Molybdenum (Mo) as principal constituent

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H01L2224/4888

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4888Molybdenum (Mo) as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and inspection device
- Patent number 12,040,303
- Issue date Jul 16, 2024
- Kabushiki Kaisha Toshiba
- Mitsuaki Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 10,818,620
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,068,823
- Issue date Sep 4, 2018
- Rohm Co., Ltd.
- Hiroshi Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,508,672
- Issue date Nov 29, 2016
- Rohm Co., Ltd.
- Hiroshi Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 9,466,559
- Issue date Oct 11, 2016
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging methods and packaged semiconductor devices
- Patent number 9,263,412
- Issue date Feb 16, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hung Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having copper interconnect for bonding
- Patent number 8,759,970
- Issue date Jun 24, 2014
- Round Rock Research, LLC
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level processing method and structure to manufacture semicond...
- Patent number 8,431,977
- Issue date Apr 30, 2013
- Megica Corporation
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 8,132,709
- Issue date Mar 13, 2012
- Nichia Corporation
- Tadao Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 8,063,489
- Issue date Nov 22, 2011
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure having dummy plugs and/or patterns formed therea...
- Patent number 8,030,781
- Issue date Oct 4, 2011
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and semiconductor device having copper interconnect for bonding
- Patent number 7,592,246
- Issue date Sep 22, 2009
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnect
- Patent number 7,569,934
- Issue date Aug 4, 2009
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnection with conductive polymer layer and method of...
- Patent number 7,538,434
- Issue date May 26, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsueh Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnect
- Patent number 7,511,363
- Issue date Mar 31, 2009
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnect
- Patent number 7,489,041
- Issue date Feb 10, 2009
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnect for semiconductor device
- Patent number 7,345,358
- Issue date Mar 18, 2008
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of improving copper interconnects of semiconductor devices f...
- Patent number 7,338,889
- Issue date Mar 4, 2008
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of improving copper interconnects of semiconductor devices f...
- Patent number 6,835,643
- Issue date Dec 28, 2004
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding process for copper-metallized integrated circuits
- Patent number 6,800,555
- Issue date Oct 5, 2004
- Texas Instruments Incorporated
- Howard R. Test
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of improving copper interconnects of semiconductor devices f...
- Patent number 6,544,880
- Issue date Apr 8, 2003
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND INSPECTION DEVICE
- Publication number 20210296279
- Publication date Sep 23, 2021
- Kabushiki Kaisha Toshiba
- Mitsuaki KATO
- G01 - MEASURING TESTING
Information Patent Application
Packaging Methods and Packaged Semiconductor Devices
- Publication number 20140367867
- Publication date Dec 18, 2014
- Wei-Hung Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...
- Publication number 20140327018
- Publication date Nov 6, 2014
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND PROCESSING METHODS
- Publication number 20140110838
- Publication date Apr 24, 2014
- INFINEON TECHNOLOGIES AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-In-Packages and Methods of Formation Thereof
- Publication number 20140001615
- Publication date Jan 2, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20130313708
- Publication date Nov 28, 2013
- RENESAS ELECTRONICS CORPORATION
- HIROMI SHIGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130113096
- Publication date May 9, 2013
- Rohm Co., Ltd.
- Hiroshi Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE TO REDUCE BOND PAD CORROSION
- Publication number 20130043598
- Publication date Feb 21, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD CARRIER WITH THERMALLY FUSED PACKAGE COMPONENTS
- Publication number 20130001761
- Publication date Jan 3, 2013
- Philip E. Rogren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Bonding Wire
- Publication number 20120267784
- Publication date Oct 25, 2012
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNS OF PASSIVATION MATERIAL ON BOND PADS AND METHODS OF MANUFA...
- Publication number 20120205812
- Publication date Aug 16, 2012
- Sehat Sutardja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20120032329
- Publication date Feb 9, 2012
- Renesas Electronics Corporation
- HIROMI SHIGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PROCESSING METHOD AND STRUCTURE TO MANUFACTURE SEMICOND...
- Publication number 20110304008
- Publication date Dec 15, 2011
- Magica Corporation
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20100133688
- Publication date Jun 3, 2010
- RENESAS TECHNOLOGY CORP.
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE HAVING DUMMY PLUGS AND/OR PATTERNS FORMED THEREA...
- Publication number 20100072632
- Publication date Mar 25, 2010
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SEMICONDUCTOR DEVICE HAVING COPPER INTERCONNECT FOR BONDING
- Publication number 20090309222
- Publication date Dec 17, 2009
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20080116591
- Publication date May 22, 2008
- Nichia Corporation.
- Tadao Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper interconnection with conductive polymer layer and method of...
- Publication number 20060202346
- Publication date Sep 14, 2006
- Chien-Hsueh Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper interconnect
- Publication number 20060138660
- Publication date Jun 29, 2006
- SALMAN AKRAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper interconnect
- Publication number 20060071336
- Publication date Apr 6, 2006
- SALMAN AKRAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper interconnect
- Publication number 20060055057
- Publication date Mar 16, 2006
- SALMAN AKRAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper interconnect
- Publication number 20060055058
- Publication date Mar 16, 2006
- SALMAN AKRAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper interconnect
- Publication number 20060055060
- Publication date Mar 16, 2006
- SALMAN AKRAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper interconnect
- Publication number 20060055059
- Publication date Mar 16, 2006
- SALMAN AKRAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and semiconductor device having copper interconnect for bonding
- Publication number 20050218483
- Publication date Oct 6, 2005
- SALMAN AKRAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper interconnect
- Publication number 20050212128
- Publication date Sep 29, 2005
- SALMAN AKRAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding process for copper-metallized integrated circuits
- Publication number 20050106851
- Publication date May 19, 2005
- Howard R. Test
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and semiconductor device having copper interconnect for bonding
- Publication number 20050098888
- Publication date May 12, 2005
- SALMAN AKRAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of improving copper interconnect of semiconductor devices fo...
- Publication number 20040171246
- Publication date Sep 2, 2004
- SALMAN AKRAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of improving copper interconnect of semiconductor devices fo...
- Publication number 20030143830
- Publication date Jul 31, 2003
- SALMAN AKRAM
- H01 - BASIC ELECTRIC ELEMENTS

