Multistep processes for the separation of wafers into individual elements not provided for in groups B81C1/00873 - B81C1/00896

Industry

CPC
B81C1/00904

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C1/00Manufacture or treatment of devices or systems in or on a substrate

Current Industry

B81C1/00904Multistep processes for the separation of wafers into individual elements not provided for in groups B81C1/00873 - B81C1/00896

Industries

Patents Grantslast 30 patents

Information Patent Grant
Laser-assisted material phase-change and expulsion micro-machining...
- Patent number 12,077,432
- Issue date Sep 3, 2024
- Massachusetts Institute of Technology
- Prashant Patil
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method with stealth dicing process for fabricating MEMS semiconduct...
- Patent number 11,939,216
- Issue date Mar 26, 2024
- Infineon Technologies AG
- Andre Brockmeier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device manufacturing method and mems device
- Patent number 11,597,648
- Issue date Mar 7, 2023
- Murata Manufacturing Co., Ltd.
- Masakazu Fukumitsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device chip manufacturing method
- Patent number 11,469,142
- Issue date Oct 11, 2022
- Disco Corporation
- Frank Wei
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer processing method
- Patent number 11,420,294
- Issue date Aug 23, 2022
- Disco Corporation
- Jingshi Chi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Techniques for fabricating waveguide facets and die separation
- Patent number 11,402,579
- Issue date Aug 2, 2022
- Medlumics S.L.
- José Luis Rubio Guivernau
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of forming microelectromechanical s...
- Patent number 11,370,655
- Issue date Jun 28, 2022
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and systems for fabricating miniaturized nanotube sensors
- Patent number 11,019,734
- Issue date May 25, 2021
- Tula Health, Inc.
- Robert Davis
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Deposition of protective material at wafer level in front end for e...
- Patent number 10,858,245
- Issue date Dec 8, 2020
- Infineon Technologies AG
- Florian Brandl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor element and methods for manufacturing the same
- Patent number 10,766,769
- Issue date Sep 8, 2020
- Infineon Technologies AG
- Christian Bretthauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of forming microelectromechanical s...
- Patent number 10,662,056
- Issue date May 26, 2020
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Deposition of protective material at wafer level in front end for e...
- Patent number 10,370,244
- Issue date Aug 6, 2019
- Infineon Technologies AG
- Florian Brandl
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for wafer-level manufacturing of objects and corresponding s...
- Patent number 10,343,899
- Issue date Jul 9, 2019
- ams Sensors Singapore Pte. Ltd.
- Peter Riel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of forming microelectromechanical s...
- Patent number 10,189,702
- Issue date Jan 29, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of strain gauge fabrication using a transfer substrate
- Patent number 10,183,862
- Issue date Jan 22, 2019
- GM Global Technology Operations LLC
- Stephen A. Berggren
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for simultaneous structuring and chip singulation
- Patent number 10,005,659
- Issue date Jun 26, 2018
- Infineon Technologies AG
- Thomas Grille
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor element and methods for manufacturing the same
- Patent number 9,938,141
- Issue date Apr 10, 2018
- Infineon Technologies AG
- Christian Bretthauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Silicon-on-sapphire device with minimal thermal strain preload and...
- Patent number 9,890,033
- Issue date Feb 13, 2018
- Honeywell International Inc.
- Gregory C. Brown
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Leak detection using cavity surface quality factor
- Patent number 9,796,585
- Issue date Oct 24, 2017
- Texas Instruments Incorporated
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for simultaneous structuring and chip singulation
- Patent number 9,610,543
- Issue date Apr 4, 2017
- Infineon Technologies AG
- Thomas Grille
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of forming microelectromechanical s...
- Patent number 9,527,723
- Issue date Dec 27, 2016
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Production of micro-mechanical devices
- Patent number 9,482,863
- Issue date Nov 1, 2016
- Apple Inc.
- Raviv Erlich
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device chip manufacturing method
- Patent number 9,206,037
- Issue date Dec 8, 2015
- Disco Corporation
- Aris Bernales
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronic packages having stacked accelerometer and magnetome...
- Patent number 9,108,841
- Issue date Aug 18, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonded microelectromechanical assemblies
- Patent number 8,979,247
- Issue date Mar 17, 2015
- FUJIFILM Dimatix, Inc.
- Paul A. Hoisington
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 8,941,152
- Issue date Jan 27, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Die singulation method
- Patent number 8,623,744
- Issue date Jan 7, 2014
- Sandia Corporation
- Thomas P. Swiler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS packaging with etching and thinning of lid wafer to form lids...
- Patent number 8,597,985
- Issue date Dec 3, 2013
- Sandia Corporation
- Rajen Chanchani
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device
- Patent number 8,497,149
- Issue date Jul 30, 2013
- Wolfson Microelectronics plc
- Richard Ian Laming
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Die singulation method
- Patent number 8,461,023
- Issue date Jun 11, 2013
- Sandia Corporation
