Multistep processes

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/02008Multistep processes

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Profile control in forming epitaxy regions for transistors
- Patent number 12,132,100
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shahaji B. More
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial growth apparatus and method of producing epitaxial wafer
- Patent number 12,129,543
- Issue date Oct 29, 2024
- Sumco Corporation
- Haku Komori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic substrate having differential coaxial vias
- Patent number 12,063,735
- Issue date Aug 13, 2024
- Texas Instruments Incorporated
- Snehamay Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor silicon wafer
- Patent number 12,046,469
- Issue date Jul 23, 2024
- Globalwafers Japan Co., Ltd
- Takeshi Senda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure
- Patent number 11,967,612
- Issue date Apr 23, 2024
- NANYA TECHNOLOGY CORPORATION
- Ting-Cih Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming graphene on a silicon substrate
- Patent number 11,837,635
- Issue date Dec 5, 2023
- Paragraf Limited
- Sebastian Dixon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for manufacturing a wafer
- Patent number 11,830,724
- Issue date Nov 28, 2023
- STMicroelectronics S.r.l.
- Ruggero Anzalone
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic substrate having differential coaxial vias
- Patent number 11,800,636
- Issue date Oct 24, 2023
- Texas Instruments Incorporated
- Snehamay Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing gallium nitride semiconductor device
- Patent number 11,784,039
- Issue date Oct 10, 2023
- Denso Corporation
- Jun Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wafer structure and method of manufacturing the same
- Patent number 11,757,003
- Issue date Sep 12, 2023
- GlobalWafers Co., Ltd.
- Ying-Ru Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical liquid supplying system and method of supplying chemical l...
- Patent number 11,715,656
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,456,353
- Issue date Sep 27, 2022
- NANYA TECHNOLOGY CORPORATION
- Ting-Cih Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking structure applicable to manufacturing circuit board
- Patent number 11,322,377
- Issue date May 3, 2022
- Unimicron Technology Corp.
- Po-Hsuan Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for manufacturing a wafer
- Patent number 11,309,177
- Issue date Apr 19, 2022
- STMicroelectronics S.r.l.
- Ruggero Anzalone
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Systems and methods for wafer map analysis
- Patent number 11,282,695
- Issue date Mar 22, 2022
- Samsung Electronics Co., Ltd.
- Nuo Xu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor wafers and semiconductor devices with barrier layer a...
- Patent number 11,239,384
- Issue date Feb 1, 2022
- INFINEON TECHNOLOGIESAG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compound semiconductor laminate substrate, method for manufacturing...
- Patent number 11,177,123
- Issue date Nov 16, 2021
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Nagasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light assisted platelet formation facilitating layer transfer from...
- Patent number 11,173,697
- Issue date Nov 16, 2021
- GlobalWafers Co., Ltd.
- Gang Wang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electronic substrate having differential coaxial vias
- Patent number 11,160,163
- Issue date Oct 26, 2021
- Texas Instruments Incorporated
- Snehamay Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,152,338
- Issue date Oct 19, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Zhi-Qiang Wu
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Etching using chamber with top plate formed of non-oxygen containin...
- Patent number 11,120,986
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- En-Ping Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bonded wafer, a method of manufacturing the same, and a method of f...
- Patent number 11,087,970
- Issue date Aug 10, 2021
- Canon Kabushiki Kaisha
- Ryoji Kanri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device manufacturing method
- Patent number 11,069,536
- Issue date Jul 20, 2021
- Tokyo Electron Limited
- Sunghil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing bonded SOI wafer
- Patent number 11,056,381
- Issue date Jul 6, 2021
- Shin-Etsu Handotai Co., Ltd.
- Toru Ishizuka
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method of forming memory device
- Patent number 11,017,852
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Chi Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and method for forming the same
- Patent number 11,011,224
- Issue date May 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Chi Tu
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 10,964,813
- Issue date Mar 30, 2021
- Semiconductor Manufacturing (Beijing) International Corporation
- Fei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,957,607
- Issue date Mar 23, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wei-Sheng Yun
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor substrate processing method
- Patent number 10,872,757
- Issue date Dec 22, 2020
- Disco Corporation
- Kazuya Hirata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafers and semiconductor devices with barrier layer a...
- Patent number 10,833,218
- Issue date Nov 10, 2020
- Infineon Technologies AG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROFILE CONTROL IN FORMING EPITAXY REGIONS FOR TRANSISTORS
- Publication number 20240371976
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shahaji B. More
