Molybdenum [Mo] as principal constituent

Industry

CPC
H01L2224/2928

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/2928Molybdenum [Mo] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Hybrid backside thermal structures for enhanced IC packages
- Patent number 11,948,906
- Issue date Apr 2, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and manufacturing method of electronic device
- Patent number 11,948,908
- Issue date Apr 2, 2024
- Japan Display Inc.
- Kazuyuki Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor device
- Patent number 11,676,936
- Issue date Jun 13, 2023
- Nitto Denko Corporation
- Ryota Mita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display module and manufacturing method thereof
- Patent number 11,652,196
- Issue date May 16, 2023
- Samsung Electronics Co., Ltd.
- Myunghee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sheet and composite sheet
- Patent number 11,634,611
- Issue date Apr 25, 2023
- Nitto Denko Corporation
- Nao Kamakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor device
- Patent number 11,594,513
- Issue date Feb 28, 2023
- Nitto Denko Corporation
- Ryota Mita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film
- Patent number 11,557,562
- Issue date Jan 17, 2023
- Dexerials Corporation
- Takeshi Miyake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-dielectric adhesive film
- Patent number 11,485,879
- Issue date Nov 1, 2022
- ICH Co., Ltd.
- Young Hun Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Metal paste for joints, assembly, production method for assembly, s...
- Patent number 11,462,502
- Issue date Oct 4, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Metal paste and use thereof for joining components
- Patent number 11,045,910
- Issue date Jun 29, 2021
- Heraeus Deutschland GmbH & Co. KG
- Wolfgang Schmitt
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Information handling system low form factor interface thermal manag...
- Patent number 10,985,086
- Issue date Apr 20, 2021
- Dell Products L.P.
- Travis C. North
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Contact structures with porous networks for solder connections, and...
- Patent number 10,849,240
- Issue date Nov 24, 2020
- Invensas Corporation
- Liang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sintering pastes with high metal loading for semiconductor die atta...
- Patent number 10,727,193
- Issue date Jul 28, 2020
- Ormet Circuits, Inc.
- Catherine Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal bonding sheet and thermal bonding sheet with dicing tape
- Patent number 10,685,933
- Issue date Jun 16, 2020
- Nitto Denko Corporation
- Yuki Sugo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermal bonding sheet and thermal bonding sheet with dicing tape
- Patent number 10,669,452
- Issue date Jun 2, 2020
- Nitto Denko Corporation
- Yuki Sugo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, mechanical quantity measuring device, and sem...
- Patent number 10,247,630
- Issue date Apr 2, 2019
- Hitachi Automotive Systems, Ltd.
- Hanae Shimokawa
- G01 - MEASURING TESTING
Information Patent Grant
Heat-dissipating structure and semiconductor module using same
- Patent number 10,177,069
- Issue date Jan 8, 2019
- Hitachi Ltd.
- Takashi Naito
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Thermocompression for semiconductor chip assembly
- Patent number 10,134,704
- Issue date Nov 20, 2018
- International Business Machines Corporation
- Julien Sylvestre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression for semiconductor chip assembly
- Patent number 9,735,125
- Issue date Aug 15, 2017
- International Business Machines Corporation
- Julien Sylvestre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates
- Patent number 9,673,167
- Issue date Jun 6, 2017
- EV Group E. Thallner GmbH
- Markus Wimplinger
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Joint material, and jointed body
- Patent number 9,543,265
- Issue date Jan 10, 2017
- Hitachi, Ltd.
- Motomune Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder joint structure, power module, power module substrate with h...
- Patent number 9,355,986
- Issue date May 31, 2016
- Mitsubishi Materials Corporation
- Shuji Nishimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression for semiconductor chip assembly
- Patent number 9,287,230
- Issue date Mar 15, 2016
- International Business Machines Corporation
- Julien Sylvestre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression for semiconductor chip assembly
- Patent number 8,932,909
- Issue date Jan 13, 2015
- International Business Machines Corporation
- Julien Sylvestre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive applications using alkali silicate glass for electronics
- Patent number 8,637,980
- Issue date Jan 28, 2014
- Rockwell Collins, Inc.
- Nathan P. Lower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for providing near-hermetically coated integrated circuit as...
- Patent number 8,581,108
- Issue date Nov 12, 2013
- Rockwell Collins, Inc.
- Alan P. Boone
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating bonding structure
- Patent number 8,211,788
- Issue date Jul 3, 2012
- Taiwan TFT LCD Association
- Shyh-Ming Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package system with multiple die
- Patent number 8,067,825
