modifying the pattern

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H01L21/76892

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76892modifying the pattern

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Etch method for opening a source line in flash memory
- Patent number 12,193,227
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yong-Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom lateral expansion of contact plugs through implantation
- Patent number 12,183,632
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element, semiconductor element group, and method of m...
- Patent number 12,148,662
- Issue date Nov 19, 2024
- Rohm Co., Ltd.
- Satoshi Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Block-on-block memory array architecture using bi-directional stair...
- Patent number 12,114,499
- Issue date Oct 8, 2024
- Lodestar Licensing Group LLC
- Aaron S. Yip
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuits having signal lines formed with double patterning
- Patent number 12,100,655
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Chieh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage device, semiconductor structure and method for forming same
- Patent number 12,100,654
- Issue date Sep 24, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Juanjuan He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Access line formation for a memory array
- Patent number 12,082,424
- Issue date Sep 3, 2024
- Micron Technology, Inc.
- Andrea Redaelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned via to metal line for interconnect
- Patent number 12,080,640
- Issue date Sep 3, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures and methods of forming the same
- Patent number 12,080,646
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Lin-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a source/drain contact plug with an upw...
- Patent number 12,014,957
- Issue date Jun 18, 2024
- Samsung Electronics Co., Ltd.
- Sungmoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and IC design with non-linear power rails
- Patent number 11,996,329
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sheng-Hsiung Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structure, method for fabricating thereof, and method...
- Patent number 11,996,290
- Issue date May 28, 2024
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Gang-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully aligned subtractive processes and electronic devices therefrom
- Patent number 11,967,527
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming interconnect structures in semiconductor fabrica...
- Patent number 11,967,552
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming apparatuses having tungsten-containing structures
- Patent number 11,923,305
- Issue date Mar 5, 2024
- Micron Technology, Inc.
- Luca Fumagalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via interconnects including super vias
- Patent number 11,916,013
- Issue date Feb 27, 2024
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modified fuse structure and method of use
- Patent number 11,854,968
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Sheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 11,810,786
- Issue date Nov 7, 2023
- United Microelectronics Corp.
- Po-Wen Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of fabricating an electronic device
- Patent number 11,798,880
- Issue date Oct 24, 2023
- INNOLUX CORPORATION
- Hirofumi Watsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming three-dimensional integrated wiring structure an...
- Patent number 11,791,265
- Issue date Oct 17, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jifeng Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch method for opening a source line in flash memory
- Patent number 11,778,816
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yong-Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-alignment etching of interconnect layers
- Patent number 11,749,561
- Issue date Sep 5, 2023
- Applied Materials, Inc.
- Suketu Arun Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional vertical nor flash thin-film transistor strings
- Patent number 11,749,344
- Issue date Sep 5, 2023
- SUNRISE MEMORY CORPORATION
- Eli Harari
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device with fuse and anti-fuse structures
- Patent number 11,705,394
- Issue date Jul 18, 2023
- NANYA TECHNOLOGY CORPORATION
- Chin-Ling Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spin on scaffold film for forming topvia
- Patent number 11,688,636
- Issue date Jun 27, 2023
- International Business Machines Corporation
- Somnath Ghosh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced metal connection with metal cut
- Patent number 11,637,064
- Issue date Apr 25, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having fuse array and method of making the same
- Patent number 11,626,368
- Issue date Apr 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Sheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip
- Patent number 11,610,853
- Issue date Mar 21, 2023
- Delta Electronics (Shanghai) Co., Ltd.
- Shouyu Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit e-fuse having an e-fuse element providing a diff...
- Patent number 11,600,566
- Issue date Mar 7, 2023
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting structure and method for forming the same
- Patent number 11,587,875
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- U-Ting Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ETCH METHOD FOR OPENING A SOURCE LINE IN FLASH MEMORY
- Publication number 20250098160