- Thomas P. Swiler
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE
- Publication number 20240355677
- Publication date Oct 24, 2024
- TDK Corporation
- Shinji HARA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240109768
- Publication date Apr 4, 2024
- Advanced Semiconductor Engineering, Inc.
- Chieh-An YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED DICING DIE BONDING SHEET AND METHOD FOR PRODUCING SEMICO...
- Publication number 20240087941
- Publication date Mar 14, 2024
- Dow Toray Co., Ltd.
- Nohno TODA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device and Method of Forming Microelectromechanical S...
- Publication number 20220289560
- Publication date Sep 15, 2022
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210246015
- Publication date Aug 12, 2021
- Advanced Semiconductor Engineering, Inc.
- Chieh-An YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE MANUFACTURING METHOD AND MEMS DEVICE
- Publication number 20210147224
- Publication date May 20, 2021
- Murata Manufacturing Co., Ltd.
- Masakazu Fukumitsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Laser-Assisted Material Phase-Change and Expulsion Micro-Machining...
- Publication number 20210139321
- Publication date May 13, 2021
- Massachusetts Institute of Technology
- Prashant Patil
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Forming Microelectromechanical S...
- Publication number 20200399117
- Publication date Dec 24, 2020
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICE CHIP MANUFACTURING METHOD
- Publication number 20200343139
- Publication date Oct 29, 2020
- Disco Corporation
- Frank Wei
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEPOSITION OF PROTECTIVE MATERIAL AT WAFER LEVEL IN FRONT END FOR E...
- Publication number 20190300362
- Publication date Oct 3, 2019
- INFINEON TECHNOLOGIES AG
- Florian BRANDL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20190160597
- Publication date May 30, 2019
- Disco Corporation
- Jingshi CHI
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
DEPOSITION OF PROTECTIVE MATERIAL AT WAFER LEVEL IN FRONT END FOR E...
- Publication number 20190161345
- Publication date May 30, 2019
- INFINEON TECHNOLOGIES AG
- Florian BRANDL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device and Method of Forming Microelectromechanical S...
- Publication number 20190047845
- Publication date Feb 14, 2019
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR ELEMENT AND METHODS FOR MANUFACTURING THE SAME
- Publication number 20180208461
- Publication date Jul 26, 2018
- INFINEON TECHNOLOGIES AG
- Christian BRETTHAUER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device and Method of Forming Microelectromechanical S...
- Publication number 20170297903
- Publication date Oct 19, 2017
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LEAK DETECTION USING CAVITY SURFACE QUALITY FACTOR
- Publication number 20170174511
- Publication date Jun 22, 2017
- TEXAS INSTRUMENTS INCORPORATED
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Simultaneous Structuring and Chip Singulation
- Publication number 20170158493
- Publication date Jun 8, 2017
- INFINEON TECHNOLOGIES AG
- Thomas Grille
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SILICON-ON-SAPPHIRE DEVICE WITH MINIMAL THERMAL STRAIN PRELOAD AND...
- Publication number 20160289061
- Publication date Oct 6, 2016
- Honeywell International Inc.
- Gregory C. Brown
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR CAVITY PACKAGE USING PHOTOSENSITIVE RESIN
- Publication number 20160068387
- Publication date Mar 10, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Noboru Nakanishi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRODUCTION OF MICRO-MECHANICAL DEVICES
- Publication number 20150338643
- Publication date Nov 26, 2015
- PRIMESENSE LTD.
- Raviv Erlich
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONIC PACKAGES HAVING AXIALLY-PARTITIONED HERMETIC CAVITI...
- Publication number 20150274515
- Publication date Oct 1, 2015
- PHILIP H. BOWLES
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device and Method of Forming Microelectromechanical S...
- Publication number 20150259194
- Publication date Sep 17, 2015
- STATS ChipPAC, Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONIC PACKAGES HAVING STACKED ACCELEROMETER AND MAGNETOME...
- Publication number 20150251903
- Publication date Sep 10, 2015
- PHILIP H. BOWLES
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE CHIP MANUFACTURING METHOD
- Publication number 20150251902
- Publication date Sep 10, 2015
- Disco Corporation
- Aris Bernales
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR WAFER-LEVEL MANUFACTURING OF OBJECTS AND CORRESPONDING S...
- Publication number 20140295122
- Publication date Oct 2, 2014
- Peter Riel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE
- Publication number 20140016798
- Publication date Jan 16, 2014
- Richard Ian Laming
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Bonded Microelectromechanical Assemblies
- Publication number 20120019598
- Publication date Jan 26, 2012
- FUJIFILM DIMATIX, INC.
- Paul A. Hoisington
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMACHINED TRANSDUCERS AND METHOD OF FABRICATION
- Publication number 20110120971
- Publication date May 26, 2011
- Avago Technologies Wireless IP (Singapore) Pte. Ltd.
- David Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Metal-Assisted Chemical Etching of Substrates
- Publication number 20100248449
- Publication date Sep 30, 2010
- Georgia Tech Research Corporation
- Owen Hildreth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Bonded Microelectromechanical Assemblies
- Publication number 20100187667
- Publication date Jul 29, 2010
- FUJIFILM DIMATIX, INC.
- Paul A. Hoisington
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Multistep processes for the separation of wafers into individual elements not provided for in groups B81C1/00873 - B81C1/00896

