Molding with other step

Industry

CPC
Y10S29/029

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Parent Industries

YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10S29/00Metal working

Current Industry

Y10S29/029Molding with other step

Industries

Patents Grantslast 30 patents

Information Patent Grant
Shaft assembly for an electrified vehicle and shaft providing method
- Patent number 11,028,873
- Issue date Jun 8, 2021
- Ford Global Technologies, LLC
- Cyrille Goldstein
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
High density integrated circuit apparatus, test probe and methods o...
- Patent number 7,538,565
- Issue date May 26, 2009
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Grant
Constant velocity joint plunge boot
- Patent number 7,282,166
- Issue date Oct 16, 2007
- GKN Driveline North America, Inc.
- Shen-Ling Allen Wang
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Method of manufacturing commutator of rotary electric machine
- Patent number 7,043,822
- Issue date May 16, 2006
- Denso Corporation
- Masayuki Kobayashi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method of making a carbon commutator assembly
- Patent number 6,634,082
- Issue date Oct 21, 2003
- William E. Ziegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded PC card packages
- Patent number 6,633,492
- Issue date Oct 14, 2003
- Methode Electronics, Inc.
- Ryan Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Universal joint bearing insert formed from ceramic or composite mat...
- Patent number 6,520,859
- Issue date Feb 18, 2003
- Spicer Driveshaft, Inc.
- Daniel E. Beitzel
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Pin header and a method of making same
- Patent number 6,506,063
- Issue date Jan 14, 2003
- J.S.T. Mfg. Co., Ltd.
- Ryo Moriwake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a pin header
- Patent number 6,505,402
- Issue date Jan 14, 2003
- J.S.T. Mfg. Co., Ltd.
- Ryo Moriwake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density integrated circuit apparatus, test probe and methods o...
- Patent number 6,334,247
- Issue date Jan 1, 2002
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Grant
High density integrated circuit apparatus, test probe and methods o...
- Patent number 6,300,780
- Issue date Oct 9, 2001
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Grant
Interconnector with contact pads having enhanced durability
- Patent number 6,286,208
- Issue date Sep 11, 2001
- International Business Machines Corporation
- Da-Yuan Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembling a peripheral device printed circuit board package
- Patent number 6,269,537
- Issue date Aug 7, 2001
- Methode Electronics, Inc.
- Ryan Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mold for producing resin-molded product
- Patent number 6,206,681
- Issue date Mar 27, 2001
- Sumitomo Wiring
- Hajime Kawase
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of using a substrate with magnetic substance of a magnetic s...
- Patent number 6,153,321
- Issue date Nov 28, 2000
- Teijun Seiki Co.
- Kiyoshi Toyama
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Carbon commutator
- Patent number 5,932,949
- Issue date Aug 3, 1999
- McCord Winn Textron Inc.
- William E. Ziegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a connector using a pre-molded connector stru...
- Patent number 5,926,952
- Issue date Jul 27, 1999
- Sumitomo Wiring Systems, Ltd.
- Katsuya Ito
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of producing resin-molded product
- Patent number 5,915,760
- Issue date Jun 29, 1999
- Sumitomo Wiring Systems, Ltd.
- Hajime Kawase
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Test probe for high density integrated circuits, methods of fabrica...
- Patent number 5,821,763
- Issue date Oct 13, 1998
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Grant
Interconnector with contact pads having enhanced durability
- Patent number 5,810,607
- Issue date Sep 22, 1998
- International Business Machines Corporation
- Da-Yuan Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test probe having elongated conductor embedded in an elostomeric ma...
- Patent number 5,635,846
- Issue date Jun 3, 1997
- International Business Machines Corporation
- Brian S. Beaman
- G01 - MEASURING TESTING
Information Patent Grant
Method of fabricating an overmold onto an electrical cable assembly...
- Patent number 5,600,885
- Issue date Feb 11, 1997
- The Whitaker Corporation
- Richard C. Schroepfer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of and mold for molding product having insert
- Patent number 5,575,056
- Issue date Nov 19, 1996
- Sumitomo Bakelite Company Limited
- Yuji Nakagawa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of forming a three dimensional high performance interconnect...
- Patent number 5,531,022
- Issue date Jul 2, 1996
- International Business Machines Corporation
- Brain S. Beaman
- G01 - MEASURING TESTING
Information Patent Grant
Method of forming a welded encasement for a computer card
- Patent number 5,502,892
- Issue date Apr 2, 1996
- Maxconn Incorporated
- Teh-Sou Lien
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Overmold strain relief and snag prevention feature
- Patent number 5,462,457
- Issue date Oct 31, 1995
- The Whitaker Corporation
- Richard C. Schroepfer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a cable end retainer
- Patent number 5,435,052
- Issue date Jul 25, 1995
- Teleflex Incorporated
- David T. Spease
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Three dimensional high performance interconnection package
- Patent number 5,371,654
- Issue date Dec 6, 1994
- International Business Machines Corporation
- Brian S. Beaman
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing a magazine of predetermined number of cartr...
- Patent number 5,345,660
- Issue date Sep 13, 1994
- William J. Howard
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Cable end fitting retainer and method for making same
- Patent number 5,337,621
- Issue date Aug 16, 1994
- Teleflex Incorporated
- David T. Spease
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...