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING COMPOUND SEMICONDUCTOR BONDED SUBSTRATE AND...
- Publication number 20240371641
- Publication date Nov 7, 2024
- Shin-Etsu Handotai Co., Ltd.
- Junya ISHIZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20240234497
- Publication date Jul 11, 2024
- NANYA TECHNOLOGY CORPORATION
- Ting-Cih KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER FOR THE CVD GROWTH OF UNIFORM GRAPHENE AND METHOD OF MANUFACT...
- Publication number 20240153762
- Publication date May 9, 2024
- Paragraf Limited
- Sebastian DIXON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING THE RESIDUE OF A DONOR SUBSTRATE, A LAYER OF W...
- Publication number 20240120191
- Publication date Apr 11, 2024
- SOITEC
- Isabelle Huyet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING GRAPHENE ON A SILICON SUBSTRATE
- Publication number 20240072118
- Publication date Feb 29, 2024
- Paragraf Limited
- Sebastian Dixon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF DIAMOND COMPOSITE WAFER
- Publication number 20240047192
- Publication date Feb 8, 2024
- nD-HI Technologies Lab,Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SUBSTRATE HAVING DIFFERENTIAL COAXIAL VIAS
- Publication number 20230363083
- Publication date Nov 9, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Snehamay Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SUPPLYING CHEMICAL LIQUID
- Publication number 20230326772
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Cheng CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Profile Control In Forming Epitaxy Regions for Transistors
- Publication number 20230307223
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shahaji B. More
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A CARRIER SUBSTRATE ON A SEMICONDUCTOR WAF...
- Publication number 20230274928
- Publication date Aug 31, 2023
- ROBERT BOSCH GmbH
- Bernhard Polzinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATED OVERLAY REMOVAL DURING WAFER SINGULATION
- Publication number 20230238234
- Publication date Jul 27, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Andrew NELSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING A SELF-SUPPORTING SUBSTRATE
- Publication number 20230175167
- Publication date Jun 8, 2023
- Yiguan information technology (Shanghai) Co., Ltd.
- Tao Jiang
- C30 - CRYSTAL GROWTH
Information Patent Application
N-TYPE DOPED GERMANIUM MONOCRYSTALS AND WAFERS DERIVED THEREFROM
- Publication number 20230170391
- Publication date Jun 1, 2023
- Umicore
- Johannes VANPAEMEL
- C30 - CRYSTAL GROWTH
Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING T...
- Publication number 20230154987
- Publication date May 18, 2023
- DENSO CORPORATION
- HIROKI TSUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR FORMING MATERIAL WITHIN A GAP
- Publication number 20230099607
- Publication date Mar 30, 2023
- ASM IP HOLDING B.V.
- Timothee Blanquart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR FORMING MATERIAL WITHIN A GAP USING MELTABLE...
- Publication number 20230096062
- Publication date Mar 30, 2023
- ASM IP HOLDING B.V.
- Timothee Blanquart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR SILICON WAFER
- Publication number 20230055929
- Publication date Feb 23, 2023
- GlobalWafers Japan Co., Ltd.
- Takeshi SENDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
EPITAXIAL GROWTH APPARATUS AND METHOD OF PRODUCING EPITAXIAL WAFER
- Publication number 20220251726
- Publication date Aug 11, 2022
- SUMCO CORPORATION
- Haku KOMORI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
EPITAXIAL WAFER AND METHOD OF FABRICATING THE SAME, AND ELECTROCHEM...
- Publication number 20220214298
- Publication date Jul 7, 2022
- SOUTH CHINA NORMAL UNIVERSITY
- Richard NOTZEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR MANUFACTURING A WAFER
- Publication number 20220208541
- Publication date Jun 30, 2022
- STMicroelectronics S.r.l.
- Ruggero ANZALONE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SiC SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREFOR
- Publication number 20220102502
- Publication date Mar 31, 2022
- Rohm Co., Ltd.
- Shingo OTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20220102490
- Publication date Mar 31, 2022
- NANYA TECHNOLOGY CORPORATION
- Ting-Cih KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING GRAPHENE ON A SILICON SUBSTRATE
- Publication number 20220102501
- Publication date Mar 31, 2022
- Paragraf Limited
- Sebastian Dixon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAN SUBSTRATE WAFER AND PRODUCTION METHOD FOR SAME
- Publication number 20220084820
- Publication date Mar 17, 2022
- MITSUBISHI CHEMICAL CORPORATION
- Yuuki ENATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAN SUBSTRATE WAFER AND METHOD FOR MANUFACTURING SAME
- Publication number 20220084819
- Publication date Mar 17, 2022
- MITSUBISHI CHEMICAL CORPORATION
- Kenji ISO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WAFER STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220028977
- Publication date Jan 27, 2022
- GLOBALWAFERS CO., LTD.
- Ying-Ru Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220020847
- Publication date Jan 20, 2022
- NANYA TECHNOLOGY CORPORATION
- Ting-Cih KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SUBSTRATE HAVING DIFFERENTIAL COAXIAL VIAS
- Publication number 20220015225
- Publication date Jan 13, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Snehamay Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING GALLIUM NITRIDE SEMICONDUCTOR DEVICE
- Publication number 20210327702
- Publication date Oct 21, 2021
- DENSO CORPORATION
- Jun KOJIMA
- H01 - BASIC ELECTRIC ELEMENTS

