN CO., LTD.
- Satoru KAWAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE
- Publication number 20210348276
- Publication date Nov 11, 2021
- ARISAWA MFG. CO., LTD.
- Kenji Nakamura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Catalytic Laminate with Conductive Traces formed during Lamination
- Publication number 20210022252
- Publication date Jan 21, 2021
- CATLAM LLC
- Kenneth S BAHL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Circuit Board using non-catalytic laminate with catalytic adhesive...
- Publication number 20200404785
- Publication date Dec 24, 2020
- CATLAM, LLC
- Kenneth S. BAHL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATERIAL DEPOSITION IN A MAGNETIC FIELD
- Publication number 20200024741
- Publication date Jan 23, 2020
- Coventry University
- Andrew Cobley
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE WIRING SUBSTRATE
- Publication number 20200029430
- Publication date Jan 23, 2020
- SEIKO EPSON CORPORATION
- Yutaka YAMAZAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPLICATION SPECIFIC ELECTRONICS PACKAGING SYSTEMS, METHODS AND DEV...
- Publication number 20200022265
- Publication date Jan 16, 2020
- Molex, LLC
- Marko SPIEGEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Catalytic Laminate with Conductive Traces formed during Lamination
- Publication number 20190274221
- Publication date Sep 5, 2019
- SIERRA CIRCUITS, INC.
- Kenneth S. BAHL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Catalytic Laminate Apparatus and Method
- Publication number 20190239349
- Publication date Aug 1, 2019
- SIERRA CIRCUITS, INC.
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE OF CONDUCTIVE LINES AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160157344
- Publication date Jun 2, 2016
- Industrial Technology Research Institute
- Yu-Ming WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING METAL PATTERN AND SUBSTRATE HAVING THE SAME
- Publication number 20160073508
- Publication date Mar 10, 2016
- WISTRON NEWEB CORP.
- Tzu-Wen Chuang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF FORMING HIGH ASPECT RATIO PLATED THROUGH HOLES AND HIGH...
- Publication number 20150208514
- Publication date Jul 23, 2015
- Sanmina Corporation
- Douglas Ward THOMAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING A CONDUCTIVE PATTERN
- Publication number 20140370185
- Publication date Dec 18, 2014
- Israel Schuster
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLATING CATALYST AND METHOD
- Publication number 20140083860
- Publication date Mar 27, 2014
- Maria Anna RZEZNIK
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130319734
- Publication date Dec 5, 2013
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sang Hyun Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING LOW-RESISTANCE METAL PATTERN, PATTERNED METAL STR...
- Publication number 20130299450
- Publication date Nov 14, 2013
- Ki Yong SONG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRE-TREATMENT PROCESS FOR ELECTROLESS NICKEL PLATING
- Publication number 20120321781
- Publication date Dec 20, 2012
- Elisabeth Zettelmeyer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLATING CATALYST AND METHOD
- Publication number 20120145555
- Publication date Jun 14, 2012
- Rohm and Haas Electronic Materials L.L.C.
- Maria Anna RZEZNIK
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR ELECTROLESS NICKEL-PALLADIUM-GOLD PLATING, PLATED PRODUC...
- Publication number 20110051387
- Publication date Mar 3, 2011
- Sumitomo Bakelite Company, Ltd.
- Kenya TACHIBANA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR THE PRODUCTION OF POLYMER-COATED METAL FOILS, AND USE TH...
- Publication number 20100170626
- Publication date Jul 8, 2010
- BASF SE
- Rene Lochtman
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF NICKEL-GOLD PLATING AND PRINTED CIRCUIT BOARD
- Publication number 20100059257
- Publication date Mar 11, 2010
- Samsung Electro-Mechanics CO., LTD.
- Jin-Hak CHOI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of Applying Catalytic Solution for Use in Electroless Deposi...
- Publication number 20090238979
- Publication date Sep 24, 2009
- William Decesare
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PRODUCING A COPPER LAYER ON A SUBSTRATE IN A FLAT PANEL...
- Publication number 20080248194
- Publication date Oct 9, 2008
- L'AIR LIQUIDE SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEO...
- Akinobu NASU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FORMING LOW-RESISTANCE METAL PATTERN, PATTERNED METAL STR...
- Publication number 20080206530
- Publication date Aug 28, 2008
- Samsung Electronics Co., Ltd.
- Ki Yong SONG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Wiring board in which silver is deposited near via-conductor and me...
- Publication number 20070236896
- Publication date Oct 11, 2007
- Alps Electric Co., Ltd.
- Masayoshi Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURABLE CoWP METAL CAP PROCESS FOR COPPER INTERCONNECTS
- Publication number 20070215842
- Publication date Sep 20, 2007
- International Business Machines Corporation
- Darryl D. Restaino
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of manufacturing wiring board, and liquid ejection head havi...
- Publication number 20070023293
- Publication date Feb 1, 2007
- Fuji Photo Film Co., Ltd.
- Yasuhiko Kachi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MANUFACTURABLE CoWP METAL CAP PROCESS FOR COPPER INTERCONNECTS
- Publication number 20060134911
- Publication date Jun 22, 2006
- Darryl D. Restaino
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Metallic plating catalysts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Laminated film structure and method for manufacturing laminated fil...

