Molybdenum [Mo] as principal constituent

Industry

CPC
H01L2224/8348

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8348Molybdenum [Mo] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding structure production method and bonding structure
- Patent number 12,094,850
- Issue date Sep 17, 2024
- Osaka University
- Katsuaki Suganuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,062,637
- Issue date Aug 13, 2024
- Innolux Corporation
- Pai-Chiao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and fluidic manufacture thereof
- Patent number 11,721,792
- Issue date Aug 8, 2023
- eLux Inc.
- Kenji Alexander Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
- Patent number 11,626,388
- Issue date Apr 11, 2023
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering a conductor to an aluminum layer
- Patent number 11,424,217
- Issue date Aug 23, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
- Patent number 11,233,036
- Issue date Jan 25, 2022
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having conductive particle between pads
- Patent number 11,217,557
- Issue date Jan 4, 2022
- Innolux Corporation
- Pai-Chiao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having chips attached to support members throu...
- Patent number 11,101,246
- Issue date Aug 24, 2021
- Denso Corporation
- Tomohito Iwashige
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
- Patent number 10,943,888
- Issue date Mar 9, 2021
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and fluidic manufacture thereof
- Patent number 10,930,819
- Issue date Feb 23, 2021
- eLux Inc.
- Kenji Alexander Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for creating a bond between objects based on f...
- Patent number 10,923,454
- Issue date Feb 16, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ag underlayer-attached metallic member, Ag underlayer-attached insu...
- Patent number 10,734,297
- Issue date Aug 4, 2020
- Mitsubishi Materials Corporation
- Shuji Nishimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vibrator device, oscillator, electronic device, and vehicle
- Patent number 10,615,747
- Issue date Apr 7, 2020
- Seiko Epson Corporation
- Hisahiro Ito
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device
- Patent number 10,504,749
- Issue date Dec 10, 2019
- Mitsubishi Materials Corporation
- Shuji Nishimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and production method of the same
- Patent number 10,461,054
- Issue date Oct 29, 2019
- Dexerials Corporation
- Yasushi Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die with integrated microphone device using through-silicon vias (T...
- Patent number 10,455,308
- Issue date Oct 22, 2019
- Intel Corporation
- Kevin J. Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Anisotropic conductive film and production method of the same
- Patent number 10,442,958
- Issue date Oct 15, 2019
- Dexerials Corporation
- Yuta Araki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Anisotropic conductive film, method for producing anisotropic condu...
- Patent number 10,373,926
- Issue date Aug 6, 2019
- Dexerials Corporation
- Kouichi Sato
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Light emitting device and light emitting module
- Patent number 10,297,716
- Issue date May 21, 2019
- LG Innotek Co., Ltd
- Shuhei Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and fluidic manufacture thereof
- Patent number 10,230,020
- Issue date Mar 12, 2019
- eLux Inc.
- Kenji Alexander Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
- Patent number 10,192,852
- Issue date Jan 29, 2019
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit packages including modules that include at least one integr...
- Patent number 10,178,786
- Issue date Jan 8, 2019
- Honeywell International Inc.
- James L. Tucker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive and light-emitting device
- Patent number 9,994,743
- Issue date Jun 12, 2018
- DEXERIALS CORPORATION
- Masaharu Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and method of manufacturing the same
- Patent number 9,991,184
- Issue date Jun 5, 2018
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film, method for producing anisotropic condu...
- Patent number 9,960,139
- Issue date May 1, 2018
- Dexerials Corporation
- Kouichi Sato
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
- Patent number 9,818,728
- Issue date Nov 14, 2017
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite substrate with alternating pattern of diamond and metal o...
- Patent number 9,812,375
- Issue date Nov 7, 2017
- II-VI Incorporated
- Wen-Qing Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having multiple bonded heat sinks
- Patent number 9,721,866
- Issue date Aug 1, 2017
- SOCIONEXT INC.
- Takeshi Imamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joint material, and jointed body
- Patent number 9,543,265
- Issue date Jan 10, 2017
- Hitachi, Ltd.
- Motomune Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with mechanical lock features between a semico...
- Patent number 9,425,161
- Issue date Aug 23, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Lakshminarayan Viswanathan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240363582
- Publication date Oct 31, 2024
- InnoLux Corporation
- Pai-Chiao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240312860
- Publication date Sep 19, 2024
- Kabushiki Kaisha Toshiba
- Daisuke KOIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Power Semiconductor Device
- Publication number 20240096842
- Publication date Mar 21, 2024
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEIGHT ADAPTABLE MULTILAYER SPACER
- Publication number 20230197665
- Publication date Jun 22, 2023
- Heraeus Deutschland GmbH & Co. KG
- Andreas HINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING LAMINATE
- Publication number 20220293554
- Publication date Sep 15, 2022
- LINTEC CORPORATION
- Isao ICHIKAWA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
BONDING STRUCTURE PRODUCTION METHOD AND BONDING STRUCTURE
- Publication number 20220230988
- Publication date Jul 21, 2022
- OSAKA UNIVERSITY
- Katsuaki SUGANUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20220084982
- Publication date Mar 17, 2022
- InnoLux Corporation
- Pai-Chiao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device and Method for Fabricating a Power Semic...
- Publication number 20210225795
- Publication date Jul 22, 2021
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...
- Publication number 20210167035
- Publication date Jun 3, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20200365551
- Publication date Nov 19, 2020
- InnoLux Corporation
- Pai-Chiao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
- Publication number 20200312818
- Publication date Oct 1, 2020
- DENSO CORPORATION
- Tomohito IWASHIGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY FAN-OUT PACKAGING
- Publication number 20190326257
- Publication date Oct 24, 2019
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light Emitting Device and Fluidic Manufacture Thereof
- Publication number 20190181304
- Publication date Jun 13, 2019
- eLux Inc.
- Kenji Alexander Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING ANISOTROPIC CONDU...
- Publication number 20180218994
- Publication date Aug 2, 2018
- DEXERIALS CORPORATION
- Kouichi SATO
- B32 - LAYERED PRODUCTS
Information Patent Application
INTERCONNECT STRUCTURE WITH REDUNDANT ELECTRICAL CONNECTORS AND ASS...
- Publication number 20180026015
- Publication date Jan 25, 2018
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Joint Material, and Jointed Body
- Publication number 20140287227
- Publication date Sep 25, 2014
- Hitachi, Ltd
- Motomune KODAMA
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20140197533
- Publication date Jul 17, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Takeshi Imamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20140110740
- Publication date Apr 24, 2014
- Nichia Corporation.
- Masafumi KURAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140021610
- Publication date Jan 23, 2014
- INFINEON TECHNOLOGIES AG
- Carsten VON KOBLINSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT ARRANGEMENT FOR A THERMALLY CONDUCTIVE CHIP ASSEMBLY AND A...
- Publication number 20130277846
- Publication date Oct 24, 2013
- ROHDE & SCHWARZ GMBH & CO. KG
- Robert Ziegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20130234298
- Publication date Sep 12, 2013
- Kabushiki Kaisha Toshiba
- Satoshi MITSUGI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BROAD-AREA LIGHTING SYSTEMS
- Publication number 20130111744
- Publication date May 9, 2013
- Michael A. Tischler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BROAD-AREA LIGHTING SYSTEMS
- Publication number 20130112989
- Publication date May 9, 2013
- COOLEDGE LIGHTING, INC.
- Michael Tischler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SEALING AND CONTACTING SUBSTRATES USING LASER LIGHT AND E...
- Publication number 20130070428
- Publication date Mar 21, 2013
- CORELASE OY
- Jarno Kangastupa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BROAD-AREA LIGHTING SYSTEMS
- Publication number 20130056749
- Publication date Mar 7, 2013
- Michael Tischler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE
- Publication number 20130037967
- Publication date Feb 14, 2013
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jong Man KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL
- Publication number 20120068325
- Publication date Mar 22, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100213622
- Publication date Aug 26, 2010
- Toshinobu Ogatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20100187563
- Publication date Jul 29, 2010
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL
- Publication number 20100181676
- Publication date Jul 22, 2010
- RUBEN B. MONTEZ
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Molybdenum [Mo] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding structure production method and bonding structure

