Metallurgical effects

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H01L2924/365

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/365Metallurgical effects

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 12,166,006
- Issue date Dec 10, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 12,132,026
- Issue date Oct 29, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having redistribution layer structure with protective layer
- Patent number 12,057,406
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxidation and corrosion prevention in semiconductor devices and sem...
- Patent number 12,051,661
- Issue date Jul 30, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Srinivasa Reddy Yeduru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming a chip package
- Patent number 12,040,288
- Issue date Jul 16, 2024
- Infineon Technologies AG
- Harry Walter Sax
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having redistribution layer structure with protective layer...
- Patent number 12,014,993
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,916,029
- Issue date Feb 27, 2024
- Sumitomo Electric Industries, Ltd.
- Mitsuhiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,887,957
- Issue date Jan 30, 2024
- Samsung Electronics Co., Ltd.
- Jubin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a contact clip with a contact region ha...
- Patent number 11,869,865
- Issue date Jan 9, 2024
- Infineon Technologies AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming a chip package
- Patent number 11,735,534
- Issue date Aug 22, 2023
- Infineon Technologies AG
- Harry Walter Sax
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 11,721,660
- Issue date Aug 8, 2023
- Nippon Micrometal Corporation
- Daizo Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration resistant and profile consistent contact arrays
- Patent number 11,699,648
- Issue date Jul 11, 2023
- Tahoe Research, LTD.
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper deposition in wafer level packaging of integrated circuits
- Patent number 11,697,884
- Issue date Jul 11, 2023
- MacDermid Enthone Inc.
- Thomas Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device bonding area including fused solder film and m...
- Patent number 11,545,452
- Issue date Jan 3, 2023
- Lapis Semiconductor Co., Ltd.
- Masanori Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,538,782
- Issue date Dec 27, 2022
- Samsung Electronics Co., Ltd.
- Jubin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging devices and methods of manufacture thereof
- Patent number 11,527,490
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure and nanoparticle mounting material
- Patent number 11,515,280
- Issue date Nov 29, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kiyohiro Hine
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Joining material and joining method using same
- Patent number 11,453,053
- Issue date Sep 27, 2022
- Dowa Electronics Materials Co., Ltd.
- Satoru Kurita
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Shaped interconnect bumps in semiconductor devices
- Patent number 11,444,048
- Issue date Sep 13, 2022
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration resistant and profile consistent contact arrays
- Patent number 11,309,239
- Issue date Apr 19, 2022
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,270,970
- Issue date Mar 8, 2022
- Fuji Electric Co., Ltd.
- Masaki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Designs and methods for conductive bumps
- Patent number 11,201,129
- Issue date Dec 14, 2021
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframes in semiconductor devices
- Patent number 11,152,322
- Issue date Oct 19, 2021
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material for semiconductor device
- Patent number 11,145,615
- Issue date Oct 12, 2021
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper deposition in wafer level packaging of integrated circuits
- Patent number 11,124,888
- Issue date Sep 21, 2021
- MacDermid Enthone Inc.
- Thomas Richardson
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor device and method for fabricating a semiconductor device
- Patent number 11,088,105
- Issue date Aug 10, 2021
- Infineon Technologies AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having redistribution layer structure with protective layer...
- Patent number 11,031,344
- Issue date Jun 8, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-molded leadframes in semiconductor devices
- Patent number 10,957,666
- Issue date Mar 23, 2021
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device bonding area including fused solder film and m...
- Patent number 10,910,331
- Issue date Feb 2, 2021
- Lapis Semiconductor Co., Ltd.
- Masanori Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Collars for under-bump metal structures and associated systems and...
- Patent number 10,886,244
- Issue date Jan 5, 2021
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OXIDATION AND CORROSION PREVENTION IN SEMICONDUCTOR DEVICES AND SEM...
- Publication number 20240387425
- Publication date Nov 21, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Srinivasa Reddy YEDURU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
- Publication number 20240371796
- Publication date Nov 7, 2024
- INFINEON TECHNOLOGIES AG
- Harry Walter SAX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE HAVING REDISTRIBUTION LAYER STRUCTURE WITH PROTECTIVE LAYER...
- Publication number 20240355756
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE
- Publication number 20240339419
- Publication date Oct 10, 2024
- Sumitomo Electric Industries, Ltd.
- Shota SAMBONSUGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING HEAT EMITTING POST BONDED THERETO AND...
- Publication number 20240297096
- Publication date Sep 5, 2024
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240297142
- Publication date Sep 5, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240290743
- Publication date Aug 29, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- G01 - MEASURING TESTING
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240290745
- Publication date Aug 29, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- G01 - MEASURING TESTING
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240266313
- Publication date Aug 8, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro UNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20240250048
- Publication date Jul 25, 2024
- TDK Corporation
- Kosuke TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240038698
- Publication date Feb 1, 2024
- Advanced Semiconductor Engineering, Inc.
- Erh-Ju LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
- Publication number 20230395532
- Publication date Dec 7, 2023
- INFINEON TECHNOLOGIES AG
- Harry Walter SAX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230335528
- Publication date Oct 19, 2023
- NIPPON MICROMETAL COPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230215834
- Publication date Jul 6, 2023
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230148306
- Publication date May 11, 2023
- NIPPON MICROMETAL CORPORATION
- Motoki ETO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEMS FOR BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES...
- Publication number 20230133526
- Publication date May 4, 2023
- KULICKE AND SOFFA INDUSTRIES, INC.
- Thomas J. Colosimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING
- Publication number 20230110402
- Publication date Apr 13, 2023
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230108516
- Publication date Apr 6, 2023
- Samsung Electronics Co., Ltd.
- JUBIN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER MATERIAL, LAYER STRUCTURE, CHIP PACKAGE, METHOD OF FORMING A...
- Publication number 20230095749
- Publication date Mar 30, 2023
- Alexander Heinrich
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230079686
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- Young Hun CHEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, BONDED ARTICLE, AND BONDING DEVICE
- Publication number 20230030272
- Publication date Feb 2, 2023
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHAPED INTERCONNECT BUMPS IN SEMICONDUCTOR DEVICES
- Publication number 20230012200
- Publication date Jan 12, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT INSULATING INTERCONNECT FEATURES IN A COMPONENT OF A COMPOSITE...
- Publication number 20220415853
- Publication date Dec 29, 2022
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CU PADS FOR REDUCED DISHING IN LOW TEMPERATURE ANNEALING AND BONDING
- Publication number 20220352441
- Publication date Nov 3, 2022
- Meta Platforms Technologies, LLC
- Stephan LUTGEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OXIDATION AND CORROSION PREVENTION IN SEMICONDUCTOR DEVICES AND SEM...
- Publication number 20220328434
- Publication date Oct 13, 2022
- Semiconductor Components Industries, LLC
- Srinivasa Reddy YEDURU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20220328443
- Publication date Oct 13, 2022
- CHIPMORE TECHNOLOGY CORPORATION LIMITED
- HAO CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE HAVING REDISTRIBUTION LAYER STRUCTURE WITH PROTECTIVE LAYER
- Publication number 20220302038
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION RESISTANT AND PROFILE CONSISTENT CONTACT ARRAYS
- Publication number 20220199515
- Publication date Jun 23, 2022
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220181281
- Publication date Jun 9, 2022
- Sumitomo Electric Industries, Ltd.
- Mitsuhiko SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGNS AND METHODS FOR CONDUCTIVE BUMPS
- Publication number 20220059484
- Publication date Feb 24, 2022
- Intel Corporation
- Valery M. DUBIN
- H01 - BASIC ELECTRIC ELEMENTS

