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H01L2224/1415

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/1415Mirror array

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,119,288
- Issue date Oct 15, 2024
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 12,087,718
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,033,969
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer body and method of manufacturing the same
- Patent number 12,002,779
- Issue date Jun 4, 2024
- Murata Manufacturing Co., Ltd.
- Takashi Iwamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,948,903
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Sang-Sick Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method of fluidic assembly of microchips on a substrate
- Patent number 11,942,450
- Issue date Mar 26, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Melina Haupt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 11,916,033
- Issue date Feb 27, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency module and communication device
- Patent number 11,881,840
- Issue date Jan 23, 2024
- Murata Manufacturing Co., Ltd.
- Daisuke Miyazaki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wafer level packaging of light emitting diodes (LEDs)
- Patent number 11,837,585
- Issue date Dec 5, 2023
- CreeLED, Inc.
- Michael John Bergmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,830,839
- Issue date Nov 28, 2023
- Murata Manufacturing Co., Ltd.
- Shingo Yanagihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of direct bonding semiconductor components
- Patent number 11,810,892
- Issue date Nov 7, 2023
- Imec VZW
- Jaber Derakhshandeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip
- Patent number 11,676,825
- Issue date Jun 13, 2023
- Murata Manufacturing Co., Ltd.
- Kenichi Shimamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 11,631,648
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,616,039
- Issue date Mar 28, 2023
- Samsung Electronics Co., Ltd.
- Sang-Sick Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate and fabrication method thereof, display panel and d...
- Patent number 11,563,036
- Issue date Jan 24, 2023
- ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
- Shuai Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupling inductors in an IC device using interconnecting elements w...
- Patent number 11,557,420
- Issue date Jan 17, 2023
- GLOBALFOUNDRIES Inc.
- Tak Ming Mak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure
- Patent number 11,502,052
- Issue date Nov 15, 2022
- Novatek Microelectronics Corp.
- Ling-Chieh Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 11,437,334
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip power supply system, chip, PCB, and computer device
- Patent number 11,387,226
- Issue date Jul 12, 2022
- Huawei Technologies Co., Ltd.
- Yadong Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,302,659
- Issue date Apr 12, 2022
- Murata Manufacturing Co., Ltd.
- Hisanori Namie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 11,239,192
- Issue date Feb 1, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 11,239,191
- Issue date Feb 1, 2022
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead structure of circuit with increased gaps between adjacent leads
- Patent number 11,217,508
- Issue date Jan 4, 2022
- Sitronix Technology Corp.
- Kuo-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package with flexible printed circuits
- Patent number 11,171,170
- Issue date Nov 9, 2021
- Sony Corporation
- Yuta Momiuchi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Surface mounting semiconductor components
- Patent number 11,101,238
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures for package and substrate
- Patent number 11,088,102
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing light emitting device
- Patent number 11,024,771
- Issue date Jun 1, 2021
- Nichia Corporation
- Kenji Ozeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip
- Patent number 10,971,377
- Issue date Apr 6, 2021
- Murata Manufacturing Co., Ltd.
- Kenichi Shimamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Driving chip, display substrate, display device and method for manu...
- Patent number 10,971,465
- Issue date Apr 6, 2021
- BOE Technology Group Co., Ltd.
- Liqiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,854,576
- Issue date Dec 1, 2020
- TOSHIBA MEMORY CORPORATION
- Yuji Karakane
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY DEVICE
- Publication number 20240321800
- Publication date Sep 26, 2024
- E Ink Holdings Inc.
- Wenchuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP FIELD EFFECT TRANSISTOR LAYOUTS AND STRUCTURES
- Publication number 20240266348
- Publication date Aug 8, 2024
- Wolfspeed, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20240250093
- Publication date Jul 25, 2024
- CHONGQING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Bin WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING DUMMY SOLDERS AND MANUFACTURING METHOD...
- Publication number 20240234358
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- JUNHO LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF AMPLIFIERS WITH IMPROVED STABILITY BY SOURCE INDUCTANCE ADJUSTMENT
- Publication number 20240145414
- Publication date May 2, 2024
- Wolfspeed, Inc.
- Gerard Bouisse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CONDUCTIVE PILLAR DEVICE AND METHOD
- Publication number 20240071972
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Hidenori Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240055385
- Publication date Feb 15, 2024
- WISTRON NEWEB CORPORATION
- KUO-HUA HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL
- Publication number 20240006397
- Publication date Jan 4, 2024
- Prilit Optronics, Inc.
- Biing-Seng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BILAYER RDL STRUCTURE FOR BUMP COUNT REDUCTION
- Publication number 20230395486
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH UNDERFILL FLOW CONTROL
- Publication number 20230378124
- Publication date Nov 23, 2023
- Intel Corporation
- Frederick Atadana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20230361170
- Publication date Nov 9, 2023
- MURATA MANUFACTURING CO., LTD.
- Fuminori MORISAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STACK COOLING WINGS
- Publication number 20230317681
- Publication date Oct 5, 2023
- Intel Corporation
- Sonja Koller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND RADIO-FREQUENCY MODULE
- Publication number 20230307458
- Publication date Sep 28, 2023
- MURATA MANUFACTURING CO., LTD.
- Motoji TSUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...
- Publication number 20230253355
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Horng CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230223373
- Publication date Jul 13, 2023
- Samsung Electronics Co., Ltd.
- Sang-Sick PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE AND ELECTRONIC DEVICE
- Publication number 20230187369
- Publication date Jun 15, 2023
- Canon Kabushiki Kaisha
- Nobuaki Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PILLAR CONNECTION TOPOLOGIES FOR HETEROGENEOUS PACKAGING
- Publication number 20230075505
- Publication date Mar 9, 2023
- Wolfspeed, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20220392979
- Publication date Dec 8, 2022
- SAMSUNG DISPLAY CO., LTD.
- Sang Duk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING ELEMENT
- Publication number 20220376140
- Publication date Nov 24, 2022
- Nichia Corporation.
- Takao MISAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20220359448
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND ELECTRONIC COMPONEN...
- Publication number 20220352105
- Publication date Nov 3, 2022
- Rohm Co., Ltd.
- Isamu NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE OF CHIP
- Publication number 20220336398
- Publication date Oct 20, 2022
- Sitronix Technology Corp.
- KUO-WEI TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE
- Publication number 20220278088
- Publication date Sep 1, 2022
- SAMSUNG DISPLAY CO., LTD.
- Chan Jae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE
- Publication number 20220166407
- Publication date May 26, 2022
- MURATA MANUFACTURING CO., LTD.
- Daisuke MIYAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD OF FLUIDIC ASSEMBLY OF MICROCHIPS ON A SUBSTRATE
- Publication number 20220165702
- Publication date May 26, 2022
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Melina Haupt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Packing Optimization of Semiconductor Devices
- Publication number 20220157755
- Publication date May 19, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210407949
- Publication date Dec 30, 2021
- Samsung Electronics Co., Ltd.
- Sang-Sick PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGING OF MULTIPLE LIGHT EMITTING DIODES (LEDS) ON A...
- Publication number 20210367112
- Publication date Nov 25, 2021
- CreeLED, Inc.
- Michael John Bergmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER BODY AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210203302
- Publication date Jul 1, 2021
- Murata Manufacturing Co., Ltd.
- Takashi IWAMOTO
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR CHIP
- Publication number 20210193484
- Publication date Jun 24, 2021
- Murata Manufacturing Co., Ltd.
- Kenichi SHIMAMOTO
- H03 - BASIC ELECTRONIC CIRCUITRY

