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H01L2224/1715

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/1715Mirror array

Industries

Patents Grantslast 30 patents

Information Patent Grant
Display device
- Patent number 12,074,155
- Issue date Aug 27, 2024
- Samsung Display Co., Ltd.
- Dae Geun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,074,121
- Issue date Aug 27, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for assembling processor systems
- Patent number 12,033,996
- Issue date Jul 9, 2024
- 1372934 B.C. LTD
- Kelly T. R. Boothby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,033,969
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Honeycomb pattern for conductive features
- Patent number 11,929,338
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shenggao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of direct bonding semiconductor components
- Patent number 11,810,892
- Issue date Nov 7, 2023
- Imec VZW
- Jaber Derakhshandeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device having improved bonding between display panel and en...
- Patent number 11,678,502
- Issue date Jun 13, 2023
- SAMSUNG DISPLAY CO., LTD.
- Hyun A Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Honeycomb pattern for conductive features
- Patent number 11,652,075
- Issue date May 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shenggao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 11,626,372
- Issue date Apr 11, 2023
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,495,591
- Issue date Nov 8, 2022
- SAMSUNG DISPLAY CO., LTD.
- Dae Geun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 11,437,334
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip interconnection and circuit board thereof
- Patent number 11,322,437
- Issue date May 3, 2022
- Chipbond Technology Corporation
- Yu-Chen Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead structure of circuit with increased gaps between adjacent leads
- Patent number 11,217,508
- Issue date Jan 4, 2022
- Sitronix Technology Corp.
- Kuo-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack packages including a supporting substrate
- Patent number 11,152,335
- Issue date Oct 19, 2021
- SK hynix Inc.
- Seung Yeop Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 10,964,680
- Issue date Mar 30, 2021
- SAMSUNG DISPLAY CO., LTD.
- Dae Geun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 10,916,514
- Issue date Feb 9, 2021
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreading device and method
- Patent number 10,867,884
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreading device and method
- Patent number 10,867,885
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and method for forming the same
- Patent number 10,847,485
- Issue date Nov 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device, oscillator, electronic device, and vehicle
- Patent number 10,715,082
- Issue date Jul 14, 2020
- Seiko Epson Corporation
- Yasuhiro Sudo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor method for forming semiconductor structure having bum...
- Patent number 10,607,858
- Issue date Mar 31, 2020
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreading device and method
- Patent number 10,483,187
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microprocessor package with first level die bump ground webbing str...
- Patent number 10,453,795
- Issue date Oct 22, 2019
- Intel Corporation
- Yu Amos Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having bump on tilting upper corner surface
- Patent number 10,290,512
- Issue date May 14, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-film package structure
- Patent number 10,211,142
- Issue date Feb 19, 2019
- ChipMOS Technologies Inc.
- Pi-Chang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor manufacturing process
- Patent number 9,911,709
- Issue date Mar 6, 2018
- Advanced Semiconductor Engineering, Inc.
- Chun-Jun Zhuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 9,735,132
- Issue date Aug 15, 2017
- ChipMOS Technologies Inc.
- Cheng-Yu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display drive circuit including an output terminal
- Patent number 9,589,501
- Issue date Mar 7, 2017
- Lapis Semiconductor Co., Ltd.
- Atsushi Hirama
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Microelectronic packaging without wirebonds to package substrate ha...
- Patent number 9,515,053
- Issue date Dec 6, 2016
- Invensas Corporation
- Richard Dewitt Crisp
- G11 - INFORMATION STORAGE
Information Patent Grant
Display drive circuit including an output terminal
- Patent number 9,208,716
- Issue date Dec 8, 2015
- Lapis Semiconductor Co., Ltd.
- Atsushi Hirama
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR ASSEMBLING PROCESSOR SYSTEMS
- Publication number 20240387496
- Publication date Nov 21, 2024
- 1372934 B.C. Ltd.
- Kelly T. R. Boothby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240363612
- Publication date Oct 31, 2024
- SAMSUNG DISPLAY CO., LTD.
- Dae Geun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MODULE AND FLEXIBLE SUBSTRATE
- Publication number 20240332273
- Publication date Oct 3, 2024
- Sumitomo Electric Industries, Ltd.
- Hiroshi UEMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240213166
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Se-Ho YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Honeycomb Pattern for Conductive Features
- Publication number 20240186276
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shenggao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES
- Publication number 20240178119
- Publication date May 30, 2024
- Intel Corporation
- Mohammad Mamunur RAHMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Honeycomb Pattern for Conductive Features
- Publication number 20230253357
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shenggao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
- Publication number 20230223361
- Publication date Jul 13, 2023
- Intel Corporation
- Dae-Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230139657
- Publication date May 4, 2023
- Samsung Electronics Co., Ltd.
- Hui Min YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230026637
- Publication date Jan 26, 2023
- SAMSUNG DISPLAY CO., LTD.
- Dae Geun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Honeycomb Pattern for Conductive Features
- Publication number 20220367400
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shenggao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20220359448
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP INTERCONNECTION AND CIRCUIT BOARD THEREOF
- Publication number 20210265255
- Publication date Aug 26, 2021
- Chipbond Technology Corporation
- Yu-Chen Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND CIRCUIT BOARD THEREOF
- Publication number 20210257287
- Publication date Aug 19, 2021
- Chipbond Technology Corporation
- Yu-Chen Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20210249627
- Publication date Aug 12, 2021
- SAMSUNG DISPLAY CO., LTD.
- Hyun A LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20210193641
- Publication date Jun 24, 2021
- SAMSUNG DISPLAY CO., LTD.
- Dae Geun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING SEMICONDUCTOR COMPONENTS
- Publication number 20210159207
- Publication date May 27, 2021
- IMEC vzw
- Jaber Derakhshandeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR ASSEMBLING PROCESSOR SYSTEMS
- Publication number 20210091062
- Publication date Mar 25, 2021
- D-WAVE SYSTEMS INC.
- Kelly T. R. Boothby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210082856
- Publication date Mar 18, 2021
- Kioxia Corporation
- Soichi HOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20210066230
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGES INCLUDING A SUPPORTING SUBSTRATE
- Publication number 20200395340
- Publication date Dec 17, 2020
- SK HYNIX INC.
- Seung Yeop LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20200203300
- Publication date Jun 25, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE CAPTURING MODULE AND PORTABLE ELECTRONIC DEVICE
- Publication number 20200185350
- Publication date Jun 11, 2020
- AZUREWAVE TECHNOLOGIES, INC.
- Chuan Jin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Heat Spreading Device and Method
- Publication number 20200013697
- Publication date Jan 9, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Spreading Device and Method
- Publication number 20200013698
- Publication date Jan 9, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20190326274
- Publication date Oct 24, 2019
- SAMSUNG DISPLAY CO., LTD.
- Dae Geun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM PACKAGE STRUCTURE
- Publication number 20190080996
- Publication date Mar 14, 2019
- CHIPMOS TECHNOLOGIES INC.
- Pi-Chang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR METHOD FOR FORMING SEMICONDUCTOR STRUCTURE HAVING BUM...
- Publication number 20190074197
- Publication date Mar 7, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Spreading Device and Method
- Publication number 20190006263
- Publication date Jan 3, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROPROCESSOR PACKAGE WITH FIRST LEVEL DIE BUMP GROUND WEBBING STR...
- Publication number 20180331035
- Publication date Nov 15, 2018
- Yu Amos ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Mirror array

