Molten solder just before placing the component

Industry

CPC
H05K2203/0475

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0475Molten solder just before placing the component

Industries

Patents Grantslast 30 patents

Information Patent Grant
Flux residue detection
- Patent number 10,939,600
- Issue date Mar 2, 2021
- International Business Machines Corporation
- Jiayu Zheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer-level methods of fabricating semiconductor device packages an...
- Patent number 10,896,894
- Issue date Jan 19, 2021
- Micron Technology, Inc.
- Wei Zhou
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device comprising an electronic component mounted on a s...
- Patent number 10,897,822
- Issue date Jan 19, 2021
- STMicroelectronics (Grenoble 2) SAS
- Fabien Quercia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnection including a cable assembly and a board assembly, a...
- Patent number 10,541,479
- Issue date Jan 21, 2020
- MD Elektronik GmbH
- Martin Huber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Estimation device
- Patent number 10,413,986
- Issue date Sep 17, 2019
- FUJI CORPORATION
- Kazuya Degura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression bonding systems and methods of operating the same
- Patent number 9,780,066
- Issue date Oct 3, 2017
- Kulicke and Soffa Industries, Inc.
- Matthew B. Wasserman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding systems and methods of operating the same
- Patent number 9,659,902
- Issue date May 23, 2017
- Kulicke and Soffa Industries, Inc.
- Matthew B. Wasserman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-assembled electrical contacts
- Patent number 8,318,595
- Issue date Nov 27, 2012
- The United States of America as represented by the Secretary of the Army
- Christopher J. Morris
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 7,901,997
- Issue date Mar 8, 2011
- Shinko Electric Industries Co., Ltd.
- Takashi Ozawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Attachment using magnetic particle based solder composites
- Patent number 7,902,060
- Issue date Mar 8, 2011
- Intel Corporation
- Rajasekaran Swaminathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing electronic component-mounted board
- Patent number 7,595,228
- Issue date Sep 29, 2009
- Fujitsu Limited
- Tomoyuki Abe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for soldering miniaturized components to a baseplate
- Patent number 7,504,604
- Issue date Mar 17, 2009
- Leica Geosystems AG
- Stephane Rossopoulos
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing electronic part and electronic part obtaine...
- Patent number 7,331,502
- Issue date Feb 19, 2008
- Sumitomo Bakelite Company, Ltd.
- Ryoichi Okada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip-join process to reduce elongation mismatch between the adheren...
- Patent number 7,235,886
- Issue date Jun 26, 2007
- Intel Corporation
- Biju Chandran
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting electronic component on substrate without genera...
- Patent number 7,159,309
- Issue date Jan 9, 2007
- Fujitsu Limited
- Tsuyoshi Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer interconnection and method
- Patent number 6,543,674
- Issue date Apr 8, 2003
- Fujitsu Limited
- Michael G. Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for manufacturing circuit modules
- Patent number 6,441,339
- Issue date Aug 27, 2002
- Taiyo Yuden Co., Ltd.
- Mitsuo Ueno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing circuit modules
- Patent number 6,333,483
- Issue date Dec 25, 2001
- Taiyo Yuden Co., Ltd.
- Mitsuo Ueno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reflow soldering apparatus
- Patent number 6,131,793
- Issue date Oct 17, 2000
- MCMS, Inc.
- David A. Howell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reflow soldering method
- Patent number 6,010,061
- Issue date Jan 4, 2000
- Micron Custom Manufacturing Services Inc.
- David A. Howell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for assembling ball grid array components on p...
- Patent number 5,516,030
- Issue date May 14, 1996
- Compaq Computer Corporation
- Ronald D. Denton
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of positioning and soldering of SMD components
- Patent number 5,413,275
- Issue date May 9, 1995
- U.S. Philips Corporation
- Martinus M. F. Verguld
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for connecting electronic component with substrate
- Patent number 5,289,966
- Issue date Mar 1, 1994
- Matsushita Electric Industrial Co., Ltd.
- Yasuo Izumi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of soldering components to printed circuit boards
- Patent number 5,111,991
- Issue date May 12, 1992
- Motorola, Inc.
- Robert A. Clawson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of solder reflow assembly
- Patent number 4,334,646
- Issue date Jun 15, 1982
- Harris Corporation
- Henry J. Campbell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3912153
- Patent number 3,912,153
- Issue date Oct 14, 1975
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3710196
- Patent number 3,710,196
- Issue date Jan 9, 1973
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3214827
- Patent number 3,214,827
- Issue date Nov 2, 1965
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...
- Publication number 20240389240
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chao-Wei Chiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER SOLDERING METHOD AND DEVICE
- Publication number 20220320811
- Publication date Oct 6, 2022
- O.M.C. CO., LTD.
- Shinji WATANABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE COMPRISING AN ELECTRONIC COMPONENT MOUNTED ON A S...
- Publication number 20200305283
- Publication date Sep 24, 2020
- STMicroelectronics (Grenoble 2) SAS
- Fabien QUERCIA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUX RESIDUE DETECTION
- Publication number 20200170155
- Publication date May 28, 2020
- International Business Machines Corporation
- Jiayu Zheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER-LEVEL METHODS OF FABRICATING SEMICONDUCTOR DEVICE PACKAGES AN...
- Publication number 20200105713
- Publication date Apr 2, 2020
- Micron Technology, Inc.
- Wei Zhou
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECTION INCLUDING A CABLE ASSEMBLY AND A BOARD ASSEMBLY, A...
- Publication number 20190036245
- Publication date Jan 31, 2019
- MD ELEKTRONIK GmbH
- Martin Huber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ESTIMATION DEVICE
- Publication number 20180185946
- Publication date Jul 5, 2018
- FUJI MACHINE MFG. CO., LTD.
- Kazuya DEGURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERING APPARATUS
- Publication number 20180015558
- Publication date Jan 18, 2018
- FUJI MACHINE MFG. CO., LTD.
- Katsunori TANAKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ATTACHMENT USING MAGNETIC PARTICLE BASED SOLDER COMPOSITES
- Publication number 20100159692
- Publication date Jun 24, 2010
- Rajasekaran SWAMINATHAN
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Self-Assembled Electrical Contacts
- Publication number 20100139954
- Publication date Jun 10, 2010
- Christopher J. Morris
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20080188040
- Publication date Aug 7, 2008
- Shinko Electric Industries Co., Ltd.
- Takashi Ozawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method for soldering miniaturised components to a base plate
- Publication number 20060124614
- Publication date Jun 15, 2006
- Leica Geosystems AG
- Stephane Rossopoulos
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing electronic component-mounted board
- Publication number 20060051895
- Publication date Mar 9, 2006
- FUJITSU LIMITED
- Tomoyuki Abe
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method of mounting electronic component on substrate without genera...
- Publication number 20050139389
- Publication date Jun 30, 2005
- FUJITSU LIMITED
- Tsuyoshi Yamamoto
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method of manufacturing electronic part and electronic part obtaine...
- Publication number 20040105223
- Publication date Jun 3, 2004
- Ryoichi Okada
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method of mounting electronic component on substrate without genera...
- Publication number 20030051905
- Publication date Mar 20, 2003
- FUJITSU LIMITED
- Tsuyoshi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer interconnection and method
- Publication number 20020104873
- Publication date Aug 8, 2002
- Michael G. Lee
- H01 - BASIC ELECTRIC ELEMENTS