Multistep processes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Profile control in forming epitaxy regions for transistors

Epitaxial growth apparatus and method of producing epitaxial wafer

Electronic substrate having differential coaxial vias

Manufacturing method for semiconductor silicon wafer

Method of manufacturing semiconductor structure

Method of forming graphene on a silicon substrate

Apparatus and method for manufacturing a wafer

Electronic substrate having differential coaxial vias

Method for manufacturing gallium nitride semiconductor device

Bonding wafer structure and method of manufacturing the same

Chemical liquid supplying system and method of supplying chemical l...

Semiconductor structure and manufacturing method thereof

Stacking structure applicable to manufacturing circuit board

Apparatus and method for manufacturing a wafer

Systems and methods for wafer map analysis

Semiconductor wafers and semiconductor devices with barrier layer a...

Compound semiconductor laminate substrate, method for manufacturing...

Light assisted platelet formation facilitating layer transfer from...

Electronic substrate having differential coaxial vias

Semiconductor device and manufacturing method thereof

Etching using chamber with top plate formed of non-oxygen containin...

Bonded wafer, a method of manufacturing the same, and a method of f...

Device manufacturing method

Method for producing bonded SOI wafer

Method of forming memory device

Memory device and method for forming the same

Semiconductor device and manufacturing method therefor

Semiconductor device and method for manufacturing the same

Semiconductor substrate processing method

Semiconductor wafers and semiconductor devices with barrier layer a...

Patents Applicationslast 30 patents

PROFILE CONTROL IN FORMING EPITAXY REGIONS FOR TRANSISTORS

METHOD OF MANUFACTURING COMPOUND SEMICONDUCTOR BONDED SUBSTRATE AND...

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE

WAFER FOR THE CVD GROWTH OF UNIFORM GRAPHENE AND METHOD OF MANUFACT...

METHOD FOR PREPARING THE RESIDUE OF A DONOR SUBSTRATE, A LAYER OF W...

METHOD OF FORMING GRAPHENE ON A SILICON SUBSTRATE

MANUFACTURING METHOD OF DIAMOND COMPOSITE WAFER

ELECTRONIC SUBSTRATE HAVING DIFFERENTIAL COAXIAL VIAS

METHOD OF SUPPLYING CHEMICAL LIQUID

Profile Control In Forming Epitaxy Regions for Transistors

METHOD FOR MANUFACTURING A CARRIER SUBSTRATE ON A SEMICONDUCTOR WAF...

AUTOMATED OVERLAY REMOVAL DURING WAFER SINGULATION

METHOD FOR PREPARING A SELF-SUPPORTING SUBSTRATE

N-TYPE DOPED GERMANIUM MONOCRYSTALS AND WAFERS DERIVED THEREFROM

SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING T...

METHOD AND SYSTEM FOR FORMING MATERIAL WITHIN A GAP

METHOD AND SYSTEM FOR FORMING MATERIAL WITHIN A GAP USING MELTABLE...

MANUFACTURING METHOD FOR SEMICONDUCTOR SILICON WAFER

EPITAXIAL GROWTH APPARATUS AND METHOD OF PRODUCING EPITAXIAL WAFER

EPITAXIAL WAFER AND METHOD OF FABRICATING THE SAME, AND ELECTROCHEM...

APPARATUS AND METHOD FOR MANUFACTURING A WAFER

SiC SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREFOR

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE

METHOD OF FORMING GRAPHENE ON A SILICON SUBSTRATE

GAN SUBSTRATE WAFER AND PRODUCTION METHOD FOR SAME

GAN SUBSTRATE WAFER AND METHOD FOR MANUFACTURING SAME

BONDING WAFER STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

ELECTRONIC SUBSTRATE HAVING DIFFERENTIAL COAXIAL VIAS

METHOD FOR MANUFACTURING GALLIUM NITRIDE SEMICONDUCTOR DEVICE