Multilayer substrates

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H01L23/49822

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49822Multilayer substrates

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Redistribution layer structure
- Patent number 12,322,686
- Issue date Jun 3, 2025
- Innolux Corporation
- Hung-Sheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including auxiliary dielectric portion
- Patent number 12,322,688
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip including through electrode, and semiconductor p...
- Patent number 12,322,681
- Issue date Jun 3, 2025
- SK hynix Inc.
- Seung Hwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for noise prevention and semiconductor package including...
- Patent number 12,322,687
- Issue date Jun 3, 2025
- Samsung Electronics Co., Ltd.
- Kiwon Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die including through substrate via barrier structure...
- Patent number 12,322,679
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Efficient power electronics arrangement
- Patent number 12,323,071
- Issue date Jun 3, 2025
- Rolls-Royce Deutschland Ltd & Co KG
- Uwe Waltrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-mode wireless charging device
- Patent number 12,322,696
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic power module using polymer p...
- Patent number 12,322,604
- Issue date Jun 3, 2025
- SAFRAN
- Baptiste Joël Christian Fedi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit packages and fabrication methods using bond-on-pad (BoP) su...
- Patent number 12,322,690
- Issue date Jun 3, 2025
- Avago Technologies International Sales Pte. Limited
- Wen-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Maleimide resin composition, prepreg, resin film, laminated board,...
- Patent number 12,324,105
- Issue date Jun 3, 2025
- Resonac Corporation
- Chihiro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 12,315,785
- Issue date May 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Yu-Ying Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package for high bandwidth memory
- Patent number 12,315,860
- Issue date May 27, 2025
- Google LLC
- Nam Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded semiconductor packages and methods thereof
- Patent number 12,315,787
- Issue date May 27, 2025
- Georgia Tech Research Corporation
- Nobuo Ogura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,315,824
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having connecting structure
- Patent number 12,315,832
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Kijong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,315,786
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer, manufacturing method therefor, and circuit board assembly
- Patent number 12,308,252
- Issue date May 20, 2025
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Man-Zhi Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded product for semiconductor strip and method of manufacturing...
- Patent number 12,308,253
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Seunghwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package
- Patent number 12,308,308
- Issue date May 20, 2025
- Siliconware Precision Industries Co., Ltd.
- Sung-Hua Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies with communication networks
- Patent number 12,300,666
- Issue date May 13, 2025
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum nitride multilayer power module interposer and method
- Patent number 12,300,578
- Issue date May 13, 2025
- TriPent Power LLC
- Stephen P. Nootens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,300,589
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Gwangjae Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses including ball grid arrays and associated systems
- Patent number 12,300,597
- Issue date May 13, 2025
- Micron Technology, Inc.
- David K. Ovard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, package structure and electronic manufacturing m...
- Patent number 12,300,651
- Issue date May 13, 2025
- Advanced Semiconductor Engineering, Inc.
- Pei-Jen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package
- Patent number 12,300,509
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Junyong Chung
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device including differential height PCB
- Patent number 12,300,557
- Issue date May 13, 2025
- SanDisk Technologies, Inc.
- Nandha Kumar Mohanraj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,300,684
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Chieh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully molded structure with multi-height components comprising back...
- Patent number 12,300,561
- Issue date May 13, 2025
- Deca Technologies USA, Inc.
- Clifford Sandstrom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inorganic-based embedded-die layers for modular semiconductive devices
- Patent number 12,300,620
- Issue date May 13, 2025
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for forming same
- Patent number 12,300,590
- Issue date May 13, 2025
- JCET GROUP CO., LTD.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250183185
- Publication date Jun 5, 2025
- Siliconware Precision Industries Co., Ltd.
- Hsin-Yin CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20250183213
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER
- Publication number 20250183113
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Kang Gyune Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20250183141
- Publication date Jun 5, 2025
- LG Display Co., Ltd.
- Buhui LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE, RDL STRUCTURE COMPRISING REDIS...
- Publication number 20250183143
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250183197
- Publication date Jun 5, 2025
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan KUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES INCLUDING WIRE-BOND PADS AND FLIP-CHIP BUM...
- Publication number 20250183137
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yun-Chi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER STAGE PACKAGE WITH HALF BRIDGE-CONNECTED TRANSISTOR CHIPS AND...
- Publication number 20250183232
- Publication date Jun 5, 2025
- INFINEON TECHNOLOGIES AG
- Angela KESSLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183246
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Sang Cheon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE
- Publication number 20250183142
- Publication date Jun 5, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sang-min Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183147
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Hongjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE WITH INTEGRATED INDUCTOR AND MANUFACTU...
- Publication number 20250183202
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- WEN-SHIANG LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PACKAGE INCLUDING THE SEMICONDUCTOR DEVICE
- Publication number 20250183210
- Publication date Jun 5, 2025
- Infineon Technologies Austria AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING A BACKSIDE METAL FILM ON A SEMICONDUCTO...
- Publication number 20250183237
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20250183140
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzu-Sheng Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hollow Antenna Substrate and Its Manufacturing Method for Antenna P...
- Publication number 20250174874
- Publication date May 29, 2025
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- PAO-HUNG CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRIC POWER CONVERSION DEVICE
- Publication number 20250174503
- Publication date May 29, 2025
- Minebea Power Semiconductor Device Inc.
- Norio NAKAZATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT RADIATION STRUCTURE, COOLING S...
- Publication number 20250174521
- Publication date May 29, 2025
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20250174534
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Jinwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250174535
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Heewoo AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED INTEGRATED VOLTAGE REGULATOR
- Publication number 20250174597
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED PACKAGE WITH CARRIER, LAMINATE BODY AND COMPONENT IN B...
- Publication number 20250174509
- Publication date May 29, 2025
- INFINEON TECHNOLOGIES AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PRODUCING HIGH POWER MODULE PACKAGE STRUCTURES
- Publication number 20250174515
- Publication date May 29, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED CLIP PAD FOR PASSIVE SURFACE MOUNT COMPONENT
- Publication number 20250174525
- Publication date May 29, 2025
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo Molina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250174533
- Publication date May 29, 2025
- MEDIATEK INC.
- Yih-Ting SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE POST AND METHOD OF MANUF...
- Publication number 20250174541
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250174603
- Publication date May 29, 2025
- KIOXIA Corporation
- Akihito SAWANOBORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE
- Publication number 20250174536
- Publication date May 29, 2025
- Advanced Semiconductor Engineering, Inc.
- Chiung-Ying KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250176111
- Publication date May 29, 2025
- Samsung Electronics Co., LTD
- Kyoungok Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HEAT DISSIPATION STR...
- Publication number 20250174510
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

