Mounted network component having plural terminals

Industry

CPC
H05K2201/10045

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10045Mounted network component having plural terminals

Industries

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board
- Patent number 11,653,441
- Issue date May 16, 2023
- STMicroelectronics (Alps) SAS
- Julien Didion
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Microelectronic assemblies having front end under embedded radio fr...
- Patent number 11,424,195
- Issue date Aug 23, 2022
- Intel Corporation
- Eliav Shaul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated readout card
- Patent number 11,411,159
- Issue date Aug 9, 2022
- Google LLC
- Theodore Charles White
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Printed circuit board and optical transceiver with the printed circ...
- Patent number 11,057,986
- Issue date Jul 6, 2021
- Lumentum Japan, Inc.
- Osamu Kagaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite electronic component, composite electronic component pack...
- Patent number 10,991,513
- Issue date Apr 27, 2021
- Taiyo Yuden Co., Ltd.
- Shin Aida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip capacitor, circuit assembly, and electronic device
- Patent number 10,593,480
- Issue date Mar 17, 2020
- Rohm Co., Ltd.
- Hiroki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation mechanism of controller for circuit breaker
- Patent number 10,566,716
- Issue date Feb 18, 2020
- LSIS Co., Ltd.
- Youngkook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and optical transceiver with the printed circ...
- Patent number 10,470,293
- Issue date Nov 5, 2019
- Lumentum Japan, Inc.
- Osamu Kagaya
- G02 - OPTICS
Information Patent Grant
Connection device
- Patent number 10,127,173
- Issue date Nov 13, 2018
- BELIMO Holding AG
- Peter Schmidlin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip capacitor, circuit assembly, and electronic device
- Patent number 10,026,557
- Issue date Jul 17, 2018
- Rohm Co., Ltd.
- Hiroki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate and method for manufacturing the same
- Patent number 9,955,591
- Issue date Apr 24, 2018
- Ibiden Co., Ltd.
- Mitsuhiro Tomikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resistor, method of manufacturing the same, and board having the same
- Patent number 9,754,705
- Issue date Sep 5, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Hae In Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Networking packages based on interposers
- Patent number 9,686,865
- Issue date Jun 20, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite electronic component and board having the same
- Patent number 9,633,779
- Issue date Apr 25, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Young Ghyu Ahn
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Small form factor stacked electrical passive devices that reduce th...
- Patent number 9,215,807
- Issue date Dec 15, 2015
- Apple Inc.
- Shawn X. Arnold
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mount devices with minimum lead inductance and methods of m...
- Patent number 8,493,744
- Issue date Jul 23, 2013
- TDK Corporation
- Qiang Richard Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite module
- Patent number 8,461,463
- Issue date Jun 11, 2013
- Murata Manufacturing Co., Ltd.
- Noboru Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector assembly
- Patent number 8,433,839
- Issue date Apr 30, 2013
- Hon Hai Precision Industry Co., Ltd.
- Zheng-Heng Sun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shaped integrated passives
- Patent number 8,208,266
- Issue date Jun 26, 2012
- AVX Corporation
- Gheorghe Korony
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor component with surface mountable devices and method f...
- Patent number 8,071,433
- Issue date Dec 6, 2011
- Infineon Technologies AG
- Erich Syri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic capacitor
- Patent number 7,889,509
- Issue date Feb 15, 2011
- NGK Spark Plug Co., Ltd.
- Kazuhiro Urashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor component with surface mountable devices and method f...
- Patent number 7,804,178
- Issue date Sep 28, 2010
- Infineon Technologies AG
- Erich Syri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and capacitor
- Patent number 7,742,314
- Issue date Jun 22, 2010
- NGK Spark Plug Co., Ltd.
- Kazuhiro Urashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded type multifunctional integrated structure and method for m...
- Patent number 7,715,164
- Issue date May 11, 2010
- Inpaq Technology Co., Ltd.
- Chien-Hao Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mount composite electronic component and method for manufac...
- Patent number 7,601,920
- Issue date Oct 13, 2009
- Koa Corporation
- Koji Fujimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Technique for enhancing circuit density and performance
- Patent number 7,515,434
- Issue date Apr 7, 2009
- Nortel Networks Limited
- Aneta Wyrzykowska
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Amplifier with feedback bridge
- Patent number 7,417,498
- Issue date Aug 26, 2008
- Alcatel
- Dirk Wiegner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fixed network resistor
- Patent number 7,227,443
- Issue date Jun 5, 2007
- Rohm Co., Ltd.
- Takahiro Kuriyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optoelectronic transceiver
- Patent number 7,217,043
- Issue date May 15, 2007
- Infineon Technologies Fiber Optics GmbH
- Nikolaus Schunk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mounting chip network component
- Patent number 7,154,373
- Issue date Dec 26, 2006
- Minowa KOA Inc.
- Eiji Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240032196
- Publication date Jan 25, 2024