Metallurgical effects

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding wire for semiconductor devices

Bonding wire for semiconductor devices

Package having redistribution layer structure with protective layer

Oxidation and corrosion prevention in semiconductor devices and sem...

Chip package and method of forming a chip package

Package having redistribution layer structure with protective layer...

Semiconductor device

Semiconductor device

Semiconductor device having a contact clip with a contact region ha...

Chip package and method of forming a chip package

Bonding wire for semiconductor devices

Electromigration resistant and profile consistent contact arrays

Copper deposition in wafer level packaging of integrated circuits

Semiconductor device bonding area including fused solder film and m...

Semiconductor device

Packaging devices and methods of manufacture thereof

Mounting structure and nanoparticle mounting material

Joining material and joining method using same

Shaped interconnect bumps in semiconductor devices

Electromigration resistant and profile consistent contact arrays

Semiconductor device

Designs and methods for conductive bumps

Leadframes in semiconductor devices

Solder material for semiconductor device

Copper deposition in wafer level packaging of integrated circuits

Semiconductor device and method for fabricating a semiconductor device

Package having redistribution layer structure with protective layer...

Pre-molded leadframes in semiconductor devices

Semiconductor device bonding area including fused solder film and m...

Collars for under-bump metal structures and associated systems and...

Patents Applicationslast 30 patents

OXIDATION AND CORROSION PREVENTION IN SEMICONDUCTOR DEVICES AND SEM...

CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE

PACKAGE HAVING REDISTRIBUTION LAYER STRUCTURE WITH PROTECTIVE LAYER...

SILICON CARBIDE SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE HAVING HEAT EMITTING POST BONDED THERETO AND...

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

ELECTRONIC COMPONENT

PACKAGE STRUCTURE

CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING SYSTEMS FOR BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES...

SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING

SEMICONDUCTOR DEVICE

SOLDER MATERIAL, LAYER STRUCTURE, CHIP PACKAGE, METHOD OF FORMING A...

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

BONDING METHOD, BONDED ARTICLE, AND BONDING DEVICE

SHAPED INTERCONNECT BUMPS IN SEMICONDUCTOR DEVICES

HEAT INSULATING INTERCONNECT FEATURES IN A COMPONENT OF A COMPOSITE...

CU PADS FOR REDUCED DISHING IN LOW TEMPERATURE ANNEALING AND BONDING

OXIDATION AND CORROSION PREVENTION IN SEMICONDUCTOR DEVICES AND SEM...

PACKAGE STRUCTURE AND FORMING METHOD THEREOF

PACKAGE HAVING REDISTRIBUTION LAYER STRUCTURE WITH PROTECTIVE LAYER

ELECTROMIGRATION RESISTANT AND PROFILE CONSISTENT CONTACT ARRAYS

SEMICONDUCTOR DEVICE

DESIGNS AND METHODS FOR CONDUCTIVE BUMPS