Multiple rows of pads, lands, terminals or dummy patterns Multiple rows of mounted components

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  • Information Patent Application

    SEMICONDUCTOR SUBSTRATE, METHOD FOR DESIGNING SEMICONDUCTOR SUBSTRA...

    • Publication number 20240147603
    • Publication date May 2, 2024
    • NEC Corporation
    • Naoki Oshima
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BOARD-TO-BOARD CONNECTOR

    • Publication number 20240145957
    • Publication date May 2, 2024
    • Japan Aviation Electronics Industry, Ltd.
    • Osamu HASHIGUCHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FLEXIBLE CONNECTING STRUCTURE

    • Publication number 20240128665
    • Publication date Apr 18, 2024
    • Min Di Consultants Ltd.
    • Chi-Di LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD

    • Publication number 20240074051
    • Publication date Feb 29, 2024
    • Samsung Electronics Co., Ltd.
    • Jonghyun SEOK
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE

    • Publication number 20240032192
    • Publication date Jan 25, 2024
    • Innolux Corporation
    • Zhi-Fu Huang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SYSTEM AND METHOD FOR REVERSIBLE CONNECTION OF INTERCHANGABLE COMPO...

    • Publication number 20240032194
    • Publication date Jan 25, 2024
    • Dell Products L.P.
    • EDUARDO ESCAMILLA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD

    • Publication number 20230413425
    • Publication date Dec 21, 2023
    • LG Innotek Co., Ltd.
    • Myung Jae KWON
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ARTICLE FOR POWER INVERTER AND POWER INVERTER

    • Publication number 20230413435
    • Publication date Dec 21, 2023
    • Exro Technologies Inc.
    • Eric HUSTEDT
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    ELECTRONIC COMPONENT

    • Publication number 20230371175
    • Publication date Nov 16, 2023
    • TDK Corporation
    • Yu FUKAE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND CIRCUIT MODULE

    • Publication number 20230337359
    • Publication date Oct 19, 2023
    • Murata Manufacturing Co., Ltd.
    • Takashi KITAHARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PAD ARRANGING METHOD AND PAD ARRANGEMENT STRUCTURE

    • Publication number 20230209713
    • Publication date Jun 29, 2023
    • KINPO ELECTRONICS, INC.
    • Chuan-Wang CHANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING BOARD AND LIGHT-EMITTING DEVICE

    • Publication number 20230209715
    • Publication date Jun 29, 2023
    • Nichia Corporation.
    • Soichiro MIURA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ARTICLE FOR POWER INVERTER AND POWER INVERTER

    • Publication number 20230199952
    • Publication date Jun 22, 2023
    • Exro Technologies Inc.
    • Eric HUSTEDT
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    Platform Supports the Shortest Electrical Connection between Two QS...

    • Publication number 20230199950
    • Publication date Jun 22, 2023
    • Shuang Jin
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CONNECTION BODY AND HARNESS

    • Publication number 20230187855
    • Publication date Jun 15, 2023
    • Japan Aviation Electronics Industry, Limited
    • Kentaro TODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE

    • Publication number 20230156916
    • Publication date May 18, 2023
    • InnoLux Corporation
    • Shang-Ru WU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRICAL CONNECTION STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE...

    • Publication number 20230141357
    • Publication date May 11, 2023
    • Samsung Electronics Co., Ltd.
    • Gidae KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    TECHNOLOGIES FOR APPLYING GOLD-PLATED CONTACT PADS TO CIRCUIT BOARDS

    • Publication number 20230074269
    • Publication date Mar 9, 2023
    • Intel Corporation
    • Donald Tiendung Tran
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ZIGZAG WIRED MEMORY MODULE

    • Publication number 20230061451
    • Publication date Mar 2, 2023
    • Samsung Electronics Co., Ltd.
    • Jonghyun SEOK
    • G11 - INFORMATION STORAGE
  • Information Patent Application

    PRINTED CIRCUIT BOARD FOR TRANSMITTING SIGNAL IN HIGH-FREQUENCY BAN...

    • Publication number 20230035645
    • Publication date Feb 2, 2023
    • Samsung Electronics Co., Ltd.
    • Eunseok HONG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD

    • Publication number 20220418105
    • Publication date Dec 29, 2022
    • Samsung Electronics Co., Ltd.
    • Jonghyun SEOK
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SENSOR LENS ASSEMBLY HAVING NON-REFLOW CONFIGURATION

    • Publication number 20220361327
    • Publication date Nov 10, 2022
    • Kingpak Technology Inc.
    • CHIA-SHUAI CHANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD, AN IMAGE SENSOR MODULE, A LENS DRIVING DEVICE, AND A...

    • Publication number 20220353389
    • Publication date Nov 3, 2022
    • LG Innotek Co., Ltd.
    • Hae Sik KIM
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

    • Publication number 20220353987
    • Publication date Nov 3, 2022
    • KYOCERA CORPORATION
    • Seiichirou ITOU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BASE MEMBER

    • Publication number 20220322531
    • Publication date Oct 6, 2022
    • Canon Kabushiki Kaisha
    • Yoshihiko Fujise
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CONNECTOR ATTACHED MULTI-CONDUCTOR CABLE

    • Publication number 20220311189
    • Publication date Sep 29, 2022
    • Sumitomo Electric Industries, Ltd.
    • Naoshige YOKOTA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER CIRCUIT BOARD

    • Publication number 20220304149
    • Publication date Sep 22, 2022
    • 3M Innovative Properties Company
    • YunLong Qiao
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    HIGH DENSITY CONNECTOR ASSEMBLY

    • Publication number 20220166157
    • Publication date May 26, 2022
    • 3M Innovative Properties Company
    • YunLong Qiao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD

    • Publication number 20220095453
    • Publication date Mar 24, 2022
    • Samsung Electro-Mechanics CO., LTD.
    • Seong Ho CHOI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DISPLAY DEVICE

    • Publication number 20220083167
    • Publication date Mar 17, 2022
    • SAMSUNG DISPLAY CO., LTD.
    • SEONG-SIK PARK
    • G06 - COMPUTING CALCULATING COUNTING