- GOERTEK TECHNOLOGY CO., LTD.
- Kenichiro KODAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL MODULE ASSEMBLY, OPTICAL MODULE, PACKAGE FOR OPTICAL MODULE...
- Publication number 20230380057
- Publication date Nov 23, 2023
- Sumitomo Electric Industries, Ltd.
- Taichi MISAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ARCHITECTURE SUPPORTING MULTIPLE COMPONENT SUPPLIERS
- Publication number 20230345627
- Publication date Oct 26, 2023
- Microsoft Technology Licensing, LLC
- Fatemeh ZOLFAGHAR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TECHNOLOGIES FOR RADIO FREQUENCY OPTIMIZED INTERCONNECTS FOR A QUAN...
- Publication number 20230210023
- Publication date Jun 29, 2023
- Intel Corporation
- Hubert C. George
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
NETWORK SWITCH INCLUDING TRANSMISSION PORTS WHICH ARE NOT ARRANGED...
- Publication number 20230140400
- Publication date May 4, 2023
- Accton Technology Corporation
- Kuan-Tse Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220151056
- Publication date May 12, 2022
- STMicroelectronics (Alps) SAS
- Julien Didion
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CHIP CAPACITOR, CIRCUIT ASSEMBLY, AND ELECTRONIC DEVICE
- Publication number 20180323011
- Publication date Nov 8, 2018
- Rohm Co., Ltd.
- Hiroki YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION MECHANISM OF CONTROLLER FOR CIRCUIT BREAKER
- Publication number 20180191091
- Publication date Jul 5, 2018
- LSIS CO., LTD
- Youngkook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Networking Packages Based on Interposers
- Publication number 20150289376
- Publication date Oct 8, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Han LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SMALL FORM FACTOR STACKED ELECTRICAL PASSIVE DEVICES THAT REDUCE TH...
- Publication number 20140085851
- Publication date Mar 27, 2014
- Apple Inc.
- Shawn X. ARNOLD
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTOR ASSEMBLY
- Publication number 20130042040
- Publication date Feb 14, 2013
- HON HAI Precision Industry CO., LTD.
- Zheng-Heng Sun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Networking Packages Based on Interposers
- Publication number 20120147567
- Publication date Jun 14, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Han LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE MODULE
- Publication number 20110182039
- Publication date Jul 28, 2011
- Murata Manufacturing Co., Ltd.
- Noboru KATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Component with Surface Mountable Devices and Method f...
- Publication number 20100323479
- Publication date Dec 23, 2010
- INFINEON TECHNOLOGIES AG
- Erich Syri
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic Circuit Package
- Publication number 20090189269
- Publication date Jul 30, 2009
- Lap-Wai Lydia Leung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Embedded type multifunctional integrated structure and method for m...
- Publication number 20090130369
- Publication date May 21, 2009
- Chien-Hao Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Component
- Publication number 20080303149
- Publication date Dec 11, 2008
- MINOWA KOA INC.
- Toshiharu Takayama
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SHAPED INTEGRATED PASSIVES
- Publication number 20080298031
- Publication date Dec 4, 2008
- AVX Corporation
- Gheorghe Korony
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Surface mount devices with minimum lead inductance and methods of m...
- Publication number 20080246157
- Publication date Oct 9, 2008
- Qiang Richard Chen
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CHIP NETWORK RESISTOR CONTACTING PCB THROUGH SOLDER BALLS AND SEMIC...
- Publication number 20080136580
- Publication date Jun 12, 2008
- Samsung Electronics Co., Ltd.
- Hyo-Jae BANG
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor Component with Surface Mountable Devices and Method f...
- Publication number 20070262433
- Publication date Nov 15, 2007
- INFINEON TECHNOLOGIES AG
- Erich Syri
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Surface mount composite electronic component and method for manufac...
- Publication number 20070096864
- Publication date May 3, 2007
- Koji Fujimoto
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Wiring board and capacitor
- Publication number 20070076392
- Publication date Apr 5, 2007
- NGK SPARK PLUG CO., LTD.
- Kazuhiro Urashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ceramic capacitor
- Publication number 20070064375
- Publication date Mar 22, 2007
- NGK SPARK PLUG CO., LTD.
- Kazuhiro Urashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Amplifier with feedback bridge
- Publication number 20070013442
- Publication date Jan 18, 2007
- ALCATEL
- Dirk Wiegner
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Technique for enhancing circuit density and performance
- Publication number 20060133056
- Publication date Jun 22, 2006
- Aneta Wyrzykowska
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Optoelectronic transceiver
- Publication number 20060072881
- Publication date Apr 6, 2006
- Infineon Technologies Fiber Optics GmbH
- Nikolaus Schunk
- G02 - OPTICS
Information Patent Application
Electronic part-containing elements, electronic devices and product...
- Publication number 20060017133
- Publication date Jan 26, 2006
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fixed network resistor
- Publication number 20050285713
- Publication date Dec 29, 2005
- Rohm Co., Ltd.
- Takahiro Kuriyama
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Surface mounting chip network component
- Publication number 20050253681
- Publication date Nov 17, 2005
- Eiji Kobayashi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Mounted network component having plural terminals

