Microwave curing

Industry

CPC
H01L2224/83865

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83865Microwave curing

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronics package with integrated interconnect structure and meth...
- Patent number 10,804,115
- Issue date Oct 13, 2020
- General Electric Company
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package having a multi-thickness conductor layer and me...
- Patent number 10,770,444
- Issue date Sep 8, 2020
- General Electric Company
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package having a self-aligning interconnect assembly an...
- Patent number 10,607,929
- Issue date Mar 31, 2020
- General Electric Company
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect structure for an embedded electronics package
- Patent number 10,141,203
- Issue date Nov 27, 2018
- General Electric Company
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect structure for an embedded semiconductor dev...
- Patent number 9,653,438
- Issue date May 16, 2017
- General Electric Company
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices and methods for manufacturing microelectron...
- Patent number 8,896,105
- Issue date Nov 25, 2014
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating electronics assemblies
- Patent number 8,597,982
- Issue date Dec 3, 2013
- Nordson Corporation
- David K. Foote
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices and methods for manufacturing microelectron...
- Patent number 8,569,093
- Issue date Oct 29, 2013
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 8,334,593
- Issue date Dec 18, 2012
- General Electric Company
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor device package
- Patent number 8,114,712
- Issue date Feb 14, 2012
- General Electric Company
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus incorporating small-feature-size and large-feature-size c...
- Patent number 7,214,569
- Issue date May 8, 2007
- Alien Technology Corporation
- Susan Swindlehurst
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING MICROELECTRON...
- Publication number 20140042575
- Publication date Feb 13, 2014
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING ELECTRONICS ASSEMBLIES
- Publication number 20130109136
- Publication date May 2, 2013
- Nordson Corporation
- David K. Foote
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20120161325
- Publication date Jun 28, 2012
- GENERAL ELECTRIC COMPANY
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microwave Cure of Semiconductor Devices
- Publication number 20090253232
- Publication date Oct 8, 2009
- Gary Philip Thomson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Microelectronic devices and methods for manufacturing microelectron...
- Publication number 20070218583
- Publication date Sep 20, 2007
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus incorporating small-feature-size and large-feature-size c...
- Publication number 20070117274
- Publication date May 24, 2007
- Susan Swindlehurst
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Apparatus incorporating small-feature-size and large-feature-size c...
- Publication number 20040183182
- Publication date Sep 23, 2004
- Susan Swindlehurst
- G06 - COMPUTING CALCULATING COUNTING

Microwave curing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronics package with integrated interconnect structure and meth...

Electronics package having a multi-thickness conductor layer and me...

Electronics package having a self-aligning interconnect assembly an...

Electrical interconnect structure for an embedded electronics package

Electrical interconnect structure for an embedded semiconductor dev...

Microelectronic devices and methods for manufacturing microelectron...

Methods of fabricating electronics assemblies

Microelectronic devices and methods for manufacturing microelectron...

Semiconductor device package

Method for fabricating a semiconductor device package

Apparatus incorporating small-feature-size and large-feature-size c...

Patents Applicationslast 30 patents

MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING MICROELECTRON...

METHODS OF FABRICATING ELECTRONICS ASSEMBLIES

SEMICONDUCTOR DEVICE PACKAGE

Microwave Cure of Semiconductor Devices

Microelectronic devices and methods for manufacturing microelectron...

Apparatus incorporating small-feature-size and large-feature-size c...

Apparatus incorporating small-feature-size and large-feature-size c...