Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00

Industry

CPC
H01L25/50

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/50Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method having a through substrate via and...
- Patent number 12,148,664
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and manufacturing method thereof
- Patent number 12,148,735
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,148,678
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,148,716
- Issue date Nov 19, 2024
- Kioxia Corporation
- Takuya Konno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming large chips through stitching
- Patent number 12,148,719
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip integrated fan-out package
- Patent number 12,148,728
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional bonding scheme and associated systems and methods
- Patent number 12,148,736
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical multichip package with multiple system-on-chip dies
- Patent number 12,148,744
- Issue date Nov 19, 2024
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gallium nitride (GAN) three-dimensional integrated circuit technology
- Patent number 12,148,747
- Issue date Nov 19, 2024
- Intel Corporation
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMIB patch on glass laminate substrate
- Patent number 12,148,703
- Issue date Nov 19, 2024
- Intel Corporation
- Robert Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of semiconductor device
- Patent number 12,148,723
- Issue date Nov 19, 2024
- United Microelectronics Corp.
- Zhirui Sheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding of bridge to multiple semiconductor chips
- Patent number 12,142,603
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die ultrafine pitch patch architecture of interconnect bridge...
- Patent number 12,142,568
- Issue date Nov 12, 2024
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked transistor structure with reflection layer
- Patent number 12,142,599
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Teresa J. Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and manufacturing method of semiconduct...
- Patent number 12,144,179
- Issue date Nov 12, 2024
- SK hynix Inc.
- Eun Seok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite bridge die-to-die interconnects for integrated-circuit pa...
- Patent number 12,142,570
- Issue date Nov 12, 2024
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,142,596
- Issue date Nov 12, 2024
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and the methods of manufacturing
- Patent number 12,142,597
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimension large system integration
- Patent number 12,136,612
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing three-dimensional integrated circuit struc...
- Patent number 12,136,619
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding contact structure of three-dimensional memory device
- Patent number 12,137,568
- Issue date Nov 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 12,136,565
- Issue date Nov 5, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 12,136,562
- Issue date Nov 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an interposer in which one or more die...
- Patent number 12,136,597
- Issue date Nov 5, 2024
- Mediatek Inc.
- Yi-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and fabricating methods thereof
- Patent number 12,136,599
- Issue date Nov 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- He Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including stacked dies with interleaved wire...
- Patent number 12,136,607
- Issue date Nov 5, 2024
- Micron Technology, Inc.
- Koichi Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with backside source contact
- Patent number 12,136,618
- Issue date Nov 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- Kun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical systems fabricated by printing-based assembly
- Patent number 12,136,620
- Issue date Nov 5, 2024
- The Board of Trustees of the University of Illinois
- John A. Rogers
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Arched membrane structure for MEMS device
- Patent number 12,134,557
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jhao-Yi Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Tool for metal plugging or sealing of casing
- Patent number 12,129,735
- Issue date Oct 29, 2024
- ConocoPhillips Company
- David D. Hearn
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HYBRID ELEMENT AND METHOD OF FABRICATING THE SAME
- Publication number 20240387503
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Kyungwook Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture
- Publication number 20240387391
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package Structure with Bump
- Publication number 20240387431
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE
- Publication number 20240387440
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240387447
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Geng-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ON DIE BONDING STRUCTURE
- Publication number 20240387452
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT (3DIC) SYSTEMS WITH A HEAT SPR...
- Publication number 20240387459
- Publication date Nov 21, 2024
- Microsoft Technology Licensing, LLC
- Haohua ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20240387467
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ASSEMBLING PROCESSOR SYSTEMS
- Publication number 20240387496
- Publication date Nov 21, 2024
- 1372934 B.C. Ltd.
- Kelly T. R. Boothby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240387311
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND METHOD OF FORMING
- Publication number 20240387316
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARCHED MEMBRANE STRUCTURE FOR MEMS DEVICE
- Publication number 20240383744
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jhao-Yi Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HETEROGENOUS INTEGRATION SCHEME FOR III-V/Si AND Si CMOS INTEGRATED...
- Publication number 20240387501
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chan-Hong Chern
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, AND MEMORY SYSTEM
- Publication number 20240387402
- Publication date Nov 21, 2024
- Yangtze Memory Technologies Co., Ltd.
- Wei XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387417
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHOD OF FORMING THE SAME
- Publication number 20240387465
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING PACKAGE SEAL RING AND METHODS FOR F...
- Publication number 20240387484
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH
- Publication number 20240387499
- Publication date Nov 21, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH EXTERNAL CONNECTORS
- Publication number 20240387193
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERIPHERAL CIRCUIT HAVING RECESS GATE TRANSISTORS AND METHOD FOR FO...
- Publication number 20240389331
- Publication date Nov 21, 2024
- Yangtze Memory Technologies Co., Ltd.
- Yanwei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTONOMOUS ELECTRICAL POWER SOURCES
- Publication number 20240382774
- Publication date Nov 21, 2024
- FACE INTERNATIONAL CORPORATION
- Clark D. Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240387434
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240387457
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240387468
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE TO DIE INTERFACE CIRCUIT
- Publication number 20240387471
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AN...
- Publication number 20240389307
- Publication date Nov 21, 2024
- Yangtze Memory Technologies Co., Ltd.
- Dongxue ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20240389365
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- SEUNGMIN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INCLUDING BACKSIDE CONDUCTIVE VIAS
- Publication number 20240387652
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Extended Seal Ring Structure on Wafer-Stacking
- Publication number 20240387403
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Hsorng Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES HAVING VERTICAL TRANSISTORS AND METHODS FOR FORMING...
- Publication number 20240387428
- Publication date Nov 21, 2024
- Yangtze Memory Technologies Co., Ltd.
- Hongbin Zhu
- H01 - BASIC ELECTRIC ELEMENTS

Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method having a through substrate via and...

Memory device and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor device

Forming large chips through stitching

Multi-chip integrated fan-out package

Three-dimensional bonding scheme and associated systems and methods

Optical multichip package with multiple system-on-chip dies

Gallium nitride (GAN) three-dimensional integrated circuit technology

EMIB patch on glass laminate substrate

Structure of semiconductor device

Bonding of bridge to multiple semiconductor chips

Multi-die ultrafine pitch patch architecture of interconnect bridge...

Stacked transistor structure with reflection layer

Semiconductor memory device and manufacturing method of semiconduct...

Composite bridge die-to-die interconnects for integrated-circuit pa...

Semiconductor structure and manufacturing method thereof

Integrated fan-out package and the methods of manufacturing

Three-dimension large system integration

Methods of manufacturing three-dimensional integrated circuit struc...

Hybrid bonding contact structure of three-dimensional memory device

Semiconductor device package and manufacturing method thereof

3D semiconductor device and structure with single-crystal layers

Semiconductor package having an interposer in which one or more die...

Three-dimensional memory devices and fabricating methods thereof

Semiconductor devices including stacked dies with interleaved wire...

Three-dimensional memory device with backside source contact

Optical systems fabricated by printing-based assembly

Arched membrane structure for MEMS device

Tool for metal plugging or sealing of casing

Patents Applicationslast 30 patents

HYBRID ELEMENT AND METHOD OF FABRICATING THE SAME

Semiconductor Devices and Methods of Manufacture

Chip Package Structure with Bump

MANUFACTURING METHOD OF PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

DIE ON DIE BONDING STRUCTURE

THREE-DIMENSIONAL INTEGRATED CIRCUIT (3DIC) SYSTEMS WITH A HEAT SPR...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

SYSTEMS AND METHODS FOR ASSEMBLING PROCESSOR SYSTEMS

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR ARRANGEMENT AND METHOD OF FORMING

ARCHED MEMBRANE STRUCTURE FOR MEMS DEVICE

HETEROGENOUS INTEGRATION SCHEME FOR III-V/Si AND Si CMOS INTEGRATED...

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, AND MEMORY SYSTEM

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT PACKAGES AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING PACKAGE SEAL RING AND METHODS FOR F...

FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH

SEMICONDUCTOR DEVICES WITH EXTERNAL CONNECTORS

PERIPHERAL CIRCUIT HAVING RECESS GATE TRANSISTORS AND METHOD FOR FO...

AUTONOMOUS ELECTRICAL POWER SOURCES

PACKAGE STRUCTURE

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

PACKAGE AND METHOD OF FABRICATING THE SAME

DIE TO DIE INTERFACE CIRCUIT

FABRICATION METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AN...

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

INTEGRATED CIRCUIT INCLUDING BACKSIDE CONDUCTIVE VIAS

Extended Seal Ring Structure on Wafer-Stacking

MEMORY DEVICES HAVING VERTICAL TRANSISTORS AND METHODS FOR FORMING...