Patents Applicationslast 30 patents

Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20090128176
- Publication date May 21, 2009
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20080121879
- Publication date May 29, 2008
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20080106291
- Publication date May 8, 2008
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
High density integrated circuit apparatus, test probe and methods o...
- Publication number 20070271781
- Publication date Nov 29, 2007
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
Constant velocity joint plunge boot
- Publication number 20060135270
- Publication date Jun 22, 2006
- Shen-Ling Allen Wang
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
Method of manufacturing commutator of rotary electric machine
- Publication number 20040232798
- Publication date Nov 25, 2004
- Denso Corporation
- Masayuki Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shielded PC card packages
- Publication number 20020124400
- Publication date Sep 12, 2002
- Methode Electronics, Inc.
- Ryan Kimura
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Universal joint bearing insert formed from ceramic or composite mat...
- Publication number 20020082092
- Publication date Jun 27, 2002
- Daniel E. Beitzel
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
High density integrated circuit apparatus, test probe and methods o...
- Publication number 20020014004
- Publication date Feb 7, 2002
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
Shielded PC card packages
- Publication number 20010019475
- Publication date Sep 6, 2001
- Methode Electronics, Inc.
- Ryan Kimura
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Shielded PC card packages
- Publication number 20010017215
- Publication date Aug 30, 2001
- Methode Electronics, Inc.
- Ryan Kimura
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Pin header and a method of making same
- Publication number 20010006854
- Publication date Jul 5, 2001
- Ryo Moriwake
- H01 - BASIC ELECTRIC ELEMENTS

Molding with other step

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Shaft assembly for an electrified vehicle and shaft providing method

High density integrated circuit apparatus, test probe and methods o...

Constant velocity joint plunge boot

Method of manufacturing commutator of rotary electric machine

Method of making a carbon commutator assembly

Shielded PC card packages

Universal joint bearing insert formed from ceramic or composite mat...

Pin header and a method of making same

Method of making a pin header

High density integrated circuit apparatus, test probe and methods o...

High density integrated circuit apparatus, test probe and methods o...

Interconnector with contact pads having enhanced durability

Method of assembling a peripheral device printed circuit board package

Mold for producing resin-molded product

Method of using a substrate with magnetic substance of a magnetic s...

Carbon commutator

Method of fabricating a connector using a pre-molded connector stru...

Method of producing resin-molded product

Test probe for high density integrated circuits, methods of fabrica...

Interconnector with contact pads having enhanced durability

Test probe having elongated conductor embedded in an elostomeric ma...

Method of fabricating an overmold onto an electrical cable assembly...

Method of and mold for molding product having insert

Method of forming a three dimensional high performance interconnect...

Method of forming a welded encasement for a computer card

Overmold strain relief and snag prevention feature

Method for making a cable end retainer

Three dimensional high performance interconnection package

Method of manufacturing a magazine of predetermined number of cartr...

Cable end fitting retainer and method for making same

Patents Applicationslast 30 patents

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

High density integrated circuit apparatus, test probe and methods o...

Constant velocity joint plunge boot

Method of manufacturing commutator of rotary electric machine

Shielded PC card packages

Universal joint bearing insert formed from ceramic or composite mat...

High density integrated circuit apparatus, test probe and methods o...

Shielded PC card packages

Shielded PC card packages

Pin header and a method of making same