Multi-layer

Industry

CPC
H01L23/49534

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49534Multi-layer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Lead frame assembly having a plurality of dicing holes
- Patent number 12,113,001
- Issue date Oct 8, 2024
- CHANG WAH TECHNOLOGY CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with different types of semiconductor dies attached to a fl...
- Patent number 12,080,660
- Issue date Sep 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and related methods
- Patent number 12,062,549
- Issue date Aug 13, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having routable encapsulated conductive subst...
- Patent number 12,062,588
- Issue date Aug 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
III-nitride-based semiconductor packaged structure and method for m...
- Patent number 12,040,259
- Issue date Jul 16, 2024
- INNOSCIENCE (SUZHOU) SEMICONDUCTOR CO., LTD.
- Shangqing Qiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate having a recessed portion for an electronic component
- Patent number 12,009,285
- Issue date Jun 11, 2024
- Kyocera Corporation
- Yoshitomo Onitsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,996,347
- Issue date May 28, 2024
- Fuji Electric Co., Ltd.
- Yuhei Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,887,916
- Issue date Jan 30, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Hyeong Il Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,869,867
- Issue date Jan 9, 2024
- Sumitomo Electric Industries, Ltd.
- Taizo Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having a plurality of chips attached to a lead fr...
- Patent number 11,854,949
- Issue date Dec 26, 2023
- JCET GROUP CO., LTD.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package module
- Patent number 11,842,950
- Issue date Dec 12, 2023
- Samsung Electronics Co., Ltd.
- Yongjin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 11,837,537
- Issue date Dec 5, 2023
- Samsung Electronics Co., Ltd.
- Bongju Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leads for leadframe and semiconductor package
- Patent number 11,830,791
- Issue date Nov 28, 2023
- Texas Instruments Incorporated
- You Chye How
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with crack arrest structure
- Patent number 11,798,900
- Issue date Oct 24, 2023
- Texas Instruments Incorporated
- Naweed Anjum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly for plating with selective molding
- Patent number 11,764,075
- Issue date Sep 19, 2023
- VISHAY GENERAL SEMICONDUCTOR, LLC
- Huiying Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,652,066
- Issue date May 16, 2023
- Samsung Electronics Co., Ltd.
- Dongjoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attachment method and material between a semiconductor device a...
- Patent number 11,640,931
- Issue date May 2, 2023
- STMicroelectronics S.r.l.
- Paolo Crema
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure, semiconductor package structure and method for...
- Patent number 11,631,633
- Issue date Apr 18, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe including conductive pillar over land of conductive layer
- Patent number 11,610,834
- Issue date Mar 21, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device and multilevel lead frame coupler
- Patent number 11,600,581
- Issue date Mar 7, 2023
- Texas Instruments Incorporated
- Juan Alejandro Herbsommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate having integrated passive device(s) between leads
- Patent number 11,600,555
- Issue date Mar 7, 2023
- Texas Instruments Incorporated
- Rajen Manicon Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity structures in integrated circuit package supports
- Patent number 11,557,489
- Issue date Jan 17, 2023
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Current flow between a plurality of semiconductor chips
- Patent number 11,521,933
- Issue date Dec 6, 2022
- Fuji Electric Co., Ltd.
- Shuangching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having routable encapsulated conductive subst...
- Patent number 11,508,635
- Issue date Nov 22, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,508,646
- Issue date Nov 22, 2022
- Mitsubishi Electric Corporation
- Katsumi Miyawaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with crack arrest structure
- Patent number 11,495,549
- Issue date Nov 8, 2022
- Texas Instruments Incorporated
- Naweed Anjum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and maunfacturing method of semiconductor device
- Patent number 11,488,895
- Issue date Nov 1, 2022
- Denso Corporation
- Hiroshi Ishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including frame in which semiconductor chip i...
- Patent number 11,462,498
- Issue date Oct 4, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yong Jin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging process for plating with selective molding
- Patent number 11,393,699
- Issue date Jul 19, 2022
- VISHAY GENERAL SEMICONDUCTOR, LLC
- Huiying Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,387,174
- Issue date Jul 12, 2022
- Mitsubishi Electric Corporation
- Kazuhiro Kawahara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BUMP LANDING WITH BOND WIRES FOR IMPROVED SOLDER WETTING
- Publication number 20250006683
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo C Molina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...
- Publication number 20240404902
- Publication date Dec 5, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Bae BANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME
- Publication number 20240371733
- Publication date Nov 7, 2024
- Ohkuchi Materials Co., Ltd.
- Keiichi Otaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20240355638
- Publication date Oct 24, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE HAVING A MULTI-LEVEL LEAD FRAME
- Publication number 20240304527
- Publication date Sep 12, 2024
- INFINEON TECHNOLOGIES AG
- Dominic Raithel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING METHOD
- Publication number 20240297101
- Publication date Sep 5, 2024
- RICHTEK TECHNOLOGY CORPORATION
- Yu-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A LEAD FRAME AND STRUCTURE THEREOF
- Publication number 20240290631
- Publication date Aug 29, 2024
- SHENZHEN SIPTORY TECHNOLOGY CO., LTD
- Dongdong Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH ELECTRICAL INSULATION FEATURES AND ASSOC...
- Publication number 20240153885
- Publication date May 9, 2024
- INFINEON TECHNOLOGIES AG
- Rainer Markus SCHALLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QFN PACKAGE AND FABRICATING METHOD OF THE SAME
- Publication number 20240128168
- Publication date Apr 18, 2024
- UNITED MICROELECTRONICS CORP.
- Chiu-Feng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240120262
- Publication date Apr 11, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Hyeong Il JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240096766
- Publication date Mar 21, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Hyeong Il JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240063096
- Publication date Feb 22, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Shigeki TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN SUBSTRATE PACKAGE AND LEAD FRAME
- Publication number 20230411251
- Publication date Dec 21, 2023
- STMICROELECTRONICS, INC.
- Jefferson Sismundo TALLEDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Arrangement with Compressible Adhesive
- Publication number 20230369181
- Publication date Nov 16, 2023
- INFINEON TECHNOLOGIES AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROUTABLE MULTILEVEL PACKAGE WITH MULTIPLE INTEGRATED ANTENNAS
- Publication number 20230317644
- Publication date Oct 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Juan Alejandro Herbsommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230298976
- Publication date Sep 21, 2023
- Kabushiki Kaisha Toshiba
- Fumiyoshi KAWASHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH IMPROVED BOARD LEVEL RELIABILITY
- Publication number 20230298982
- Publication date Sep 21, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230253297
- Publication date Aug 10, 2023
- Rohm Co., Ltd.
- Kohei TANIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE MADE FROM NON-METALLIC MATERIAL AND...
- Publication number 20230223325
- Publication date Jul 13, 2023
- NEXPERIA B.V.
- Yu Jun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Layered Metal Frame Power Package
- Publication number 20230215615
- Publication date Jul 6, 2023
- Ferric Inc.
- Michael Lekas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE HAVING INTEGRATED PASSIVE DEVICE(S) BETWEEN LEADS
- Publication number 20230207430
- Publication date Jun 29, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rajen Manicon Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices Including a Premolded Leadframe and a Semicon...
- Publication number 20230197577
- Publication date Jun 22, 2023
- INFINEON TECHNOLOGIES AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME ASSEMBLY
- Publication number 20230187324
- Publication date Jun 15, 2023
- Chang Wah Technology CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20230170283
- Publication date Jun 1, 2023
- STMicroelectronics S.r.l
- Paolo CREMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH WETTABLE FLANK LEAD
- Publication number 20230114872
- Publication date Apr 13, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL COUPLING DEVICE
- Publication number 20230084755
- Publication date Mar 16, 2023
- Kabushiki Kaisha Toshiba
- Yuning TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...
- Publication number 20230083412
- Publication date Mar 16, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Bae BANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
III-NITRIDE-BASED SEMICONDUCTOR PACKAGED STRUCTURE AND METHOD FOR M...
- Publication number 20230036009
- Publication date Feb 2, 2023
- INNOSCIENCE (SUZHOU) SEMICONDUCTOR CO., LTD.
- Shangqing QIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20220399254
- Publication date Dec 15, 2022
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220375818
- Publication date Nov 24, 2022
- Fuji Electric Co., Ltd.
- Yuhei NISHIDA
- H01 - BASIC ELECTRIC ELEMENTS

