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H05K2201/09118
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ELECTRICITY
H05
Electric techniques
H05K
PRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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Indexing scheme relating to printed circuits covered by H05K1/00
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H05K2201/09118
Moulded substrate
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Patents Grants
last 30 patents
Information
Patent Grant
Packaged semiconductor device
Patent number
11,955,479
Issue date
Apr 9, 2024
Texas Instruments Incorporated
Yiqi Tang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
Patent number
11,942,389
Issue date
Mar 26, 2024
Qorvo US, Inc.
Julio C. Costa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
Patent number
11,842,939
Issue date
Dec 12, 2023
Qorvo US, Inc.
Julio C. Costa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Imaging device for connection with a circuit element
Patent number
11,800,249
Issue date
Oct 24, 2023
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Yuta Momiuchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Component carrier for arranging electrical components on a circuit...
Patent number
11,770,896
Issue date
Sep 26, 2023
HARTING AG
Thomas Hess
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for manufacturing a circuit having a lamination layer using...
Patent number
11,744,022
Issue date
Aug 29, 2023
KYOCERA AVX Components (San Diego), Inc.
Seung Hyuk Choi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
Patent number
11,676,878
Issue date
Jun 13, 2023
Qorvo US, Inc.
Julio C. Costa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Adapter board and method for making adapter board
Patent number
11,665,820
Issue date
May 30, 2023
QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
Man-Zhi Peng
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Mechanical support within moulded chip package
Patent number
11,659,663
Issue date
May 23, 2023
Murata Manufacturing Co., Ltd.
Kimmo Kaija
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
Patent number
11,646,242
Issue date
May 9, 2023
Qorvo US, Inc.
Julio C. Costa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Illumination assembly including thermal energy management
Patent number
11,619,376
Issue date
Apr 4, 2023
INNOTEC, CORP.
Thomas J. Veenstra
F21 - LIGHTING
Information
Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
Patent number
11,621,207
Issue date
Apr 4, 2023
Qorvo US, Inc.
Julio C. Costa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing an electromechanical structure and an arra...
Patent number
11,516,920
Issue date
Nov 29, 2022
TACTOTEK OY
Mikko Heikkinen
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Application specific electronics packaging systems, methods and dev...
Patent number
11,503,718
Issue date
Nov 15, 2022
Molex, LLC
Marko Spiegel
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Camera module and molded circuit board assembly and manufacturing m...
Patent number
11,477,354
Issue date
Oct 18, 2022
NINGBO SUNNY OPOTECH CO., LTD.
Mingzhu Wang
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
Patent number
11,476,177
Issue date
Oct 18, 2022
Qorvo US, Inc.
Julio C. Costa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
Patent number
11,443,999
Issue date
Sep 13, 2022
Qorvo US, Inc.
Julio C. Costa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
Patent number
11,410,904
Issue date
Aug 9, 2022
Qorvo US, Inc.
Julio C. Costa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Component carrier for electrical/electronic parts for attachment in...
Patent number
11,401,740
Issue date
Aug 2, 2022
Kiekert AG
Sascha Maciolowski
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
System for manufacturing an electromechanical structure
Patent number
11,406,021
Issue date
Aug 2, 2022
TACTOTEK OY
Mikko Heikkinen
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
System for manufacturing an electromechanical structure
Patent number
11,363,720
Issue date
Jun 14, 2022
TACTOTEK OY
Mikko Heikkinen
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Molded interconnect device
Patent number
11,357,112
Issue date
Jun 7, 2022
Molex, LLC
Tsuey Choo Chang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
Patent number
11,328,974
Issue date
May 10, 2022
Qorvo US, Inc.
Julio C. Costa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
Patent number
11,296,003
Issue date
Apr 5, 2022
Qorvo US, Inc.
Julio C. Costa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Compact microelectronic integrated gas sensor
Patent number
11,231,386
Issue date
Jan 25, 2022
STMicroelectronics Pte Ltd
Jerome Teysseyre
G01 - MEASURING TESTING
Information
Patent Grant
Device and method for molding an FPC and a plastic part
Patent number
11,224,128
Issue date
Jan 11, 2022
DONGGUAN LUXSHARE PRECISION INDUSTRY CO. LTD.
Jiaoping Cao
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
Patent number
11,217,501
Issue date
Jan 4, 2022
Qorvo US, Inc.
Julio C. Costa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing a circuit having a lamination layer using...
Patent number
11,191,165
Issue date
Nov 30, 2021
Ethertronics, Inc.
Seung Hyuk Choi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multi-planar circuit board having reduced z-height
Patent number
11,172,581
Issue date
Nov 9, 2021
Intel Corporation
Eng Huat Goh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
Patent number
11,158,559
Issue date
Oct 26, 2021
Qorvo US, Inc.
Julio C. Costa
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
BASE MEMBER, ELECTRONIC DEVICE, AND STRUCTURE
Publication number
20240032190
Publication date
Jan 25, 2024
Canon Kabushiki Kaisha
KOICHI ODAGAKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC APPARATUS
Publication number
20230199961
Publication date
Jun 22, 2023
Industrial Technology Research Institute
Yu-Lin Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPONENT CARRIER FOR ARRANGING ELECTRICAL COMPONENTS ON A CIRCUIT...
Publication number
20230061125
Publication date
Mar 2, 2023
HARTING AG
Thomas HESS
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR MANUFACTURING WIRING BOARD, WIRING BOARD, METHOD FOR MAN...