Mirror array

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package

Bump structure having a side recess and semiconductor structure inc...

Chip package structure

Multilayer body and method of manufacturing the same

Semiconductor package

Device and method of fluidic assembly of microchips on a substrate

Method and system for packing optimization of semiconductor devices

Radio-frequency module and communication device

Wafer level packaging of light emitting diodes (LEDs)

Semiconductor device

Method of direct bonding semiconductor components

Semiconductor chip

Bump structure having a side recess and semiconductor structure inc...

Semiconductor package

Array substrate and fabrication method thereof, display panel and d...

Coupling inductors in an IC device using interconnecting elements w...

Chip structure

Chip package structure

Chip power supply system, chip, PCB, and computer device

Semiconductor device

Method and system for packing optimization of semiconductor devices

Semiconductor device and a method of manufacturing the same

Lead structure of circuit with increased gaps between adjacent leads

Image sensor package with flexible printed circuits

Surface mounting semiconductor components

Bonded structures for package and substrate

Method for manufacturing light emitting device

Semiconductor chip

Driving chip, display substrate, display device and method for manu...

Semiconductor device and manufacturing method thereof

Patents Applicationslast 30 patents

DISPLAY DEVICE

FLIP-CHIP FIELD EFFECT TRANSISTOR LAYOUTS AND STRUCTURES

DISPLAY PANEL AND DISPLAY DEVICE

SEMICONDUCTOR PACKAGE HAVING DUMMY SOLDERS AND MANUFACTURING METHOD...

RF AMPLIFIERS WITH IMPROVED STABILITY BY SOURCE INDUCTANCE ADJUSTMENT

SEMICONDUCTOR CONDUCTIVE PILLAR DEVICE AND METHOD

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

DISPLAY PANEL

BILAYER RDL STRUCTURE FOR BUMP COUNT REDUCTION

MICROELECTRONIC ASSEMBLY WITH UNDERFILL FLOW CONTROL

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

THREE-DIMENSIONAL STACK COOLING WINGS

INTEGRATED CIRCUIT AND RADIO-FREQUENCY MODULE

BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...

SEMICONDUCTOR PACKAGE

ELECTRONIC MODULE AND ELECTRONIC DEVICE

METAL PILLAR CONNECTION TOPOLOGIES FOR HETEROGENEOUS PACKAGING

DISPLAY DEVICE

LIGHT EMITTING ELEMENT

CHIP PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND ELECTRONIC COMPONEN...

BUMP STRUCTURE OF CHIP

DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE

RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE

DEVICE AND METHOD OF FLUIDIC ASSEMBLY OF MICROCHIPS ON A SUBSTRATE

Method and System for Packing Optimization of Semiconductor Devices

SEMICONDUCTOR PACKAGE

WAFER LEVEL PACKAGING OF MULTIPLE LIGHT EMITTING DIODES (LEDS) ON A...

MULTILAYER BODY AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR CHIP