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Laser-assisted material phase-change and expulsion micro-machining...

Method with stealth dicing process for fabricating MEMS semiconduct...

MEMS device manufacturing method and mems device

Device chip manufacturing method

Wafer processing method

Techniques for fabricating waveguide facets and die separation

Semiconductor device and method of forming microelectromechanical s...

Methods and systems for fabricating miniaturized nanotube sensors

Deposition of protective material at wafer level in front end for e...

Semiconductor element and methods for manufacturing the same

Semiconductor device and method of forming microelectromechanical s...

Deposition of protective material at wafer level in front end for e...

Method for wafer-level manufacturing of objects and corresponding s...

Semiconductor device and method of forming microelectromechanical s...

Method of strain gauge fabrication using a transfer substrate

Method for simultaneous structuring and chip singulation

Semiconductor element and methods for manufacturing the same

Silicon-on-sapphire device with minimal thermal strain preload and...

Leak detection using cavity surface quality factor

Method for simultaneous structuring and chip singulation

Semiconductor device and method of forming microelectromechanical s...

Production of micro-mechanical devices

MEMS device chip manufacturing method

Microelectronic packages having stacked accelerometer and magnetome...

Bonded microelectromechanical assemblies

Semiconductor device

Die singulation method

MEMS packaging with etching and thinning of lid wafer to form lids...

MEMS device

Die singulation method

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE

SENSOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

INTEGRATED DICING DIE BONDING SHEET AND METHOD FOR PRODUCING SEMICO...

Semiconductor Device and Method of Forming Microelectromechanical S...

SENSOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

MEMS DEVICE MANUFACTURING METHOD AND MEMS DEVICE

Laser-Assisted Material Phase-Change and Expulsion Micro-Machining...

Semiconductor Device and Method of Forming Microelectromechanical S...

DEVICE CHIP MANUFACTURING METHOD

DEPOSITION OF PROTECTIVE MATERIAL AT WAFER LEVEL IN FRONT END FOR E...

WAFER PROCESSING METHOD

DEPOSITION OF PROTECTIVE MATERIAL AT WAFER LEVEL IN FRONT END FOR E...

Semiconductor Device and Method of Forming Microelectromechanical S...

SEMICONDUCTOR ELEMENT AND METHODS FOR MANUFACTURING THE SAME

Semiconductor Device and Method of Forming Microelectromechanical S...

LEAK DETECTION USING CAVITY SURFACE QUALITY FACTOR

Method for Simultaneous Structuring and Chip Singulation

SILICON-ON-SAPPHIRE DEVICE WITH MINIMAL THERMAL STRAIN PRELOAD AND...

SEMICONDUCTOR CAVITY PACKAGE USING PHOTOSENSITIVE RESIN

PRODUCTION OF MICRO-MECHANICAL DEVICES

MICROELECTRONIC PACKAGES HAVING AXIALLY-PARTITIONED HERMETIC CAVITI...

Semiconductor Device and Method of Forming Microelectromechanical S...

MICROELECTRONIC PACKAGES HAVING STACKED ACCELEROMETER AND MAGNETOME...

MEMS DEVICE CHIP MANUFACTURING METHOD

METHOD FOR WAFER-LEVEL MANUFACTURING OF OBJECTS AND CORRESPONDING S...

MEMS DEVICE

Bonded Microelectromechanical Assemblies

MICROMACHINED TRANSDUCERS AND METHOD OF FABRICATION

Metal-Assisted Chemical Etching of Substrates

Bonded Microelectromechanical Assemblies