Publication number
20230007781
Publication date
Jan 5, 2023
FUJIKURA LTD.
Kazutoshi Koshimizu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED CIRCUIT BOARD
Publication number
20220338346
Publication date
Oct 20, 2022
LG Innotek Co., Ltd.
Il Sik NAM
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF MAKING A MOLDED INTERCONNECT DEVICE
Publication number
20220279656
Publication date
Sep 1, 2022
Molex, LLC
Tsuey Choo CHANG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PATTERNED CONDUCTIVE ARTICLE
Publication number
20220167499
Publication date
May 26, 2022
Raymond P. Johnston
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MECHANICAL SUPPORT WITHIN MOULDED CHIP PACKAGE
Publication number
20220110213
Publication date
Apr 7, 2022
Murata Manufacturing Co., Ltd.
Kimmo KAIJA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
IMAGE SENSOR PACKAGES
Publication number
20220093673
Publication date
Mar 24, 2022
Samsung Electronics Co., Ltd.
Raehyung DO
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
Method for Manufacturing a Circuit Having a Lamination Layer Using...
Publication number
20220087029
Publication date
Mar 17, 2022
Ethertronics, Inc.
Seung Hyuk Choi
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Application
ADAPTER BOARD AND METHOD FOR MAKING ADAPTER BOARD
Publication number
20220087020
Publication date
Mar 17, 2022
QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
MAN-ZHI PENG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
THERMALLY ENHANCED SEMICONDUCTOR PACKAGE WITH AT LEAST ONE HEAT EXT...
Publication number
20210296199
Publication date
Sep 23, 2021
Qorvo US, Inc.
Julio C. Costa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE AND METHOD FOR MOLDING AN FPC AND A PLASTIC PART
Publication number
20210298179
Publication date
Sep 23, 2021
DONGGUAN LUXSHARE PRECISION INDUSTRY CO. LTD.
Jiaoping CAO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ADAPTER BOARD AND METHOD FOR MAKING ADAPTOR BOARD
Publication number
20210235581
Publication date
Jul 29, 2021
QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
MAN-ZHI PENG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
APPLICATION SPECIFIC ELECTRONICS PACKAGING SYSTEMS, METHODS AND DEV...
Publication number
20210144861
Publication date
May 13, 2021
Molex, LLC
Marko SPIEGEL
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
APPLICATION SPECIFIC ELECTRONICS PACKAGING SYSTEMS, METHODS AND DEV...
Publication number
20200352032
Publication date
Nov 5, 2020
Molex, LLC
Marko SPIEGEL
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
RESIN MOLDED SUBSTRATE AND MOUNTING STRUCTURE FOR CAPACITOR
Publication number
20200227206
Publication date
Jul 16, 2020
FANUC CORPORATION
Yuuki INOUE
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MICRO POWER DISTRIBUTION BOXES AND METHODS OF MANUFACTURING SAME US...
Publication number
20200196451
Publication date
Jun 18, 2020
Molex, LLC
Victor ZADEREJ
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
THERMALLY ENHANCED PACKAGE AND PROCESS FOR MAKING THE SAME
Publication number
20200176347
Publication date
Jun 4, 2020
Qorvo US, Inc.
Julio C. Costa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PACKAGED SEMICONDUCTOR DEVICE
Publication number
20200066716
Publication date
Feb 27, 2020
TEXAS INSTRUMENTS INCORPORATED
YIQI TANG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CONTROL UNIT
Publication number
20200045823
Publication date
Feb 6, 2020
Jaguar Land Rover Limited
Ashutosh TOMAR
B60 - VEHICLES IN GENERAL
Information
Patent Application
Method for Manufacturing a Circuit Having a Lamination Layer Using...
Publication number
20200045827
Publication date
Feb 6, 2020
Ethertronics, Inc.
Seung Hyuk Choi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
APPLICATION SPECIFIC ELECTRONICS PACKAGING SYSTEMS, METHODS AND DEV...
Publication number
20200022265
Publication date
Jan 16, 2020
Molex, LLC
Marko SPIEGEL
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PACKAGED SEMICONDUCTOR DEVICE
Publication number
20190363080
Publication date
Nov 28, 2019
TEXAS INSTRUMENTS INCORPORATED
YIQI TANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOLDED INTERCONNECT SUBSTRATE FOR A CABLE ASSEMBLY
Publication number
20190273342
Publication date
Sep 5, 2019
TE Connectivity Corporation
Gustaf Emil Dill
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MOLDED INTERCONNECT DEVICE AND METHOD OF MAKING SAME
Publication number
20190166698
Publication date
May 30, 2019
Molex, LLC
Tsuey Choo CHANG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
APPARATUS FOR CARRYING OUT A MANUFACTURING METHOD ON AN ELECTRO CHE...
Publication number
20190098763
Publication date
Mar 28, 2019
TactoTek Oy
Mikko Heikkinen
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
PCB Assembly with Molded Matrix Core
Publication number
20190075655
Publication date
Mar 7, 2019
Apple Inc.
Albert Wang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR MANUFACTURING AN ELECTROMECHANICAL STRUCTURE AND AN ARRA...
Publication number
20190029118
Publication date
Jan 24, 2019
TactoTek Oy
Mikko Heikkinen
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
ARRAYED EMBEDDED MAGNETIC COMPONENTS AND METHODS
Publication number
20190006077
Publication date
Jan 3, 2019
RADIAL ELECTRONICS, INC
James E. Quilici
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR