Multilayer substrates

Industry

CPC
H01L23/49822

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49822Multilayer substrates

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including a dummy pattern
- Patent number 12,211,777
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Minjung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and package substrate including same
- Patent number 12,211,781
- Issue date Jan 28, 2025
- LG Innotek Co., Ltd
- Se Woong Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strip substrate having protection pattern on sidewall of conductive...
- Patent number 12,211,783
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Sunnyeong Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stiffener package and method of fabricating stiffener package
- Patent number 12,211,705
- Issue date Jan 28, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming bump pad array on substr...
- Patent number 12,211,778
- Issue date Jan 28, 2025
- STATS ChipPAC Pte. Ltd.
- Hermes T. Apale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package dielectric susbtrate including a trench
- Patent number 12,211,782
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yueh-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods for forming the same
- Patent number 12,211,799
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having multiple substrates
- Patent number 12,211,779
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming semiconductor package wi...
- Patent number 12,211,803
- Issue date Jan 28, 2025
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package structure
- Patent number 12,211,780
- Issue date Jan 28, 2025
- Advanced Semiconductor Engineering, Inc.
- Chiung-Ying Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and multi-level interposer with RF sloped via and...
- Patent number 12,205,880
- Issue date Jan 21, 2025
- Eagle Technology, LLC
- Matt Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Continuous interconnects between heterogeneous materials
- Patent number 12,205,878
- Issue date Jan 21, 2025
- Liquid Wire Inc.
- Mark William Ronay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Honeycomb pattern for conductive features
- Patent number 12,205,916
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shenggao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin component carrier having high stiffness and method of ma...
- Patent number 12,205,877
- Issue date Jan 21, 2025
- AT&S(Chongqing) Company Limited
- Jeesoo Mok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die to die high-speed communication without discrete amplifiers bet...
- Patent number 12,205,908
- Issue date Jan 21, 2025
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,205,875
- Issue date Jan 21, 2025
- Kioxia Corporation
- Satoshi Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Symmetrical substrate for semiconductor packaging
- Patent number 12,205,879
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate and method for manufacturing same
- Patent number 12,198,994
- Issue date Jan 14, 2025
- ABSOLICS INC.
- Sungjin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper connected glass modules on a glass board
- Patent number 12,199,007
- Issue date Jan 14, 2025
- BROADCOM INTERNATIONAL PTE. LTD.
- Thomas Edward Dungan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,199,047
- Issue date Jan 14, 2025
- Siliconware Precision Industries Co., Ltd.
- Chao-Chiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and semiconductor device
- Patent number 12,199,053
- Issue date Jan 14, 2025
- Renesas Electronics Corporation
- Shuuichi Kariyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies including vertically integrated circuits a...
- Patent number 12,199,001
- Issue date Jan 14, 2025
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer structure containing embedded silicon-less link chiplet
- Patent number 12,199,025
- Issue date Jan 14, 2025
- Chengdu ECHINT Technology Co., Ltd.
- Minghao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics card including multi-chip module
- Patent number 12,199,080
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,191,287
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,191,294
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked via structure disposed on a conductive pillar of a semicond...
- Patent number 12,191,239
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Che-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including electromagnetic interference (EMI) s...
- Patent number 12,191,261
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Yao Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,191,203
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a curved part in the printed circuit board
- Patent number 12,191,245
- Issue date Jan 7, 2025
- Fuji Electric Co., Ltd.
- Motohito Hori
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEVICE PACKAGE
- Publication number 20250038136
- Publication date Jan 30, 2025
- Advanced Semiconductor Engineering, Inc.
- Cheng-Nan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGING, MANUFACTURING METHOD FOR ELECTRONIC PACKAGING...
- Publication number 20250038091
- Publication date Jan 30, 2025
- CHENGDU HAIGUANG INTEGRATED CIRCUIT DESIGN CO., LTD.
- Shuan Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250038094
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Joongsun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250038134
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Junbae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250038081
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Jongho PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250038088
- Publication date Jan 30, 2025
- Siliconware Precision Industries Co., Ltd.
- Ting-Yang Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE CARRIER
- Publication number 20250040026
- Publication date Jan 30, 2025
- Unimicron Technology Corp.
- Ming-Hao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, CHIP, ELECTRONIC APPARATUS, MANUFACTURING METHOD...
- Publication number 20250038086
- Publication date Jan 30, 2025
- HYGON INFORMATION TECHNOLOGY CO., LTD.
- Shuan Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterogeneous Fan-Out Structure and Method of Manufacture
- Publication number 20250038087
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250038089
- Publication date Jan 30, 2025
- Innolux Corporation
- Hung-Sheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF, AND SUBSTRATE...
- Publication number 20250038097
- Publication date Jan 30, 2025
- Siliconware Precision Industries Co., Ltd.
- Chia-Wen TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL, METHOD FOR MANUFACTURING TERMINAL, AND SEMICONDUCTOR DEVICE
- Publication number 20250038098
- Publication date Jan 30, 2025
- Fuji Electric Co., Ltd.
- Tomomi NONAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING DYNAMIC SECURITY FABRIC INTERPOSE...
- Publication number 20250038132
- Publication date Jan 30, 2025
- The Charles Stark Draper Laboratory, Inc.
- Douglas La Tulipe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSERS INCLUDING LINE-ON-VIA AND LINE-IN-VIA INTERCONNECT STRU...
- Publication number 20250038093
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS
- Publication number 20250038112
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Taejoo HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ELECTROMAGNETIC INTERFERENCE SHIELDING...
- Publication number 20250038126
- Publication date Jan 30, 2025
- MEDIATEK INC.
- De-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250038061
- Publication date Jan 30, 2025
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250038084
- Publication date Jan 30, 2025
- Advanced Semiconductor Engineering, Inc.
- Chiung-Ying KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER MEMBER WITH ONE OR MORE VIAS
- Publication number 20250038085
- Publication date Jan 30, 2025
- Avago Technologies International Sales Pte. Limited
- Walter Dauksher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF FRONT-END FUNCTIONALITY INTEGRATED IN A COMPONENT CARRIER STACK
- Publication number 20250040028
- Publication date Jan 30, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Patrick LENHARDT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DEVICE
- Publication number 20250029907
- Publication date Jan 23, 2025
- InnoLux Corporation
- Yeong-E CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTO...
- Publication number 20250031315
- Publication date Jan 23, 2025
- DAI NIPPON PRINTING CO., LTD.
- Ryohei KASAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250029913
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Jaesic LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250029927
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- YOUNGBAE KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20250029883
- Publication date Jan 23, 2025
- Fuji Electric Co., Ltd.
- Shohei KASAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250029906
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Kyounglim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250029909
- Publication date Jan 23, 2025
- Mitsubishi Electric Corporation
- Takuma NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20250029910
- Publication date Jan 23, 2025
- Innolux Corporation
- Yeong-E Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR SUBSTRATE
- Publication number 20250029911
- Publication date Jan 23, 2025
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250029935
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Kyuil Hwang
- H01 - BASIC ELECTRIC ELEMENTS

Multilayer substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package including a dummy pattern

Printed circuit board and package substrate including same

Strip substrate having protection pattern on sidewall of conductive...

Stiffener package and method of fabricating stiffener package

Semiconductor device and method of forming bump pad array on substr...

Semiconductor package dielectric susbtrate including a trench

Semiconductor packages and methods for forming the same

Semiconductor package having multiple substrates

Semiconductor device and method of forming semiconductor package wi...

Electronic package structure

Electronic device and multi-level interposer with RF sloped via and...

Continuous interconnects between heterogeneous materials

Honeycomb pattern for conductive features

Ultra-thin component carrier having high stiffness and method of ma...

Die to die high-speed communication without discrete amplifiers bet...

Semiconductor device and manufacturing method thereof

Symmetrical substrate for semiconductor packaging

Packaging substrate and method for manufacturing same

Copper connected glass modules on a glass board

Electronic package and manufacturing method thereof

Electronic device and semiconductor device

Semiconductor assemblies including vertically integrated circuits a...

Interposer structure containing embedded silicon-less link chiplet

Electronics card including multi-chip module

Package structure

Package structure and method of forming the same

Stacked via structure disposed on a conductive pillar of a semicond...

Semiconductor device including electromagnetic interference (EMI) s...

Semiconductor package

Semiconductor device having a curved part in the printed circuit board

Patents Applicationslast 30 patents

DEVICE PACKAGE

ELECTRONIC PACKAGING, MANUFACTURING METHOD FOR ELECTRONIC PACKAGING...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF PACKAGE CARRIER

PACKAGE STRUCTURE, CHIP, ELECTRONIC APPARATUS, MANUFACTURING METHOD...

Heterogeneous Fan-Out Structure and Method of Manufacture

ELECTRONIC DEVICE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF, AND SUBSTRATE...

TERMINAL, METHOD FOR MANUFACTURING TERMINAL, AND SEMICONDUCTOR DEVICE

SYSTEMS AND METHODS FOR PROVIDING DYNAMIC SECURITY FABRIC INTERPOSE...

INTERPOSERS INCLUDING LINE-ON-VIA AND LINE-IN-VIA INTERCONNECT STRU...

SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS

SEMICONDUCTOR PACKAGE HAVING ELECTROMAGNETIC INTERFERENCE SHIELDING...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE

STIFFENER MEMBER WITH ONE OR MORE VIAS

RF FRONT-END FUNCTIONALITY INTEGRATED IN A COMPONENT CARRIER STACK

PACKAGE DEVICE

WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTO...

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT

MANUFACTURING METHOD OF SEMICONDUCTOR SUBSTRATE

SEMICONDUCTOR PACKAGE