Multilayer masks

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CPC
H01L2224/11474

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/11474Multilayer masks

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for preparing indium pillar solder, chip substrate and chip
- Patent number 11,869,861
- Issue date Jan 9, 2024
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
- Wenlong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conical-shaped or tier-shaped pillar connections
- Patent number 11,315,896
- Issue date Apr 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for preventing solder bridging, and associa...
- Patent number 10,950,565
- Issue date Mar 16, 2021
- Micron Technology, Inc.
- Kyle S. Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor structure
- Patent number 10,872,870
- Issue date Dec 22, 2020
- Siliconware Precision Industries Co., Ltd.
- Yi-Cheih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Directional deposition on patterned structures
- Patent number 10,825,680
- Issue date Nov 3, 2020
- Lam Research Corporation
- Alexander Kabansky
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor devices, methods of manufacture thereof, and semicond...
- Patent number 10,818,583
- Issue date Oct 27, 2020
- Taiwan Semiconductor Manufacturing Company
- I-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Finned contact
- Patent number 10,756,041
- Issue date Aug 25, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Expanded head pillar for bump bonds
- Patent number 10,636,758
- Issue date Apr 28, 2020
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Injection molded solder bumping
- Patent number 10,615,143
- Issue date Apr 7, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect structures for preventing solder bridging, and associa...
- Patent number 10,600,750
- Issue date Mar 24, 2020
- Micron Technology, Inc.
- Kyle S. Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for assembly of semiconductor structures in...
- Patent number 10,396,269
- Issue date Aug 27, 2019
- Massachusetts Institute of Technology
- William D. Oliver
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Fabrication method of semiconductor structure
- Patent number 10,325,872
- Issue date Jun 18, 2019
- Siliconware Precision Industries Co., Ltd.
- Yi-Cheih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and semiconductor structures for assembly of...
- Patent number 10,242,968
- Issue date Mar 26, 2019
- Massachusetts Institute of Technology
- Rabindra N. Das
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Robust pillar structure for semicondcutor device contacts
- Patent number 10,236,268
- Issue date Mar 19, 2019
- Amkor Technology, Inc.
- Karthikeyan Dhandapani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods for fabricating interconnect st...
- Patent number 10,121,754
- Issue date Nov 6, 2018
- Massachusetts Institute of Technology
- William D. Oliver
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Conical-shaped or tier-shaped pillar connections
- Patent number 10,056,345
- Issue date Aug 21, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar design for conductive bump
- Patent number 9,953,948
- Issue date Apr 24, 2018
- Taiwan Semiconductor Manufacturing Company
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper pillar sidewall protection
- Patent number 9,875,980
- Issue date Jan 23, 2018
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder in cavity interconnection technology
- Patent number 9,848,490
- Issue date Dec 19, 2017
- Intel Corporation
- Chuan Hu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnetic intermetallic compound interconnect
- Patent number 9,847,308
- Issue date Dec 19, 2017
- Intel Corporation
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming pillar bumps on semiconductor wafers
- Patent number 9,831,201
- Issue date Nov 28, 2017
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, methods of manufacture thereof, and semicond...
- Patent number 9,773,724
- Issue date Sep 26, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dense interconnect with solder cap (DISC) formation with laser abla...
- Patent number 9,741,645
- Issue date Aug 22, 2017
- Intel Corporation
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of fabricating the same
- Patent number 9,735,124
- Issue date Aug 15, 2017
- Siliconware Precision Industries Co., Ltd.
- Yi-Cheih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated WLUF and SOD process
- Patent number 9,728,515
- Issue date Aug 8, 2017
- Intel Corporation
- Rubayat Mahmud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor structure and manufacturing method thereof
- Patent number 9,704,943
- Issue date Jul 11, 2017
- Xintec Inc.
- Wei-Ming Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for building vertical pillar interconnect
- Patent number 9,627,254
- Issue date Apr 18, 2017
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic thin film passivation of metal interconnections
- Patent number 9,583,390
- Issue date Feb 28, 2017
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shaped and oriented solder joints
- Patent number 9,564,412
- Issue date Feb 7, 2017
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar design for conductive bump
- Patent number 9,496,235
