Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs

Industry

CPC
H01L23/40

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs

Industries

Patents Grantslast 30 patents

Information Patent Grant
Cooling assembly for a computer module
- Patent number 11,966,265
- Issue date Apr 23, 2024
- EKWB d.o.o.
- Joe Robey
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic power unit and semiconductor power module
- Patent number 11,967,536
- Issue date Apr 23, 2024
- SEMIKRON ELEKTRONIK GMBH CO., KG
- Valeriano Cardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controller with fan monitoring and control
- Patent number 11,968,811
- Issue date Apr 23, 2024
- Rockwell Automation Technologies, Inc.
- Michael S. Baran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,961,784
- Issue date Apr 16, 2024
- Mitsubishi Electric Corporation
- Arata Iizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit carrier arrangement and method for producing such a circuit...
- Patent number 11,961,785
- Issue date Apr 16, 2024
- Vitesco Technologies GmbH
- Jens Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress asymmetric dual side module
- Patent number 11,955,412
- Issue date Apr 9, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oscillator
- Patent number 11,949,379
- Issue date Apr 2, 2024
- Seiko Epson Corporation
- Norihito Matsukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress asymmetric dual side module
- Patent number 11,948,870
- Issue date Apr 2, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including sense insulated-gate bipolar transistor
- Patent number 11,942,531
- Issue date Mar 26, 2024
- Rohm Co., Ltd.
- Akihiro Hikasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for protecting a stack of electronic components and metho...
- Patent number 11,942,395
- Issue date Mar 26, 2024
- Ciena Corporation
- Raphael Beaupré-Laflamme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,935,813
- Issue date Mar 19, 2024
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive thermal management architecture for electronic devices
- Patent number 11,929,297
- Issue date Mar 12, 2024
- Hamilton Sundstrand Corporation
- Hebri Vijayendra Nayak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures
- Patent number 11,923,349
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Hui Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter
- Patent number 11,915,995
- Issue date Feb 27, 2024
- Fuji Electric Co., Ltd.
- Shun Fukuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a carrier, semiconductor chip packages...
- Patent number 11,915,999
- Issue date Feb 27, 2024
- Infineon Technologies AG
- Tomasz Naeve
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink fastener
- Patent number 11,901,265
- Issue date Feb 13, 2024
- Southco, Inc.
- Richard E. Schlack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computer housing
- Patent number 11,899,509
- Issue date Feb 13, 2024
- Apple Inc.
- Eugene A. Whang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Computer housing
- Patent number 11,899,511
- Issue date Feb 13, 2024
- Apple Inc.
- Eugene A. Whang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,901,263
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reusable holding component for heatsink
- Patent number 11,901,261
- Issue date Feb 13, 2024
- Illinois Tool Works Inc.
- Ming-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back plate assembly and electronic device
- Patent number 11,894,285
- Issue date Feb 6, 2024
- Tyco Electronics (Shanghai) Co., Ltd.
- Jiefeng Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling device
- Patent number 11,892,246
- Issue date Feb 6, 2024
- Fujitsu Limited
- Kento Ohga
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Imaging unit and imaging apparatus
- Patent number 11,887,839
- Issue date Jan 30, 2024
- Nikon Corporation
- Hirofumi Arima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,881,524
- Issue date Jan 23, 2024
- Sumitomo Electric Industries, Ltd.
- Hisato Michikoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including resin case having groove at corner t...
- Patent number 11,876,033
- Issue date Jan 16, 2024
- Mitsubishi Electric Corporation
- Takuro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor package having a negative standoff
- Patent number 11,862,541
- Issue date Jan 2, 2024
- Infineon Technologies AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power device, power device assembly, and related apparatus
- Patent number 11,862,531
- Issue date Jan 2, 2024
- Huawei Technologies Co., Ltd.
- Yankun Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cryostat suspended sample board
- Patent number 11,864,352
- Issue date Jan 2, 2024
- EQUAL 1 LABORATORIES IRELAND LIMITED
- Hans Haenlein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power conversion device having a clip to fix a plurality of switches
- Patent number 11,856,738
- Issue date Dec 26, 2023
- LG Innotek Co., Ltd
- Shin Young Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Housing for a power semiconductor module arrangement
- Patent number 11,856,718
- Issue date Dec 26, 2023
- Infineon Technologies AG
- Alexander Herbrandt
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240136251
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE AND METHOD F...
