Monolayer substrate

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H01L2924/15165

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/15165Monolayer substrate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bond pad connection layout
- Patent number 11,876,068
- Issue date Jan 16, 2024
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad connection layout
- Patent number 11,502,053
- Issue date Nov 15, 2022
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 11,031,310
- Issue date Jun 8, 2021
- QUALCOMM Incorporated
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating base for semicondu...
- Patent number 10,916,449
- Issue date Feb 9, 2021
- Mediatek Inc.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 10,903,151
- Issue date Jan 26, 2021
- Advanced Semiconductor Engineering, Inc.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating base for semicondu...
- Patent number 10,573,536
- Issue date Feb 25, 2020
- Mediatek Inc.
- Wen-Sung Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic elements with post-assembly planarization
- Patent number 10,559,494
- Issue date Feb 11, 2020
- Tessera, Inc.
- Vage Oganesian
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Implantable electrode array assembly including a carrier with packa...
- Patent number 10,525,258
- Issue date Jan 7, 2020
- Stryker Corporation
- Robert A. Brindley
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Three dimensional device integration method and integrated device
- Patent number 10,366,962
- Issue date Jul 30, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device package and methods of packaging thereof
- Patent number 10,297,583
- Issue date May 21, 2019
- Infineon Technologies AG
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating base for semicondu...
- Patent number 10,236,187
- Issue date Mar 19, 2019
- Mediatek Inc.
- Wen-Sung Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 10,112,824
- Issue date Oct 30, 2018
- Rohm Co., Ltd.
- Yuichi Nakao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and method for fabricating base for semicondu...
- Patent number 10,115,604
- Issue date Oct 30, 2018
- Mediatek Inc.
- Wen-Sung Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor component support and semiconductor device
- Patent number 10,068,821
- Issue date Sep 4, 2018
- Nichia Corporation
- Takeaki Shirase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for adhesive control between a substrate and a die
- Patent number 10,056,294
- Issue date Aug 21, 2018
- Maxim Integrated Products, Inc.
- Vivek S. Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic elements with post-assembly planarization
- Patent number 9,966,303
- Issue date May 8, 2018
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an implantable electrode array by forming p...
- Patent number 9,950,154
- Issue date Apr 24, 2018
- Stryker Corporation
- Robert Brindley
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Semiconductor package and method for fabricating base for semicondu...
- Patent number 9,922,844
- Issue date Mar 20, 2018
- Mediatek Inc.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for fabricating the same
- Patent number 9,899,284
- Issue date Feb 20, 2018
- QUALCOMM Incorporated
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Occam process for components having variations in part dimensions
- Patent number 9,894,771
- Issue date Feb 13, 2018
- Joseph Charles Fjelstad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip, face-up and face-down centerbond memory wirebond assemblies
- Patent number 9,806,017
- Issue date Oct 31, 2017
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implantable electrode array assembly including a carrier with embed...
- Patent number 9,770,582
- Issue date Sep 26, 2017
- Stryker Corporation
- Robert Brindley
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Microelectronic elements with post-assembly planarization
- Patent number 9,659,812
- Issue date May 23, 2017
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a semiconductor die having redistri...
- Patent number 9,633,951
- Issue date Apr 25, 2017
- Infineon Technologies Americas Corp.
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional device integration method and integrated device
- Patent number 9,564,414
- Issue date Feb 7, 2017
- ZIPTRONIX, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RFID label technique
- Patent number 9,495,632
- Issue date Nov 15, 2016
- Avery Dennison Corporation
- Alan Green
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device including a semiconductor element and a fixed...
- Patent number 9,437,520
- Issue date Sep 6, 2016
- Toyota Jidosha Kabushiki Kaisha
- Norimune Orimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional device integration method and integrated device
- Patent number 9,431,368
- Issue date Aug 30, 2016
- Ziptronix, Inc.
- Paul M. Enquist
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic modules
- Patent number 9,425,069
- Issue date Aug 23, 2016
- Charles Stark Draper Laboratory, Inc.
- Livia M. Racz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RFID tags and processes for producing RFID tags
- Patent number 9,418,328
- Issue date Aug 16, 2016
- Ruizhang Technology Limited Company
- Glenn W. Gengel
- D10 - INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEX...

