Molybdenum [Mo] as principal constituent

Industry

CPC
H01L2224/8048

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8048Molybdenum [Mo] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Die encapsulation in oxide bonded wafer stack
- Patent number 10,784,234
- Issue date Sep 22, 2020
- Raytheon Company
- John J. Drab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die encapsulation in oxide bonded wafer stack
- Patent number 10,242,967
- Issue date Mar 26, 2019
- Raytheon Company
- John J. Drab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies formed using metal silicide, and methods...
- Patent number 9,905,523
- Issue date Feb 27, 2018
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing a semiconductor d...
- Patent number 9,613,930
- Issue date Apr 4, 2017
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flattened substrate surface for substrate bonding
- Patent number 9,355,936
- Issue date May 31, 2016
- GLOBALFOUNDRIES Inc.
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-wafer pair anodic bonding apparatus and method
- Patent number 9,287,126
- Issue date Mar 15, 2016
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Method of sealing and contacting substrates using laser light and e...
- Patent number 9,171,822
- Issue date Oct 27, 2015
- Corelase Oy
- Jarno Kangastupa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting structure
- Patent number 8,497,432
- Issue date Jul 30, 2013
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for joining a silicon plate to a second plate
- Patent number 6,955,975
- Issue date Oct 18, 2005
- Robert Bosch GmbH
- Frank Reichenbach
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING
- Publication number 20240379564
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yi-Chu WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240250039
- Publication date Jul 25, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240250038
- Publication date Jul 25, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHO...
- Publication number 20240222226
- Publication date Jul 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240128147
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sey-Ping SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...
- Publication number 20240038633
- Publication date Feb 1, 2024
- INVENSAS BONDING TECHNOLOGIES, INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240006301
- Publication date Jan 4, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20230154877
- Publication date May 18, 2023
- Industrial Technology Research Institute
- Yu-Ming Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE COMPOSITE WAFER AND MANUFACTURING METHOD THEREOF
- Publication number 20220384385
- Publication date Dec 1, 2022
- Hong Chuang Applied Technology Co., Ltd
- Yan-Kai ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ENCAPSULATION IN OXIDE BONDED WAFER STACK
- Publication number 20190221547
- Publication date Jul 18, 2019
- Raytheon Company
- John J. Drab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES FORMED USING METAL SILICIDE, AND METHODS...
- Publication number 20170018517
- Publication date Jan 19, 2017
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR D...
- Publication number 20150115458
- Publication date Apr 30, 2015
- INFINEON TECHNOLOGIES AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-WAFER PAIR ANODIC BONDING APPARATUS AND METHOD
- Publication number 20140322892
- Publication date Oct 30, 2014
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
FLATTENED SUBSTRATE SURFACE FOR SUBSTRATE BONDING
- Publication number 20140209908
- Publication date Jul 31, 2014
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLATTENED SUBSTRATE SURFACE FOR SUBSTRATE BONDING
- Publication number 20130105981
- Publication date May 2, 2013
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SEALING AND CONTACTING SUBSTRATES USING LASER LIGHT AND E...
- Publication number 20130070428
- Publication date Mar 21, 2013
- CORELASE OY
- Jarno Kangastupa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE
- Publication number 20100071946
- Publication date Mar 25, 2010
- SEIKO EPSON CORPORATION
- Nobuaki HASHIMOTO
- G02 - OPTICS
Information Patent Application
Method for joining a silicon plate to a second plate
- Publication number 20040082145
- Publication date Apr 29, 2004
- Frank Reichenbach
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Molybdenum [Mo] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Die encapsulation in oxide bonded wafer stack

Die encapsulation in oxide bonded wafer stack

Microelectronic assemblies formed using metal silicide, and methods...

Semiconductor device and method for manufacturing a semiconductor d...

Flattened substrate surface for substrate bonding

Multi-wafer pair anodic bonding apparatus and method

Method of sealing and contacting substrates using laser light and e...

Electronic component mounting structure

Method for joining a silicon plate to a second plate

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHO...

SEMICONDUCTOR DEVICE

EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

SILICON CARBIDE COMPOSITE WAFER AND MANUFACTURING METHOD THEREOF

DIE ENCAPSULATION IN OXIDE BONDED WAFER STACK

MICROELECTRONIC ASSEMBLIES FORMED USING METAL SILICIDE, AND METHODS...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR D...

MULTI-WAFER PAIR ANODIC BONDING APPARATUS AND METHOD

FLATTENED SUBSTRATE SURFACE FOR SUBSTRATE BONDING

FLATTENED SUBSTRATE SURFACE FOR SUBSTRATE BONDING

METHOD OF SEALING AND CONTACTING SUBSTRATES USING LASER LIGHT AND E...

ELECTRONIC COMPONENT MOUNTING STRUCTURE

Method for joining a silicon plate to a second plate