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board

Microelectronic assemblies having front end under embedded radio fr...

Integrated readout card

Printed circuit board and optical transceiver with the printed circ...

Composite electronic component, composite electronic component pack...

Chip capacitor, circuit assembly, and electronic device

Isolation mechanism of controller for circuit breaker

Printed circuit board and optical transceiver with the printed circ...

Connection device

Chip capacitor, circuit assembly, and electronic device

Circuit substrate and method for manufacturing the same

Resistor, method of manufacturing the same, and board having the same

Networking packages based on interposers

Composite electronic component and board having the same

Small form factor stacked electrical passive devices that reduce th...

Surface mount devices with minimum lead inductance and methods of m...

Composite module

Connector assembly

Shaped integrated passives

Semiconductor component with surface mountable devices and method f...

Ceramic capacitor

Semiconductor component with surface mountable devices and method f...

Wiring board and capacitor

Embedded type multifunctional integrated structure and method for m...

Surface mount composite electronic component and method for manufac...

Technique for enhancing circuit density and performance

Amplifier with feedback bridge

Fixed network resistor

Optoelectronic transceiver

Surface mounting chip network component

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

OPTICAL MODULE ASSEMBLY, OPTICAL MODULE, PACKAGE FOR OPTICAL MODULE...

CIRCUIT BOARD ARCHITECTURE SUPPORTING MULTIPLE COMPONENT SUPPLIERS

TECHNOLOGIES FOR RADIO FREQUENCY OPTIMIZED INTERCONNECTS FOR A QUAN...

NETWORK SWITCH INCLUDING TRANSMISSION PORTS WHICH ARE NOT ARRANGED...

PRINTED CIRCUIT BOARD

CHIP CAPACITOR, CIRCUIT ASSEMBLY, AND ELECTRONIC DEVICE

ISOLATION MECHANISM OF CONTROLLER FOR CIRCUIT BREAKER

Networking Packages Based on Interposers

SMALL FORM FACTOR STACKED ELECTRICAL PASSIVE DEVICES THAT REDUCE TH...

CONNECTOR ASSEMBLY

Networking Packages Based on Interposers

COMPOSITE MODULE

Semiconductor Component with Surface Mountable Devices and Method f...

Electronic Circuit Package

Embedded type multifunctional integrated structure and method for m...

Electronic Component

SHAPED INTEGRATED PASSIVES

Surface mount devices with minimum lead inductance and methods of m...

CHIP NETWORK RESISTOR CONTACTING PCB THROUGH SOLDER BALLS AND SEMIC...

Semiconductor Component with Surface Mountable Devices and Method f...

Surface mount composite electronic component and method for manufac...

Wiring board and capacitor

Ceramic capacitor

Amplifier with feedback bridge

Technique for enhancing circuit density and performance

Optoelectronic transceiver

Electronic part-containing elements, electronic devices and product...

Fixed network resistor

Surface mounting chip network component