Multi-layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Lead frame assembly having a plurality of dicing holes

Package with different types of semiconductor dies attached to a fl...

Semiconductor packages and related methods

Semiconductor package having routable encapsulated conductive subst...

III-nitride-based semiconductor packaged structure and method for m...

Substrate having a recessed portion for an electronic component

Semiconductor device

Semiconductor devices and methods of manufacturing semiconductor de...

Semiconductor device

Package structure having a plurality of chips attached to a lead fr...

Package module

Fan-out semiconductor package

Leads for leadframe and semiconductor package

Electronic device with crack arrest structure

Package assembly for plating with selective molding

Semiconductor package

Die attachment method and material between a semiconductor device a...

Substrate structure, semiconductor package structure and method for...

Leadframe including conductive pillar over land of conductive layer

Packaged electronic device and multilevel lead frame coupler

Package substrate having integrated passive device(s) between leads

Cavity structures in integrated circuit package supports

Current flow between a plurality of semiconductor chips

Semiconductor package having routable encapsulated conductive subst...

Semiconductor device

Electronic device with crack arrest structure

Semiconductor device and maunfacturing method of semiconductor device

Semiconductor package including frame in which semiconductor chip i...

Packaging process for plating with selective molding

Semiconductor device

Patents Applicationslast 30 patents

BUMP LANDING WITH BOND WIRES FOR IMPROVED SOLDER WETTING

SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...

LEAD FRAME

SEMICONDUCTOR PACKAGES AND RELATED METHODS

POWER MODULE HAVING A MULTI-LEVEL LEAD FRAME

PACKAGING METHOD

METHOD FOR MANUFACTURING A LEAD FRAME AND STRUCTURE THEREOF

SEMICONDUCTOR DEVICES WITH ELECTRICAL INSULATION FEATURES AND ASSOC...

QFN PACKAGE AND FABRICATING METHOD OF THE SAME

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

THIN SUBSTRATE PACKAGE AND LEAD FRAME

Semiconductor Device Arrangement with Compressible Adhesive

ROUTABLE MULTILEVEL PACKAGE WITH MULTIPLE INTEGRATED ANTENNAS

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE WITH IMPROVED BOARD LEVEL RELIABILITY

SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE SUBSTRATE MADE FROM NON-METALLIC MATERIAL AND...

Multi-Layered Metal Frame Power Package

PACKAGE SUBSTRATE HAVING INTEGRATED PASSIVE DEVICE(S) BETWEEN LEADS

Semiconductor Devices Including a Premolded Leadframe and a Semicon...

LEAD FRAME ASSEMBLY

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

ELECTRONIC DEVICE WITH WETTABLE FLANK LEAD

OPTICAL COUPLING DEVICE

SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...

III-NITRIDE-BASED SEMICONDUCTOR PACKAGED STRUCTURE AND METHOD FOR M...

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE