Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00

Industry

CPC
H01L25/50

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/50Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and manufacturing method of the same
- Patent number 11,967,553
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer stacking structure and manufacturing method thereof
- Patent number 11,967,558
- Issue date Apr 23, 2024
- Powerchip Semiconductor Manufacturing Corporation
- Shou-Zen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolated transformer with integrated shield topology for reduced EMI
- Patent number 11,967,566
- Issue date Apr 23, 2024
- Texas Instruments Incorporated
- Vijaylaxmi Gumaste Khanolkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies with communication networks
- Patent number 11,967,580
- Issue date Apr 23, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 11,967,583
- Issue date Apr 23, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous packaging integration of photonic and electronic elem...
- Patent number 11,966,090
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Stefan Rusu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package with top-side memory module
- Patent number 11,967,587
- Issue date Apr 23, 2024
- Marvell Israel (M.I.S.L) Ltd.
- Dan Azeroual
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming package structure with cavity substrate
- Patent number 11,967,579
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and data storage system including the same
- Patent number 11,967,574
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Sungmin Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip device and method of formation
- Patent number 11,967,582
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number 11,967,584
- Issue date Apr 23, 2024
- Hitachi Astemo, Ltd.
- Hiromi Shimazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package, semiconductor package structure, and method for...
- Patent number 11,961,831
- Issue date Apr 16, 2024
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Size and efficiency of dies
- Patent number 11,961,804
- Issue date Apr 16, 2024
- Intel Corporation
- Mathew J. Manusharow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to dual-sided radio-frequency package w...
- Patent number 11,961,805
- Issue date Apr 16, 2024
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device assemblies and packages including multiple d...
- Patent number 11,961,825
- Issue date Apr 16, 2024
- Micron Technology, Inc.
- Aparna U. Limaye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded wafer device structure and methods for making the same
- Patent number 11,961,826
- Issue date Apr 16, 2024
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with vertical field effect transist...
- Patent number 11,963,352
- Issue date Apr 16, 2024
- SanDisk Technologies LLC
- Peter Rabkin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structurally embedded and inhospitable environment systems having a...
- Patent number 11,957,922
- Issue date Apr 16, 2024
- Face International Corporation
- Clark D Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure comprising buffer layer for reducing thermal stre...
- Patent number 11,961,777
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies including multiple stacks of differ...
- Patent number 11,961,821
- Issue date Apr 16, 2024
- Micron Technology, Inc.
- Blaine J. Thurgood
- G11 - INFORMATION STORAGE
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 11,961,827
- Issue date Apr 16, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and manufacturing method thereof
- Patent number 11,963,355
- Issue date Apr 16, 2024
- SK hynix Inc.
- Dong Hwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal pads over TSV
- Patent number 11,955,445
- Issue date Apr 9, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having pads with stepped structure
- Patent number 11,955,464
- Issue date Apr 9, 2024
- Samsung Electronics Co., Ltd.
- Myung Kee Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing loss in stacked quantum devices
- Patent number 11,955,465
- Issue date Apr 9, 2024
- Google LLC
- Theodore Charles White
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Embedded stress absorber in package
- Patent number 11,955,455
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies with system and methods for aligning dies...
- Patent number 11,955,461
- Issue date Apr 9, 2024
- Micron Technology, Inc.
- Shiro Uchiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package stacking using chip to wafer bonding
- Patent number 11,955,462
- Issue date Apr 9, 2024
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package device
- Patent number 11,955,433
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE, SEMICONDUCTOR DEVICE AND METHOD FOR FORMING SEMI...
- Publication number 20240136284
- Publication date Apr 25, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Jiarui ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240136327
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- AENEE JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER OF MICRO DEVICES
- Publication number 20240136215
- Publication date Apr 25, 2024
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240136273
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Geunwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20240136323
- Publication date Apr 25, 2024
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PILLARS WITH INCLINED SURF...
- Publication number 20240136316
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chiang-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20240136341
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Seokgeun AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light Emitting Structure
- Publication number 20240136345
- Publication date Apr 25, 2024
- Apple Inc.
- John A. Higginson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE ANDELECTRONIC SYSTEM...
- Publication number 20240138157
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Jiwon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240132340
- Publication date Apr 25, 2024
- STMicroelectronics (Malta) Ltd.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE
- Publication number 20240136269
- Publication date Apr 25, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
InFO-POP Structures with TIVs Having Cavities
- Publication number 20240136298
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Dp., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE...
- Publication number 20240128208
- Publication date Apr 18, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240128179
- Publication date Apr 18, 2024
- Unimicron Technology Corp.
- Jyun-Hong CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240128195
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Sangwoong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING
- Publication number 20240128211
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
- Publication number 20240128237
- Publication date Apr 18, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS ASYMMETRIC DUAL SIDE MODULE
- Publication number 20240128240
- Publication date Apr 18, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGING
- Publication number 20240128256
- Publication date Apr 18, 2024
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240128232
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...
- Publication number 20240128254
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20240128255
- Publication date Apr 18, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC INTERPOSER WITH ELECTRICAL-CONNECTION CUT-IN
- Publication number 20240128182
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT FABRICATION
- Publication number 20240128235
- Publication date Apr 18, 2024
- Cirrus Logic International Semiconductor Ltd.
- David PATTEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240120280
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- Kyungdon Mun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ION IMPLANTATION WITH ANNEALING FOR SUBSTRATE CUTTING
- Publication number 20240120314
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huicheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER PACKAGES CONTAINING ELECTRICALLY-ROUTED LIDS AND ME...
- Publication number 20240120321
- Publication date Apr 11, 2024
- NXP USA, Inc.
- Elie A. Maalouf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240120315
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE, STRUCTURE AND METHODS WITH CONNECTIVITY ST...
- Publication number 20240121968
- Publication date Apr 11, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE FOR DIRECT COOLING MULTIPLE POWER MODULES
- Publication number 20240120328
- Publication date Apr 11, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS

Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and manufacturing method of the same

Wafer stacking structure and manufacturing method thereof

Isolated transformer with integrated shield topology for reduced EMI

Microelectronic assemblies with communication networks

3D semiconductor device and structure with metal layers

Heterogeneous packaging integration of photonic and electronic elem...

IC package with top-side memory module

Method for forming package structure with cavity substrate

Memory device and data storage system including the same

Multi-chip device and method of formation

Power semiconductor device

Solderless interconnection structure and method of forming same

Electronic package, semiconductor package structure, and method for...

Size and efficiency of dies

Devices and methods related to dual-sided radio-frequency package w...

Microelectronic device assemblies and packages including multiple d...

Bonded wafer device structure and methods for making the same

Three-dimensional memory device with vertical field effect transist...

Structurally embedded and inhospitable environment systems having a...

Package structure comprising buffer layer for reducing thermal stre...

Semiconductor device assemblies including multiple stacks of differ...

3D semiconductor device and structure with metal layers

Semiconductor memory device and manufacturing method thereof

Metal pads over TSV

Semiconductor package having pads with stepped structure

Reducing loss in stacked quantum devices

Embedded stress absorber in package

Semiconductor assemblies with system and methods for aligning dies...

Package stacking using chip to wafer bonding

Package-on-package device

Patents Applicationslast 30 patents

SEMICONDUCTOR DIE, SEMICONDUCTOR DEVICE AND METHOD FOR FORMING SEMI...

MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

TRANSFER OF MICRO DEVICES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

MICROELECTRONIC ASSEMBLIES

SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PILLARS WITH INCLINED SURF...

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

Light Emitting Structure

THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE ANDELECTRONIC SYSTEM...

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE

InFO-POP Structures with TIVs Having Cavities

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE...

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS

LOW STRESS ASYMMETRIC DUAL SIDE MODULE

MULTI-CHIP PACKAGING

SEMICONDUCTOR PACKAGE

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...

MICROELECTRONIC ASSEMBLIES

DIELECTRIC INTERPOSER WITH ELECTRICAL-CONNECTION CUT-IN

ELECTRONIC CIRCUIT FABRICATION

SEMICONDUCTOR PACKAGE

ION IMPLANTATION WITH ANNEALING FOR SUBSTRATE CUTTING

POWER AMPLIFIER PACKAGES CONTAINING ELECTRICALLY-ROUTED LIDS AND ME...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

3D SEMICONDUCTOR DEVICE, STRUCTURE AND METHODS WITH CONNECTIVITY ST...

POWER MODULE PACKAGE FOR DIRECT COOLING MULTIPLE POWER MODULES