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yong-Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM LATERAL EXPANSION OF CONTACT PLUGS THROUGH IMPLANTATION
- Publication number 20250096041
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACCESS LINE FORMATION FOR A MEMORY ARRAY
- Publication number 20250031383
- Publication date Jan 23, 2025
- Micron Technology, Inc.
- Andrea Redaelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BLOCK-ON-BLOCK MEMORY ARRAY ARCHITECTURE USING BI-DIRECTIONAL STAIR...
- Publication number 20240431110
- Publication date Dec 26, 2024
- Lodestar Licensing Group LLC
- Aaron S. Yip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS HAVING SIGNAL LINES FORMED WITH DOUBLE PATTERNING
- Publication number 20240395704
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Chieh YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240363535
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Lin-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE, SEMICONDUCTOR CHIP AND FABRICATING METHOD THEREOF
- Publication number 20240321686
- Publication date Sep 26, 2024
- Macronix International Co., Ltd.
- Cheng-Hsien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND IC DESIGN WITH NON-LINEAR POWER RAILS
- Publication number 20240312838
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Sheng-Hsiung Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PASS-THROUGH WIRING IN NOTCHED INTERCONNECT
- Publication number 20240290713
- Publication date Aug 29, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING INTERCONNECT STRUCTURES IN SEMICONDUCTOR FABRICA...
- Publication number 20240274528
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Ming-Han LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PATTERN AND METHOD OF ROUNDING THE SAME
- Publication number 20240266286
- Publication date Aug 8, 2024
- UNITED MICROELECTRONICS CORP.
- Bo-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED ZERO TRACK SKIP
- Publication number 20240234306
- Publication date Jul 11, 2024
- International Business Machines Corporation
- Reinaldo Vega
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, METHOD FOR FABRICATING THEREOF, AND METHOD...
- Publication number 20240222124
- Publication date Jul 4, 2024
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Gang-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES WITH HYBRID METAL LINES
- Publication number 20240203869
- Publication date Jun 20, 2024
- Intel Corporation
- Sukru Yemenicioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED ZERO TRACK SKIP
- Publication number 20240136281
- Publication date Apr 25, 2024
- International Business Machines Corporation
- Reinaldo Vega
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-STRESS PASSIVATION LAYER
- Publication number 20240136291
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Ku SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUG IN A METAL LAYER
- Publication number 20240113017
- Publication date Apr 4, 2024
- Intel Corporation
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED FUSE STRUCTURE AND METHOD OF USE
- Publication number 20240096789
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Sheng CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240071908
- Publication date Feb 29, 2024
- Rohm Co., Ltd.
- Shoji TAKEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER WITH A HIGH DENSITY OF PRIME INTEGRATED CIRCUIT...
- Publication number 20240006251
- Publication date Jan 4, 2024
- pSemi Corporation
- Tran KONONOVA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS HAVING SIGNAL LINES FORMED WITH DOUBLE PATTERNING
- Publication number 20230378060
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Chieh YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL VERTICAL NOR FLASH THIN FILM TRANSISTOR STRINGS
- Publication number 20230368843
- Publication date Nov 16, 2023
- Sunrise Memory Corporation
- Eli Harari
- G11 - INFORMATION STORAGE
Information Patent Application
SELF-ALIGNMENT ETCHING OF INTERCONNECT LAYERS
- Publication number 20230360965
- Publication date Nov 9, 2023
- Applied Materials, Inc.
- Suketu Arun Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH METHOD FOR OPENING A SOURCE LINE IN FLASH MEMORY
- Publication number 20230363154
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yong-Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING GRAPHENE INTERCONNECT AND METHOD OF...
- Publication number 20230335497
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH NARROW WIDTH INTERCONNECTS AND REDUCED RC...
- Publication number 20230317605
- Publication date Oct 5, 2023
- Intel Corporation
- Abhishek Anil Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT INTERCONNECT STRUCTURE
- Publication number 20230207330
- Publication date Jun 29, 2023
- International Business Machines Corporation
- Sagarika Mukesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20230197617
- Publication date Jun 22, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- U-TING CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and IC Design with Non-Linear Power Rails
- Publication number 20230187277
- Publication date Jun 15, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Sheng-Hsiung Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ETCH METHOD FOR OPENING A SOURCE LINE IN FLASH MEMORY
- Publication number 20230117612
- Publication date Apr 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yong-Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS

modifying the pattern

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Etch method for opening a source line in flash memory

Bottom lateral expansion of contact plugs through implantation

Semiconductor element, semiconductor element group, and method of m...