Molten solder just before placing the component

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Flux residue detection

Wafer-level methods of fabricating semiconductor device packages an...

Electronic device comprising an electronic component mounted on a s...

Interconnection including a cable assembly and a board assembly, a...

Estimation device

Thermocompression bonding systems and methods of operating the same

Thermocompression bonding systems and methods of operating the same

Self-assembled electrical contacts

Method of manufacturing semiconductor device

Attachment using magnetic particle based solder composites

Method for manufacturing electronic component-mounted board

Method for soldering miniaturized components to a baseplate

Method of manufacturing electronic part and electronic part obtaine...

Chip-join process to reduce elongation mismatch between the adheren...

Method of mounting electronic component on substrate without genera...

Multilayer interconnection and method

Apparatus for manufacturing circuit modules

Method of manufacturing circuit modules

Reflow soldering apparatus

Reflow soldering method

Method and apparatus for assembling ball grid array components on p...

Method of positioning and soldering of SMD components

Method for connecting electronic component with substrate

Method of soldering components to printed circuit boards

Method of solder reflow assembly

3912153

3710196

3214827

Patents Applicationslast 30 patents

MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...

LASER SOLDERING METHOD AND DEVICE

ELECTRONIC DEVICE COMPRISING AN ELECTRONIC COMPONENT MOUNTED ON A S...

FLUX RESIDUE DETECTION

WAFER-LEVEL METHODS OF FABRICATING SEMICONDUCTOR DEVICE PACKAGES AN...

INTERCONNECTION INCLUDING A CABLE ASSEMBLY AND A BOARD ASSEMBLY, A...

ESTIMATION DEVICE

SOLDERING APPARATUS

ATTACHMENT USING MAGNETIC PARTICLE BASED SOLDER COMPOSITES

Self-Assembled Electrical Contacts

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Method for soldering miniaturised components to a base plate

Method for manufacturing electronic component-mounted board

Method of mounting electronic component on substrate without genera...

Method of manufacturing electronic part and electronic part obtaine...

Method of mounting electronic component on substrate without genera...

Multilayer interconnection and method