- Issue date Nov 29, 2011
- Stats Chippac Ltd.
- Abelardo Jr. Hadap Advincula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of package height in a stacked die configuration
- Patent number 7,932,131
- Issue date Apr 26, 2011
- Spansion LLC
- Sally Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure
- Patent number 7,576,430
- Issue date Aug 18, 2009
- Taiwan TFT LCD Association
- Shyh-Ming Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HEAT DISSIPATION IN SEMICONDUCTOR DEVICES
- Publication number 20250006687
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zheng-Yong Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BACKSIDE THERMAL STRUCTURES FOR ENHANCED IC PACKAGES
- Publication number 20240203926
- Publication date Jun 20, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE AND SEMICONDUCTOR LIGHT EMITTIN...
- Publication number 20230335696
- Publication date Oct 19, 2023
- STANLEY ELECTRIC CO., LTD
- Keima KONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS FOR MANUFACTURING THE SAME
- Publication number 20230025412
- Publication date Jan 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Pin CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20220005780
- Publication date Jan 6, 2022
- Japan Display Inc.
- Kazuyuki YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BACKSIDE THERMAL STRUCTURES FOR ENHANCED IC PACKAGES
- Publication number 20210249375
- Publication date Aug 12, 2021
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20210242165
- Publication date Aug 5, 2021
- NITTO DENKO CORPORATION
- Ryota MITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20210111325
- Publication date Apr 15, 2021
- Samsung Electronics Co., Ltd.
- Myunghee KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20210098418
- Publication date Apr 1, 2021
- NITTO DENKO CORPORATION
- Ryota MITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFORMATION HANDLING SYSTEM LOW FORM FACTOR INTERFACE THERMAL MANAG...
- Publication number 20210013125
- Publication date Jan 14, 2021
- Dell Products L.P.
- Travis C. North
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH-DIELECTRIC ADHESIVE FILM
- Publication number 20200071570
- Publication date Mar 5, 2020
- ICH CO., LTD.
- Young Hun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, S...
- Publication number 20200075528
- Publication date Mar 5, 2020
- Hitachi Chemical Company, Ltd.
- Yuki KAWANA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
PHYSICAL QUANTITY MEASUREMENT DEVICE AND METHOD FOR MANUFACTURING S...
- Publication number 20190371759
- Publication date Dec 5, 2019
- Hitachi Automotive Systems, Ltd.
- Takuya AOYAGI
- G01 - MEASURING TESTING
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM
- Publication number 20190319003
- Publication date Oct 17, 2019
- DEXERIALS CORPORATION
- Takeshi MIYAKE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE, MECHANICAL QUANTITY MEASURING DEVICE, AND SEM...
- Publication number 20180202883
- Publication date Jul 19, 2018
- Hitachi Automotive Systems, Ltd.
- Hanae SHIMOKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE JOINING MATERIAL AND CONDUCTIVE JOINING STRUCTURE WHICH...
- Publication number 20180033760
- Publication date Feb 1, 2018
- NIPPON STEEL & SUMITOMO METAL CORPORATION
- Shinji ISHIKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOCOMPRESSION FOR SEMICONDUCTOR CHIP ASSEMBLY
- Publication number 20170309586
- Publication date Oct 26, 2017
- International Business Machines Corporation
- Julien Sylvestre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT-DISSIPATING STRUCTURE AND SEMICONDUCTOR MODULE USING SAME
- Publication number 20170236768
- Publication date Aug 17, 2017
- Hitachi, Ltd
- Takashi NAITO
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
Joint Material, and Jointed Body
- Publication number 20140287227
- Publication date Sep 25, 2014
- Hitachi, Ltd
- Motomune KODAMA
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
SEMICONDUCTOR POWER MODULE, PRODUCTION METHOD OF SEMICONDUCTOR POWE...
- Publication number 20140138850
- Publication date May 22, 2014
- NGK Spark Plug Co., Ltd.
- Yasushi Takayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION FOR SEMICONDUCTOR CHIP ASSEMBLY
- Publication number 20140131855
- Publication date May 15, 2014
- International Business Machines Corporation
- Julien Sylvestre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20100148364
- Publication date Jun 17, 2010
- Masahiro OKITA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD OF FABRICATING BONDING STRUCTURE
- Publication number 20090253233
- Publication date Oct 8, 2009
- TAIWAN TFT LCD ASSOCIATION
- Shyh-Ming Chang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Reduction of package height in a stacked die configuration
- Publication number 20090115033
- Publication date May 7, 2009
- Spansion LLC
- Sally Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTIPLE DIE
- Publication number 20090085181
- Publication date Apr 2, 2009
- Abelardo Hadap Advincula, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20080099916
- Publication date May 1, 2008
- TAIWAN TFT LCD ASSOCIATION
- Shyh-Ming Chang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Dual die bonder for a semiconductor device and a method thereof
- Publication number 20030145939
- Publication date Aug 7, 2003
- Seung Chul Ahn
- H01 - BASIC ELECTRIC ELEMENTS

Molybdenum [Mo] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Hybrid backside thermal structures for enhanced IC packages

Electronic device and manufacturing method of electronic device

Manufacturing method for semiconductor device

Display module and manufacturing method thereof

Sheet and composite sheet

Manufacturing method for semiconductor device

Anisotropic conductive film

High-dielectric adhesive film

Metal paste for joints, assembly, production method for assembly, s...

Metal paste and use thereof for joining components

Information handling system low form factor interface thermal manag...

Contact structures with porous networks for solder connections, and...

Sintering pastes with high metal loading for semiconductor die atta...

Thermal bonding sheet and thermal bonding sheet with dicing tape

Thermal bonding sheet and thermal bonding sheet with dicing tape

Semiconductor device, mechanical quantity measuring device, and sem...

Heat-dissipating structure and semiconductor module using same

Thermocompression for semiconductor chip assembly

Thermocompression for semiconductor chip assembly

Method for bonding substrates

Joint material, and jointed body

Solder joint structure, power module, power module substrate with h...

Thermocompression for semiconductor chip assembly

Thermocompression for semiconductor chip assembly

Adhesive applications using alkali silicate glass for electronics

Method for providing near-hermetically coated integrated circuit as...

Method of fabricating bonding structure

Integrated circuit package system with multiple die

Reduction of package height in a stacked die configuration

Bonding structure

Patents Applicationslast 30 patents

HEAT DISSIPATION IN SEMICONDUCTOR DEVICES

HYBRID BACKSIDE THERMAL STRUCTURES FOR ENHANCED IC PACKAGES

SEMICONDUCTOR LIGHT EMITTING DEVICE AND SEMICONDUCTOR LIGHT EMITTIN...

SEMICONDUCTOR STRUCTURES AND METHODS FOR MANUFACTURING THE SAME

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

HYBRID BACKSIDE THERMAL STRUCTURES FOR ENHANCED IC PACKAGES

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

DISPLAY MODULE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

INFORMATION HANDLING SYSTEM LOW FORM FACTOR INTERFACE THERMAL MANAG...

HIGH-DIELECTRIC ADHESIVE FILM

METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, S...

PHYSICAL QUANTITY MEASUREMENT DEVICE AND METHOD FOR MANUFACTURING S...

ANISOTROPIC CONDUCTIVE FILM

SEMICONDUCTOR DEVICE, MECHANICAL QUANTITY MEASURING DEVICE, AND SEM...

CONDUCTIVE JOINING MATERIAL AND CONDUCTIVE JOINING STRUCTURE WHICH...

THERMOCOMPRESSION FOR SEMICONDUCTOR CHIP ASSEMBLY

HEAT-DISSIPATING STRUCTURE AND SEMICONDUCTOR MODULE USING SAME

Joint Material, and Jointed Body

SEMICONDUCTOR POWER MODULE, PRODUCTION METHOD OF SEMICONDUCTOR POWE...

THERMOCOMPRESSION FOR SEMICONDUCTOR CHIP ASSEMBLY

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

METHOD OF FABRICATING BONDING STRUCTURE

Reduction of package height in a stacked die configuration

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTIPLE DIE

BONDING STRUCTURE AND METHOD OF FABRICATING THE SAME

Dual die bonder for a semiconductor device and a method thereof