Molybdenum (Mo) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and inspection device

Semiconductor integrated circuit device

Semiconductor device

Semiconductor device

Semiconductor integrated circuit device

Packaging methods and packaged semiconductor devices

Semiconductor device having copper interconnect for bonding

Wafer level processing method and structure to manufacture semicond...

Semiconductor device and method for manufacturing same

Semiconductor integrated circuit device

Bond pad structure having dummy plugs and/or patterns formed therea...

Method and semiconductor device having copper interconnect for bonding

Copper interconnect

Copper interconnection with conductive polymer layer and method of...

Copper interconnect

Copper interconnect

Copper interconnect for semiconductor device

Method of improving copper interconnects of semiconductor devices f...

Method of improving copper interconnects of semiconductor devices f...

Wire bonding process for copper-metallized integrated circuits

Method of improving copper interconnects of semiconductor devices f...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND INSPECTION DEVICE

Packaging Methods and Packaged Semiconductor Devices

POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...

SEMICONDUCTOR DEVICES AND PROCESSING METHODS

Package-In-Packages and Methods of Formation Thereof

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR DEVICE

BOND PAD STRUCTURE TO REDUCE BOND PAD CORROSION

LEAD CARRIER WITH THERMALLY FUSED PACKAGE COMPONENTS

Semiconductor Device and Bonding Wire

PATTERNS OF PASSIVATION MATERIAL ON BOND PADS AND METHODS OF MANUFA...

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

WAFER LEVEL PROCESSING METHOD AND STRUCTURE TO MANUFACTURE SEMICOND...

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

BOND PAD STRUCTURE HAVING DUMMY PLUGS AND/OR PATTERNS FORMED THEREA...

METHOD AND SEMICONDUCTOR DEVICE HAVING COPPER INTERCONNECT FOR BONDING

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Copper interconnection with conductive polymer layer and method of...

Copper interconnect

Copper interconnect

Copper interconnect

Copper interconnect

Copper interconnect

Copper interconnect

Method and semiconductor device having copper interconnect for bonding

Copper interconnect

Wire bonding process for copper-metallized integrated circuits

Method and semiconductor device having copper interconnect for bonding

Method of improving copper interconnect of semiconductor devices fo...

Method of improving copper interconnect of semiconductor devices fo...