- Publication number 20240120255
- Publication date Apr 11, 2024
- Hitachi Energy Switzerland AG
- Dominik TRUESSEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electromagnetic Interference Shielding and Sealing for Spring Screw...
- Publication number 20240112980
- Publication date Apr 4, 2024
- NIO Technology (Anhui) Co., Ltd.
- Mohammad Reza Danesh Kadivar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20240113071
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE DEVICE
- Publication number 20240105546
- Publication date Mar 28, 2024
- Industrial Technology Research Institute
- Ji-Yuan Syu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR AN INTERLOCKING FEATURE ON A POWER MODULE
- Publication number 20240105547
- Publication date Mar 28, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Edward Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING A PRINTE...
- Publication number 20240105548
- Publication date Mar 28, 2024
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Uwe WALTRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK FOR A SEMICONDUCTOR SWITCHING DEVICE, AND SEMICONDUCTOR S...
- Publication number 20240087981
- Publication date Mar 14, 2024
- SIEMENS AKTIENGESELLSCHAFT
- Walter Apfelbacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND SYSTEM INCLUDING THE SAME
- Publication number 20240087982
- Publication date Mar 14, 2024
- SK HYNIX INC.
- Nam Hyeon CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A METHOD FOR COOLING AN OBJECT, A COOLING DEVICE AND USE OF A COOLI...
- Publication number 20240090185
- Publication date Mar 14, 2024
- Søren Imer STUBKIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chamfered Die of Semiconductor Package and Method for Forming the Same
- Publication number 20240088050
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20240079288
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Youngho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADER APPARATUS WITH MAGNETIC ATTACHMENTS ON PRINTED WIRING...
- Publication number 20240071863
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Charles E. Siko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VEHICLE POWER MODULE
- Publication number 20240071858
- Publication date Feb 29, 2024
- Hyundai Motor Company
- Tae Hwa KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System, Device and Methods of Manufacture
- Publication number 20240071825
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTER HOUSING
- Publication number 20240053804
- Publication date Feb 15, 2024
- Apple Inc.
- Eugene A. Whang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIRING BOARD
- Publication number 20240049384
- Publication date Feb 8, 2024
- DAI NIPPON PRINTING CO., LTD.
- Hiroki FURUSHOU
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR FABRICATING A SEMICONDUCTOR MODULE
- Publication number 20240040689
- Publication date Feb 1, 2024
- INFINEON TECHNOLOGIES AG
- Ramdas Rangnath Ugale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE COMPRISING AT LEAST ONE SEMICONDUCTOR ELEMENT
- Publication number 20240038618
- Publication date Feb 1, 2024
- SIEMENS AKTIENGESELLSCHAFT
- Stefan Pfefferlein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERSION APPARATUS
- Publication number 20240038628
- Publication date Feb 1, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Hayata ONAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER BLOCK BASED ON TOP-SIDE COOL SURFACE-MOUNT DISCRETE DEVICES W...
- Publication number 20240030096
- Publication date Jan 25, 2024
- Qorvo US, Inc.
- Ke Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING MECHANISM HAVING NANOCAPILLARY STRUCTURE, SEMICONDUCTOR DEV...
- Publication number 20240030102
- Publication date Jan 25, 2024
- SONY GROUP CORPORATION
- Hikaru OHIRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY SEMICONDUCTOR PACKAGE DESIGN
- Publication number 20240014090
- Publication date Jan 11, 2024
- LITTELFUSE, INC.
- Thomas Spann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cooling Cover and Packaged Semiconductor Device Including the Same
- Publication number 20230420337
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARD AND ELECTRONIC APPARATUS
- Publication number 20230422450
- Publication date Dec 28, 2023
- Fujitsu Limited
- Shohei Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH PASS THROUGH HEAT SPREADER
- Publication number 20230420335
- Publication date Dec 28, 2023
- Xilinx, Inc.
- Gamal REFAI-AHMED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR ASSEMBLY
- Publication number 20230411897
- Publication date Dec 21, 2023
- Molex, LLC
- Che-Yuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE INTEGRATED TORSION LOADING MECHANISM
- Publication number 20230395460
- Publication date Dec 7, 2023
- Intel Corporation
- David Shia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATSINK UNIT, IC SOCKET, METHOD FOR MANUFACTURING SEMICONDUCTOR PA...
- Publication number 20230386965
- Publication date Nov 30, 2023
- Yamaichi Electronics Co., Ltd.
- Koichi MIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL STRUCTURE, METHOD FOR MANUFACTURING TERMINAL STRUCTURE, AN...
- Publication number 20230386966
- Publication date Nov 30, 2023
- Fuji Electric Co., Ltd.
- Tadahiko SATO
- H01 - BASIC ELECTRIC ELEMENTS

Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Cooling assembly for a computer module

Electronic power unit and semiconductor power module

Controller with fan monitoring and control

Semiconductor device

Circuit carrier arrangement and method for producing such a circuit...

Low stress asymmetric dual side module

Oscillator

Low stress asymmetric dual side module

Semiconductor device including sense insulated-gate bipolar transistor

Apparatus for protecting a stack of electronic components and metho...

Semiconductor device

Conductive thermal management architecture for electronic devices

Semiconductor structures

Power converter

Semiconductor device having a carrier, semiconductor chip packages...

Heat sink fastener

Computer housing

Computer housing

Semiconductor device and manufacturing method thereof

Reusable holding component for heatsink

Back plate assembly and electronic device

Cooling device

Imaging unit and imaging apparatus

Semiconductor device

Semiconductor device including resin case having groove at corner t...

Molded semiconductor package having a negative standoff

Power device, power device assembly, and related apparatus

Cryostat suspended sample board

Power conversion device having a clip to fix a plurality of switches

Housing for a power semiconductor module arrangement

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE AND METHOD F...

Electromagnetic Interference Shielding and Sealing for Spring Screw...

Integrated Circuit Package and Method

MODULE DEVICE

SYSTEMS AND METHODS FOR AN INTERLOCKING FEATURE ON A POWER MODULE

PRINTED CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING A PRINTE...

HEAT SINK FOR A SEMICONDUCTOR SWITCHING DEVICE, AND SEMICONDUCTOR S...

SEMICONDUCTOR MODULE AND SYSTEM INCLUDING THE SAME

A METHOD FOR COOLING AN OBJECT, A COOLING DEVICE AND USE OF A COOLI...

Chamfered Die of Semiconductor Package and Method for Forming the Same

SEMICONDUCTOR PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

HEAT SPREADER APPARATUS WITH MAGNETIC ATTACHMENTS ON PRINTED WIRING...

VEHICLE POWER MODULE

System, Device and Methods of Manufacture

COMPUTER HOUSING

WIRING BOARD

SEMICONDUCTOR MODULE AND METHOD FOR FABRICATING A SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE COMPRISING AT LEAST ONE SEMICONDUCTOR ELEMENT

POWER CONVERSION APPARATUS

POWER BLOCK BASED ON TOP-SIDE COOL SURFACE-MOUNT DISCRETE DEVICES W...

COOLING MECHANISM HAVING NANOCAPILLARY STRUCTURE, SEMICONDUCTOR DEV...

HIGH RELIABILITY SEMICONDUCTOR PACKAGE DESIGN

Cooling Cover and Packaged Semiconductor Device Including the Same

BOARD AND ELECTRONIC APPARATUS

CHIP PACKAGE WITH PASS THROUGH HEAT SPREADER

CONNECTOR ASSEMBLY

BACKSIDE INTEGRATED TORSION LOADING MECHANISM

HEATSINK UNIT, IC SOCKET, METHOD FOR MANUFACTURING SEMICONDUCTOR PA...

TERMINAL STRUCTURE, METHOD FOR MANUFACTURING TERMINAL STRUCTURE, AN...