- Issue date Nov 15, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240105652
- Publication date Mar 28, 2024
- SK HYNIX INC.
- Dae Won KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, A PACKAGE SUBSTRATE, AND A SEMICONDUCTOR PACKAGE
- Publication number 20230154879
- Publication date May 18, 2023
- SK HYNIX INC.
- Si Yun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING INDIUM PILLAR SOLDER, CHIP SUBSTRATE AND CHIP
- Publication number 20220130784
- Publication date Apr 28, 2022
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
- Wenlong ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINNED CONTACT
- Publication number 20200294946
- Publication date Sep 17, 2020
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDED HEAD PILLAR FOR BUMP BONDS
- Publication number 20200258856
- Publication date Aug 13, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR PREVENTING SOLDER BRIDGING, AND ASSOCIA...
- Publication number 20200203297
- Publication date Jun 25, 2020
- Micron Technology, Inc.
- Kyle S. Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20190259723
- Publication date Aug 22, 2019
- Siliconware Precision Industries Co., Ltd.
- Yi-Cheih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conical-Shaped or Tier-Shaped Pillar Connections
- Publication number 20180358316
- Publication date Dec 13, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices, Methods of Manufacture Thereof, and Semicond...
- Publication number 20180012830
- Publication date Jan 11, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20170309585
- Publication date Oct 26, 2017
- Siliconware Precision Industries Co., Ltd.
- Yi-Cheih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170271432
- Publication date Sep 21, 2017
- XINTEC INC.
- Wei-Ming LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES AND METHODS FOR FABRICATING INTERCONNECT ST...
- Publication number 20170133336
- Publication date May 11, 2017
- Massachusetts Institute of Technology
- William D. Oliver
- B82 - NANO-TECHNOLOGY
Information Patent Application
Conical-Shaped or Tier-Shaped Pillar Connections
- Publication number 20160358876
- Publication date Dec 8, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE WETTING PROCESS TO INCREASE SOLDER JOINT STANDOFF
- Publication number 20140362550
- Publication date Dec 11, 2014
- Leilei ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pillar Design for Conductive Bump
- Publication number 20140361432
- Publication date Dec 11, 2014
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pillar Bumps and Process for Making Same
- Publication number 20140363966
- Publication date Dec 11, 2014
- Cheng-Chung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ABLATION TAPE FOR SOLDER INTERCONNECT FORMATION
- Publication number 20140335686
- Publication date Nov 13, 2014
- Xavier F. Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP INTERPOSER, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING...
- Publication number 20140306355
- Publication date Oct 16, 2014
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL PILLAR STRUCTURE FOR USE IN PACKAGING INTEGRATED CIRCUIT PROD...
- Publication number 20140264890
- Publication date Sep 18, 2014
- GLOBALFOUNDRIES INC.
- Dirk Breuer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER IN CAVITY INTERCONNECTION TECHNOLOGY
- Publication number 20140240943
- Publication date Aug 28, 2014
- Chuan Hu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device with Conductive Pillars Having Recesses or Pro...
- Publication number 20140225256
- Publication date Aug 14, 2014
- STATS ChipPAC, Ltd.
- Jen Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices, Methods of Manufacture Thereof, and Semicond...
- Publication number 20140210074
- Publication date Jul 31, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...
- Publication number 20140206145
- Publication date Jul 24, 2014
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC THIN FILM PASSIVATION OF METAL INTERCONNECTIONS
- Publication number 20140138818
- Publication date May 22, 2014
- Alexsandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNING HYBRIDIZATION METHOD
- Publication number 20140061911
- Publication date Mar 6, 2014
- TELEDYNE SCIENTIFIC & IMAGING, LLC
- Donald E. Cooper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNING HYBRIDIZATION METHOD
- Publication number 20140061838
- Publication date Mar 6, 2014
- TELEDYNE SCIENTIFIC & IMAGING, LLC
- PHILIP A. STUPAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVING CHIP AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140054765
- Publication date Feb 27, 2014
- SAMSUNG DISPLAY CO., LTD.
- Seo-Hyeong YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING AN INTEGRATED CIRCUIT DEVICE
- Publication number 20140051244
- Publication date Feb 20, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Cheng KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLED COLLAPSE CHIP CONNECTION (C4) STRUCTURE AND METHODS OF F...
- Publication number 20140042630
- Publication date Feb 13, 2014
- International Business Machines Corporation
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DENSE INTERCONNECT WITH SOLDER CAP (DISC) FORMATION WITH LASER ABLA...
- Publication number 20140035134
- Publication date Feb 6, 2014
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS

Multilayer masks

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for preparing indium pillar solder, chip substrate and chip

Conical-shaped or tier-shaped pillar connections

Interconnect structures for preventing solder bridging, and associa...

Fabrication method of semiconductor structure

Directional deposition on patterned structures

Semiconductor devices, methods of manufacture thereof, and semicond...

Finned contact

Expanded head pillar for bump bonds

Injection molded solder bumping

Interconnect structures for preventing solder bridging, and associa...

Interconnect structures for assembly of semiconductor structures in...

Fabrication method of semiconductor structure

Interconnect structure and semiconductor structures for assembly of...

Robust pillar structure for semicondcutor device contacts

Interconnect structures and methods for fabricating interconnect st...

Conical-shaped or tier-shaped pillar connections

Pillar design for conductive bump

Copper pillar sidewall protection

Solder in cavity interconnection technology

Magnetic intermetallic compound interconnect

Methods for forming pillar bumps on semiconductor wafers

Semiconductor devices, methods of manufacture thereof, and semicond...

Dense interconnect with solder cap (DISC) formation with laser abla...

Semiconductor structure and method of fabricating the same

Integrated WLUF and SOD process

Inductor structure and manufacturing method thereof

Method for building vertical pillar interconnect

Organic thin film passivation of metal interconnections

Shaped and oriented solder joints

Pillar design for conductive bump

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, A PACKAGE SUBSTRATE, AND A SEMICONDUCTOR PACKAGE

METHOD FOR PREPARING INDIUM PILLAR SOLDER, CHIP SUBSTRATE AND CHIP

FINNED CONTACT

EXPANDED HEAD PILLAR FOR BUMP BONDS

INTERCONNECT STRUCTURES FOR PREVENTING SOLDER BRIDGING, AND ASSOCIA...

FABRICATION METHOD OF SEMICONDUCTOR STRUCTURE

Conical-Shaped or Tier-Shaped Pillar Connections

Semiconductor Devices, Methods of Manufacture Thereof, and Semicond...

FABRICATION METHOD OF SEMICONDUCTOR STRUCTURE

INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

INTERCONNECT STRUCTURES AND METHODS FOR FABRICATING INTERCONNECT ST...

Conical-Shaped or Tier-Shaped Pillar Connections

SELECTIVE WETTING PROCESS TO INCREASE SOLDER JOINT STANDOFF

Pillar Design for Conductive Bump

Pillar Bumps and Process for Making Same

LASER ABLATION TAPE FOR SOLDER INTERCONNECT FORMATION

CHIP INTERPOSER, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING...

NOVEL PILLAR STRUCTURE FOR USE IN PACKAGING INTEGRATED CIRCUIT PROD...

SOLDER IN CAVITY INTERCONNECTION TECHNOLOGY

Semiconductor Device with Conductive Pillars Having Recesses or Pro...

Semiconductor Devices, Methods of Manufacture Thereof, and Semicond...

INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...

ORGANIC THIN FILM PASSIVATION OF METAL INTERCONNECTIONS

SELF-ALIGNING HYBRIDIZATION METHOD

SELF-ALIGNING HYBRIDIZATION METHOD

DRIVING CHIP AND METHOD OF MANUFACTURING THE SAME

METHOD OF FORMING AN INTEGRATED CIRCUIT DEVICE

CONTROLLED COLLAPSE CHIP CONNECTION (C4) STRUCTURE AND METHODS OF F...

DENSE INTERCONNECT WITH SOLDER CAP (DISC) FORMATION WITH LASER ABLA...