Patents Applicationslast 30 patents

Information Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20250079391
- Publication date Mar 6, 2025
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBST...
- Publication number 20240222288
- Publication date Jul 4, 2024
- Intel Corporation
- David Shia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE INCLU...
- Publication number 20240194640
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- SEONGHO YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED...
- Publication number 20240178146
- Publication date May 30, 2024
- Intel Corporation
- Benjamin T. Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD CONNECTION LAYOUT
- Publication number 20240145425
- Publication date May 2, 2024
- Lodestar Licensing Group LLC
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CONNECTION STRUCTURE, ROOM-TEMPERATURE FLIP CONNECTION STRUCTU...
- Publication number 20240145428
- Publication date May 2, 2024
- Sony Semiconductor Solutions Corporation
- KAZUHIDE TERAHATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240030183
- Publication date Jan 25, 2024
- Resonac Corporation
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WINDOW BALL GRID ARRAY (WBGA) PACKAGE
- Publication number 20230361073
- Publication date Nov 9, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230361017
- Publication date Nov 9, 2023
- Samsung Electronics Co., Ltd.
- HYEONJEONG HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD CONNECTION LAYOUT
- Publication number 20230026960
- Publication date Jan 26, 2023
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD CONNECTION LAYOUT
- Publication number 20220165701
- Publication date May 26, 2022
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER...
- Publication number 20200211931
- Publication date Jul 2, 2020
- RENESAS ELECTRONICS CORPORATION
- Masahiro MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDU...
- Publication number 20200152479
- Publication date May 14, 2020
- MEDIATEK INC.
- Wen-Sung Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190363040
- Publication date Nov 28, 2019
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Implantable Electrode Array Assembly Including A Carrier With Packa...
- Publication number 20180296823
- Publication date Oct 18, 2018
- Stryker Corporation
- Robert A. Brindley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION
- Publication number 20180254213
- Publication date Sep 6, 2018
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDU...
- Publication number 20180166297
- Publication date Jun 14, 2018
- MEDIATEK INC.
- Wen-Sung HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20180158746
- Publication date Jun 7, 2018
- QUALCOMM Incorporated
- Mou-Shiung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP, FACE-UP AND FACE-DOWN CENTERBOND MEMORY WIREBOND ASSEMBLIES
- Publication number 20180025967
- Publication date Jan 25, 2018
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHIOD OF MANUFACTURING AN IMPLANTABLE ELECTRODE ARRAY BY FORMING...
- Publication number 20180008818
- Publication date Jan 11, 2018
- Stryker Corporation
- Robert Brindley
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION
- Publication number 20170256443
- Publication date Sep 7, 2017
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDU...
- Publication number 20150264814
- Publication date Sep 17, 2015
- MEDIATEK INC.
- Wen-Sung HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON...
- Publication number 20150076692
- Publication date Mar 19, 2015
- Intel Corporation
- Weng Khoon Mong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT ASSEMBLY USING A TEMPORARY ATTACH MATERIAL
- Publication number 20140374925
- Publication date Dec 25, 2014
- Elizabeth A. LOGAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPLIANT INTERCONNECTS IN WAFERS
- Publication number 20140342503
- Publication date Nov 20, 2014
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLANTABLE ELECTRODE ARRAY ASSEMBLY INCLUDING A CARRIER WITH EMBED...
- Publication number 20140343643
- Publication date Nov 20, 2014
- Stryker Corporation
- Robert Brindley
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
QFN/SON-Compatible Package
- Publication number 20140329362
- Publication date Nov 6, 2014
- Andreas Alfred Hase
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140284731
- Publication date Sep 25, 2014
- ROHM CO., LTD.
- Yuichi NAKAO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20140225242
- Publication date Aug 14, 2014
- United Test & Assembly Center Ltd.
- Chin Hock TOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Confining Conductive Bump Materi...
- Publication number 20140225257
- Publication date Aug 14, 2014
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS

Monolayer substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bond pad connection layout

Bond pad connection layout

Chip package

Semiconductor package and method for fabricating base for semicondu...

Semiconductor device package and method of manufacturing the same

Semiconductor package and method for fabricating base for semicondu...

Microelectronic elements with post-assembly planarization

Implantable electrode array assembly including a carrier with packa...

Three dimensional device integration method and integrated device

Semiconductor device package and methods of packaging thereof

Semiconductor package and method for fabricating base for semicondu...

Semiconductor device

Semiconductor package and method for fabricating base for semicondu...

Semiconductor component support and semiconductor device

Techniques for adhesive control between a substrate and a die

Microelectronic elements with post-assembly planarization

Method of manufacturing an implantable electrode array by forming p...

Semiconductor package and method for fabricating base for semicondu...

Chip package and method for fabricating the same

Occam process for components having variations in part dimensions

Flip-chip, face-up and face-down centerbond memory wirebond assemblies

Implantable electrode array assembly including a carrier with embed...

Microelectronic elements with post-assembly planarization

Semiconductor package including a semiconductor die having redistri...

Three dimensional device integration method and integrated device

RFID label technique

Semiconductor device including a semiconductor element and a fixed...

Three dimensional device integration method and integrated device

Electronic modules

RFID tags and processes for producing RFID tags

Patents Applicationslast 30 patents

PACKAGING STRUCTURE AND PACKAGING METHOD

SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBST...

SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE INCLU...

INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED...

BOND PAD CONNECTION LAYOUT

FLIP CONNECTION STRUCTURE, ROOM-TEMPERATURE FLIP CONNECTION STRUCTU...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING WINDOW BALL GRID ARRAY (WBGA) PACKAGE

PACKAGE AND METHOD OF FABRICATING THE SAME

BOND PAD CONNECTION LAYOUT

BOND PAD CONNECTION LAYOUT

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER...

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDU...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

Implantable Electrode Array Assembly Including A Carrier With Packa...

MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDU...

CHIP PACKAGE

FLIP-CHIP, FACE-UP AND FACE-DOWN CENTERBOND MEMORY WIREBOND ASSEMBLIES

METHIOD OF MANUFACTURING AN IMPLANTABLE ELECTRODE ARRAY BY FORMING...

MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDU...

FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON...

COMPONENT ASSEMBLY USING A TEMPORARY ATTACH MATERIAL

COMPLIANT INTERCONNECTS IN WAFERS

IMPLANTABLE ELECTRODE ARRAY ASSEMBLY INCLUDING A CARRIER WITH EMBED...

QFN/SON-Compatible Package

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

Semiconductor Device and Method of Confining Conductive Bump Materi...