Block-on-block memory array architecture using bi-directional stair...

Integrated circuits having signal lines formed with double patterning

Storage device, semiconductor structure and method for forming same

Access line formation for a memory array

Self-aligned via to metal line for interconnect

Semiconductor structures and methods of forming the same

Semiconductor device having a source/drain contact plug with an upw...

Method and IC design with non-linear power rails

Semiconductor structure, method for fabricating thereof, and method...

Fully aligned subtractive processes and electronic devices therefrom

Methods of forming interconnect structures in semiconductor fabrica...

Methods of forming apparatuses having tungsten-containing structures

Via interconnects including super vias

Modified fuse structure and method of use

Method for fabricating semiconductor device

Electronic device and method of fabricating an electronic device

Method for forming three-dimensional integrated wiring structure an...

Etch method for opening a source line in flash memory

Self-alignment etching of interconnect layers

Three-dimensional vertical nor flash thin-film transistor strings

Semiconductor device with fuse and anti-fuse structures

Spin on scaffold film for forming topvia

Advanced metal connection with metal cut

Semiconductor device having fuse array and method of making the same

Semiconductor chip

Integrated circuit e-fuse having an e-fuse element providing a diff...

Connecting structure and method for forming the same

Patents Applicationslast 30 patents

ETCH METHOD FOR OPENING A SOURCE LINE IN FLASH MEMORY

BOTTOM LATERAL EXPANSION OF CONTACT PLUGS THROUGH IMPLANTATION

ACCESS LINE FORMATION FOR A MEMORY ARRAY

BLOCK-ON-BLOCK MEMORY ARRAY ARCHITECTURE USING BI-DIRECTIONAL STAIR...

INTEGRATED CIRCUITS HAVING SIGNAL LINES FORMED WITH DOUBLE PATTERNING

SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME

BONDING STRUCTURE, SEMICONDUCTOR CHIP AND FABRICATING METHOD THEREOF

METHOD AND IC DESIGN WITH NON-LINEAR POWER RAILS

PASS-THROUGH WIRING IN NOTCHED INTERCONNECT

METHODS OF FORMING INTERCONNECT STRUCTURES IN SEMICONDUCTOR FABRICA...

SEMICONDUCTOR PATTERN AND METHOD OF ROUNDING THE SAME

SELF-ALIGNED ZERO TRACK SKIP

SEMICONDUCTOR STRUCTURE, METHOD FOR FABRICATING THEREOF, AND METHOD...

INTEGRATED CIRCUIT DEVICES WITH HYBRID METAL LINES

SELF-ALIGNED ZERO TRACK SKIP

LOW-STRESS PASSIVATION LAYER

PLUG IN A METAL LAYER

MODIFIED FUSE STRUCTURE AND METHOD OF USE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR WAFER WITH A HIGH DENSITY OF PRIME INTEGRATED CIRCUIT...

INTEGRATED CIRCUITS HAVING SIGNAL LINES FORMED WITH DOUBLE PATTERNING

THREE-DIMENSIONAL VERTICAL NOR FLASH THIN FILM TRANSISTOR STRINGS

SELF-ALIGNMENT ETCHING OF INTERCONNECT LAYERS

ETCH METHOD FOR OPENING A SOURCE LINE IN FLASH MEMORY

SEMICONDUCTOR DEVICE INCLUDING GRAPHENE INTERCONNECT AND METHOD OF...

INTEGRATED CIRCUITS WITH NARROW WIDTH INTERCONNECTS AND REDUCED RC...

CIRCUIT INTERCONNECT STRUCTURE

SEMICONDUCTOR STRUCTURE

Method and IC Design with Non-Linear Power Rails

ETCH METHOD FOR OPENING A SOURCE LINE IN FLASH MEMORY