Electronic device

Light emitting device and fluidic manufacture thereof

Interconnect structure with redundant electrical connectors and ass...

Soldering a conductor to an aluminum layer

Interconnect structure with redundant electrical connectors and ass...

Electronic device having conductive particle between pads

Semiconductor device having chips attached to support members throu...

Interconnect structure with redundant electrical connectors and ass...

Light emitting device and fluidic manufacture thereof

Method and apparatus for creating a bond between objects based on f...

Ag underlayer-attached metallic member, Ag underlayer-attached insu...

Vibrator device, oscillator, electronic device, and vehicle

Semiconductor device

Anisotropic conductive film and production method of the same

Die with integrated microphone device using through-silicon vias (T...

Anisotropic conductive film and production method of the same

Anisotropic conductive film, method for producing anisotropic condu...

Light emitting device and light emitting module

Light emitting device and fluidic manufacture thereof

Interconnect structure with redundant electrical connectors and ass...

Circuit packages including modules that include at least one integr...

Adhesive and light-emitting device

Electronic module and method of manufacturing the same

Anisotropic conductive film, method for producing anisotropic condu...

Interconnect structure with redundant electrical connectors and ass...

Composite substrate with alternating pattern of diamond and metal o...

Semiconductor device having multiple bonded heat sinks

Joint material, and jointed body

Semiconductor device with mechanical lock features between a semico...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Method for Fabricating a Power Semiconductor Device

HEIGHT ADAPTABLE MULTILAYER SPACER

METHOD OF MANUFACTURING LAMINATE

BONDING STRUCTURE PRODUCTION METHOD AND BONDING STRUCTURE

ELECTRONIC DEVICE

Power Semiconductor Device and Method for Fabricating a Power Semic...

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME

HIGH DENSITY FAN-OUT PACKAGING

Light Emitting Device and Fluidic Manufacture Thereof

ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING ANISOTROPIC CONDU...

INTERCONNECT STRUCTURE WITH REDUNDANT ELECTRICAL CONNECTORS AND ASS...

Joint Material, and Jointed Body

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE

CIRCUIT ARRANGEMENT FOR A THERMALLY CONDUCTIVE CHIP ASSEMBLY AND A...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

BROAD-AREA LIGHTING SYSTEMS

BROAD-AREA LIGHTING SYSTEMS

METHOD OF SEALING AND CONTACTING SUBSTRATES USING LASER LIGHT AND E...

BROAD-AREA LIGHTING SYSTEMS

SEMICONDUCTOR PACKAGE SUBSTRATE

SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL