Methods of manufacturing wire connectors involving a specific sequence of method steps

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H01L2224/43985

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/43985Methods of manufacturing wire connectors involving a specific sequence of method steps

Industries

Patents Grantslast 30 patents

Information Patent Grant
Methods of forming wire interconnect structures and related wire bo...
- Patent number 12,057,431
- Issue date Aug 6, 2024
- Kulicke and Soffa Industries, Inc.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and packaging method thereof
- Patent number 11,721,686
- Issue date Aug 8, 2023
- Yangtze Memory Technologies Co., Ltd.
- Peng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for hierarchical exposure of an integrated circ...
- Patent number 10,923,456
- Issue date Feb 16, 2021
- Cerebras Systems Inc.
- Jean-Philippe Fricker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and its manufacturing method
- Patent number 9,929,120
- Issue date Mar 27, 2018
- Renesas Electronics Corporation
- Akira Yajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Off substrate kinking of bond wire
- Patent number 9,893,033
- Issue date Feb 13, 2018
- Invensas Corporation
- Belgacem Haba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus, system, and method for wireless connection in integrated...
- Patent number 9,837,340
- Issue date Dec 5, 2017
- Intel Corporation
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and its manufacturing method
- Patent number 9,496,232
- Issue date Nov 15, 2016
- Renesas Electronics Corporation
- Akira Yajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding device and method of eliminating defective bonding wire
- Patent number 9,355,989
- Issue date May 31, 2016
- Siliconware Precision Industries Co., Ltd.
- Wei-Sheng Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding method employing two scrub settings
- Patent number 9,337,167
- Issue date May 10, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Boh Kid Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum-based alloy conductive wire used in semiconductor package...
- Patent number 9,312,235
- Issue date Apr 12, 2016
- Metal Industries Research & Development Centre
- Ching-Shing Kang
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Off substrate kinking of bond wire
- Patent number 9,087,815
- Issue date Jul 21, 2015
- Invensas Corporation
- Belgacem Haba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Severing bond wire by kinking and twisting
- Patent number 9,082,753
- Issue date Jul 14, 2015
- Invensas Corporation
- Belgacem Haba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BO...
- Publication number 20240363583
- Publication date Oct 31, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR P...
- Publication number 20240038720
- Publication date Feb 1, 2024
- SK HYNIX INC.
- Su Ji UM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF
- Publication number 20230343773
- Publication date Oct 26, 2023
- Yangtze Memory Technologies Co., Ltd.
- Peng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF
- Publication number 20220278089
- Publication date Sep 1, 2022
- Yangtze Memory Technologies Co., Ltd.
- Peng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR HIERARCHICAL EXPOSURE OF AN INTEGRATED CIRC...
- Publication number 20210167037
- Publication date Jun 3, 2021
- Cerebras Systems Inc.
- Jean-Philippe Fricker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER BONDING WIRE WITH ANGSTROM (Å) THICK SURFACE OXIDE LAYER
- Publication number 20170154863
- Publication date Jun 1, 2017
- Heraeus Deutschland GmbH & Co. KG
- Murali SARANGAPANI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD FOR MANUFACTURING STRETCHABLE WIRE AND METHOD FOR MANUFACTUR...
- Publication number 20170053894
- Publication date Feb 23, 2017
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Chan Woo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING DEVICE AND METHOD OF ELIMINATING DEFECTIVE BONDING WIRE
- Publication number 20160079198
- Publication date Mar 17, 2016
- Siliconware Precision Industries Co., Ltd.
- Wei-Sheng Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
- Publication number 20160064344
- Publication date Mar 3, 2016
- RENESAS ELECTRONICS CORPORATION
- Akira YAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD EMPLOYING TWO SCRUB SETTINGS
- Publication number 20150279810
- Publication date Oct 1, 2015
- Boh Kid Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEVERING BOND WIRE BY KINKING AND TWISTING
- Publication number 20150129647
- Publication date May 14, 2015
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFF SUBSTRATE KINKING OF BOND WIRE
- Publication number 20150129646
- Publication date May 14, 2015
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20150084198
- Publication date Mar 26, 2015
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Semiconductor Module
- Publication number 20140370663
- Publication date Dec 18, 2014
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS

Methods of manufacturing wire connectors involving a specific sequence of method steps

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of forming wire interconnect structures and related wire bo...

Semiconductor package structure and packaging method thereof

Systems and methods for hierarchical exposure of an integrated circ...

Semiconductor device and its manufacturing method

Off substrate kinking of bond wire

Apparatus, system, and method for wireless connection in integrated...

Semiconductor device and its manufacturing method

Wire bonding device and method of eliminating defective bonding wire

Wire bonding method employing two scrub settings

Aluminum-based alloy conductive wire used in semiconductor package...

Off substrate kinking of bond wire

Severing bond wire by kinking and twisting

Patents Applicationslast 30 patents

METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BO...

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR P...

SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF

SYSTEMS AND METHODS FOR HIERARCHICAL EXPOSURE OF AN INTEGRATED CIRC...

COPPER BONDING WIRE WITH ANGSTROM (Å) THICK SURFACE OXIDE LAYER

METHOD FOR MANUFACTURING STRETCHABLE WIRE AND METHOD FOR MANUFACTUR...

WIRE BONDING DEVICE AND METHOD OF ELIMINATING DEFECTIVE BONDING WIRE

SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

WIRE BONDING METHOD EMPLOYING TWO SCRUB SETTINGS

SEVERING BOND WIRE BY KINKING AND TWISTING

OFF SUBSTRATE KINKING OF BOND WIRE

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

Method for Producing a Semiconductor Module