Multilayer substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Redistribution layer structure

Package structure including auxiliary dielectric portion

Semiconductor chip including through electrode, and semiconductor p...

Substrate for noise prevention and semiconductor package including...

Semiconductor die including through substrate via barrier structure...

Efficient power electronics arrangement

Dual-mode wireless charging device

Method for manufacturing an electronic power module using polymer p...

Circuit packages and fabrication methods using bond-on-pad (BoP) su...

Maleimide resin composition, prepreg, resin film, laminated board,...

Semiconductor device package

Integrated circuit package for high bandwidth memory

Embedded semiconductor packages and methods thereof

Semiconductor package

Semiconductor packages having connecting structure

Semiconductor structure and manufacturing method thereof

Interposer, manufacturing method therefor, and circuit board assembly

Molded product for semiconductor strip and method of manufacturing...

Electronic package

Microelectronic assemblies with communication networks

Aluminum nitride multilayer power module interposer and method

Semiconductor package

Apparatuses including ball grid arrays and associated systems

Electronic device, package structure and electronic manufacturing m...

Method of manufacturing semiconductor package

Semiconductor device including differential height PCB

Semiconductor packages

Fully molded structure with multi-height components comprising back...

Inorganic-based embedded-die layers for modular semiconductive devices

Package structure and method for forming same

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER

DISPLAY DEVICE

METHOD OF FORMING PACKAGE STRUCTURE, RDL STRUCTURE COMPRISING REDIS...

PACKAGE STRUCTURE

SEMICONDUCTOR STRUCTURES INCLUDING WIRE-BOND PADS AND FLIP-CHIP BUM...

POWER STAGE PACKAGE WITH HALF BRIDGE-CONNECTED TRANSISTOR CHIPS AND...

SEMICONDUCTOR PACKAGE

CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE DEVICE WITH INTEGRATED INDUCTOR AND MANUFACTU...

SEMICONDUCTOR DEVICE AND PACKAGE INCLUDING THE SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE INCLUDING A BACKSIDE METAL FILM ON A SEMICONDUCTO...

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

Hollow Antenna Substrate and Its Manufacturing Method for Antenna P...

SEMICONDUCTOR DEVICE AND ELECTRIC POWER CONVERSION DEVICE

SEMICONDUCTOR PACKAGE INCLUDING HEAT RADIATION STRUCTURE, COOLING S...

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

EMBEDDED INTEGRATED VOLTAGE REGULATOR

ENCAPSULATED PACKAGE WITH CARRIER, LAMINATE BODY AND COMPONENT IN B...

METHODS OF PRODUCING HIGH POWER MODULE PACKAGE STRUCTURES

RECESSED CLIP PAD FOR PASSIVE SURFACE MOUNT COMPONENT

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE POST AND METHOD OF MANUF...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HEAT DISSIPATION STR...