3214827

Information

• Patent Grant
• 3214827

• References
• Source

• Patent Number

  3,214,827

• Date Filed

  Not available

• Date Issued

  Tuesday, November 2, 1965
  59 years ago

• CPC

  • H05K3/3447 - Lead-in-hole components
  • H01R12/523 - by an interconnection through aligned holes in the boards or multilayer board
  • H05K3/368 - parallel to each other
  • H05K1/144 - Stacked arrangements of planar printed circuit boards
  • H05K3/3494 - Heating methods for reflowing of solder
  • H05K3/4038 - Through-connections or via connections
  • H05K3/4046 - using auxiliary conductive elements
  • H05K3/4611 - by laminating two or more circuit boards
  • H05K2201/0305 - Solder used for other purposes than connections between PCB or components
  • H05K2201/09536 - Buried plated through-holes
  • H05K2201/096 - Vertically aligned vias, holes or stacked vias
  • H05K2201/09827 - Tapered
  • H05K2201/10303 - Pin-in-hole mounted pins
  • H05K2201/10984 - Component carrying a connection agent
  • H05K2203/045 - Solder filled PTH during processing
  • H05K2203/0475 - Molten solder just before placing the component
  • H05K2203/0776 - Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
  • Y10T29/49126 - Assembling bases

• US Classifications

  • 029 - Metal working
  • 174 - Electricity: conductors and insulators
  • 228 - Metal fusion bonding
  • 361 - Electricity: electrical systems and devices