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device

Metal-free frame design for silicon bridges for semiconductor packages

Systems and methods for assembling processor systems

Chip package structure

Honeycomb pattern for conductive features

Method of direct bonding semiconductor components

Display device having improved bonding between display panel and en...

Honeycomb pattern for conductive features

Metal-free frame design for silicon bridges for semiconductor packages

Display device

Chip package structure

Flip chip interconnection and circuit board thereof

Lead structure of circuit with increased gaps between adjacent leads

Stack packages including a supporting substrate

Display device

Metal-free frame design for silicon bridges for semiconductor packages

Heat spreading device and method

Heat spreading device and method

Chip package structure and method for forming the same

Integrated circuit device, oscillator, electronic device, and vehicle

Semiconductor method for forming semiconductor structure having bum...

Heat spreading device and method

Microprocessor package with first level die bump ground webbing str...

Semiconductor structure having bump on tilting upper corner surface

Chip-on-film package structure

Semiconductor device and semiconductor manufacturing process

Semiconductor package

Display drive circuit including an output terminal

Microelectronic packaging without wirebonds to package substrate ha...

Display drive circuit including an output terminal

Patents Applicationslast 30 patents

SYSTEMS AND METHODS FOR ASSEMBLING PROCESSOR SYSTEMS

DISPLAY DEVICE

OPTICAL MODULE AND FLEXIBLE SUBSTRATE

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

Honeycomb Pattern for Conductive Features

RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES

Honeycomb Pattern for Conductive Features

METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE

DISPLAY DEVICE

Honeycomb Pattern for Conductive Features

CHIP PACKAGE STRUCTURE

FLIP CHIP INTERCONNECTION AND CIRCUIT BOARD THEREOF

CHIP PACKAGE AND CIRCUIT BOARD THEREOF

DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME

DISPLAY DEVICE

METHOD FOR BONDING SEMICONDUCTOR COMPONENTS

SYSTEMS AND METHODS FOR ASSEMBLING PROCESSOR SYSTEMS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE STRUCTURE

STACK PACKAGES INCLUDING A SUPPORTING SUBSTRATE

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

IMAGE CAPTURING MODULE AND PORTABLE ELECTRONIC DEVICE

Heat Spreading Device and Method

Heat Spreading Device and Method

DISPLAY DEVICE

CHIP-ON-FILM PACKAGE STRUCTURE

SEMICONDUCTOR METHOD FOR FORMING SEMICONDUCTOR STRUCTURE HAVING BUM...

Heat Spreading Device and Method

MICROPROCESSOR PACKAGE WITH FIRST LEVEL DIE BUMP GROUND WEBBING STR...