Laminate

Plated metallization structures

Laminated film structure and method for manufacturing laminated fil...

Method for manufacturing wiring board

Application specific electronics packaging systems, methods and dev...

Catalytic laminate with conductive traces formed during lamination

Wiring substrate and method of manufacturing the wiring substrate

Circuit board using non-catalytic laminate with catalytic adhesive...

Application specific electronics packaging systems, methods and dev...

Catalytic laminate with conductive traces formed during lamination

Catalytic circuit board with traces and vias

Plated metallization structures

Application specific electronics packaging systems, methods and dev...

Application specific electronics packaging systems, methods and dev...

Circuit board with catalytic adhesive

Methods for forming embedded traces

Method for forming traces of a printed circuit board

Plating catalyst and method

Method of forming low-resistance metal pattern, patterned metal str...

Method to manufacture a flexible cable for a disk drive

Plating catalyst and method

Method of nickel-gold plating and printed circuit board

Manufacturable CoWP metal cap process for copper interconnects

Manufacturable CoWP metal cap process for copper interconnects

Metallization process and component

Electroless plating process for the manufacture of printed circuit...

Palladium sulfate solution for the selective seeding of the metal i...

Direct metallization process

Electroplating process and composition

Patents Applicationslast 30 patents

LAMINATED FILM STRUCTURE AND METHOD FOR MANUFACTURING LAMINATED FIL...

LAMINATED FILM STRUCTURE AND METHOD FOR MANUFACTURING LAMINATED FIL...

METHOD FOR MANUFACTURING PRINTED WIRING BOARD

LAMINATE

Catalytic Laminate with Conductive Traces formed during Lamination

Circuit Board using non-catalytic laminate with catalytic adhesive...

MATERIAL DEPOSITION IN A MAGNETIC FIELD

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE WIRING SUBSTRATE

APPLICATION SPECIFIC ELECTRONICS PACKAGING SYSTEMS, METHODS AND DEV...

Catalytic Laminate with Conductive Traces formed during Lamination

Catalytic Laminate Apparatus and Method

STRUCTURE OF CONDUCTIVE LINES AND METHOD OF MANUFACTURING THE SAME

METHOD FOR FORMING METAL PATTERN AND SUBSTRATE HAVING THE SAME

METHODS OF FORMING HIGH ASPECT RATIO PLATED THROUGH HOLES AND HIGH...

METHOD FOR FORMING A CONDUCTIVE PATTERN

PLATING CATALYST AND METHOD

PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

METHOD OF FORMING LOW-RESISTANCE METAL PATTERN, PATTERNED METAL STR...

PRE-TREATMENT PROCESS FOR ELECTROLESS NICKEL PLATING

PLATING CATALYST AND METHOD

METHOD FOR ELECTROLESS NICKEL-PALLADIUM-GOLD PLATING, PLATED PRODUC...

METHOD FOR THE PRODUCTION OF POLYMER-COATED METAL FOILS, AND USE TH...

METHOD OF NICKEL-GOLD PLATING AND PRINTED CIRCUIT BOARD

Method of Applying Catalytic Solution for Use in Electroless Deposi...

METHOD FOR PRODUCING A COPPER LAYER ON A SUBSTRATE IN A FLAT PANEL...

METHOD OF FORMING LOW-RESISTANCE METAL PATTERN, PATTERNED METAL STR...

Wiring board in which silver is deposited near via-conductor and me...

MANUFACTURABLE CoWP METAL CAP PROCESS FOR COPPER INTERCONNECTS

Method of manufacturing wiring board, and liquid ejection head havi...

MANUFACTURABLE CoWP METAL CAP PROCESS FOR COPPER INTERCONNECTS