TREA

Nanotubes or nanowires

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  • CPC
  • H05K2201/026
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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/026Nanotubes or nanowires
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    WIRING BOARD
    • Publication number 20250220813
    • Publication date Jul 3, 2025
    • KYOCERA CORPORATION
    • Hiroaki SANO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    CERAMIC WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
    • Publication number 20250203768
    • Publication date Jun 19, 2025
    • KYOCERA CORPORATION
    • Makoto YAMAMOTO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    METAL NANOWIRE INK FOR THE FORMATION OF TRANSPARENT CONDUCTIVE FILM...
    • Publication number 20250188302
    • Publication date Jun 12, 2025
    • EKC Technology, Inc.
    • Ying-Syi Li
    • G06 - COMPUTING CALCULATING COUNTING
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    THERMOSETTING RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATE, PRI...
    • Publication number 20250163267
    • Publication date May 22, 2025
    • Masashi OJI
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Application

    METALLIZED VIAS IN GLASS AND SILICON SUBSTRATES, INTERPOSERS, AND M...
    • Publication number 20250159807
    • Publication date May 15, 2025
    • Kuprion Inc.
    • Alfred A. Zinn
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD
    • Publication number 20250120016
    • Publication date Apr 10, 2025
    • KYOCERA CORPORATION
    • Hiroaki SANO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    LOW STRESS THROUGH GLASS VIAS (TGVS)
    • Publication number 20250089156
    • Publication date Mar 13, 2025
    • Intel Corporation
    • Mohamed R. SABER
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20250089164
    • Publication date Mar 13, 2025
    • InnoLux Corporation
    • Cheng-Chi WANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SMART WEARABLE CLOTHING INCLUDING STRETCHABLE CIRCUIT ELECTRODE AND...
    • Publication number 20250063656
    • Publication date Feb 20, 2025
    • MIDAS H&T INC.
    • Se Yun CHANG
    • A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
  • Information Patent Application

    SUBSTRATE
    • Publication number 20250056729
    • Publication date Feb 13, 2025
    • MURATA MANUFACTURING CO., LTD.
    • Ryuichi KUBO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COATING AGENT AND METHOD FOR MANUFACTURING MODULE USING THE COATING...
    • Publication number 20250048560
    • Publication date Feb 6, 2025
    • SEKISUI CHEMICAL CO., LTD.
    • Satoru KUROZUMI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20250048562
    • Publication date Feb 6, 2025
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20240431031
    • Publication date Dec 26, 2024
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD
    • Publication number 20240407088
    • Publication date Dec 5, 2024
    • KYOCERA CORPORATION
    • Hidetoshi YUGAWA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240365468
    • Publication date Oct 31, 2024
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD AND MANUFACTURING METHOD THEREFOR
    • Publication number 20240357739
    • Publication date Oct 24, 2024
    • TOPPAN Holdings Inc.
    • Tomoyuki Ishii
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Transparent Conductive Film
    • Publication number 20240355501
    • Publication date Oct 24, 2024
    • Chasm Advanced Materials, Inc.
    • Robert F. Praino
    • B82 - NANO-TECHNOLOGY
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240324103
    • Publication date Sep 26, 2024
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SHEET FOR COMPONENT CARRIER COMPRISING SEPARATE STRUCTURES WITH FIL...
    • Publication number 20240314927
    • Publication date Sep 19, 2024
    • AT&S Austria Technologie & Systemtechnik AG
    • Nina WANG
    • H01 - BASIC ELECTRIC ELEMENTS
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    PRINTED WIRING BOARD
    • Publication number 20240306312
    • Publication date Sep 12, 2024
    • IBIDEN CO., LTD.
    • Jun SAKAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240237203
    • Publication date Jul 11, 2024
    • IBIDEN CO., LTD.
    • Keisuke SHIMIZU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240206061
    • Publication date Jun 20, 2024
    • IBIDEN CO., LTD.
    • Ryo ANDO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    TRANSPARENT CONDUCTING FILM AND METHOD FOR FORMING TRANSPARENT COND...
    • Publication number 20240188220
    • Publication date Jun 6, 2024
    • Resonac Corporation
    • Shigeru YAMAKI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME
    • Publication number 20240155760
    • Publication date May 9, 2024
    • Shinko Electric Industries Co., Ltd.
    • Yuji YUKIIRI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20240114619
    • Publication date Apr 4, 2024
    • InnoLux Corporation
    • Cheng-Chi WANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE, RESIN COATED COPPER, A...
    • Publication number 20240059863
    • Publication date Feb 22, 2024
    • LG Innotek Co., Ltd.
    • Yong Suk KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE AND RESIN COATED COPPER...
    • Publication number 20240043654
    • Publication date Feb 8, 2024
    • LG Innotek Co., Ltd.
    • Byeong Kyun CHOI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METAL NANOWIRE INK FOR THE FORMATION OF TRANSPARENT CONDUCTIVE FILM...
    • Publication number 20240043711
    • Publication date Feb 8, 2024
    • C3 Nano, Inc.
    • Ying-Syi Li
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    Carrier assembly and method for producing a carrier assembly
    • Publication number 20230354529
    • Publication date Nov 2, 2023
    • Marco Gavagnin
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Circuit Structure
    • Publication number 20230354515
    • Publication date Nov 2, 2023
    • Ticona LLC
    • Young Shin Kim
    • H01 - BASIC ELECTRIC ELEMENTS