Narrow band gap semiconductor material, <<1ev

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CPC
Y10S257/916

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10S257/00Active solid-state devices

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Y10S257/916Narrow band gap semiconductor material, <<1ev

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Patents Grantslast 30 patents

Information Patent Grant
Passive within via
- Patent number 9,960,079
- Issue date May 1, 2018
- Intel Corporation
- Todd B. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of embedding passive component within via
- Patent number 8,487,446
- Issue date Jul 16, 2013
- Intel Corporation
- Todd B Myers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of embedding passive component within via
- Patent number 7,952,202
- Issue date May 31, 2011
- Intel Corporation
- Todd B Myers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mount multichip devices
- Patent number 7,525,183
- Issue date Apr 28, 2009
- General Semiconductor, Inc.
- Paddy O'Shea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of embedding passive component within via
- Patent number 7,275,316
- Issue date Oct 2, 2007
- Intel Corporation
- Todd B Myers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mount multichip devices
- Patent number 7,242,078
- Issue date Jul 10, 2007
- General Semiconductor, Inc.
- Paddy O'Shea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic component with reduced parasitic inductance and met...
- Patent number 7,002,249
- Issue date Feb 21, 2006
- Primarion, Inc.
- Thomas P. Duffy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount multichip devices
- Patent number 6,919,625
- Issue date Jul 19, 2005
- General Semiconductor, Inc.
- Paddy O'Shea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die assembly having leadframe decoupling characters
- Patent number 6,781,219
- Issue date Aug 24, 2004
- Micron Technology, Inc.
- Lucien J. Bissey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integral capacitor using embedded enclosure for effective electroma...
- Patent number 6,509,640
- Issue date Jan 21, 2003
- Intel Corporation
- Yuan-Liang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die assembly having leadframe decoupling characters a...
- Patent number 6,504,236
- Issue date Jan 7, 2003
- Micron Technology, Inc.
- Lucien J. Bissey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded capacitor assembly in a package
- Patent number 6,346,743
- Issue date Feb 12, 2002
- Intel Corp.
- David G. Figueroa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die assembly having leadframe decoupling characters
- Patent number 6,310,388
- Issue date Oct 30, 2001
- Micron Technology, Inc.
- Lucien J. Bissey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-capacitance lead frame decoupling device
- Patent number 6,184,574
- Issue date Feb 6, 2001
- Micron Technology, Inc.
- Lucien J. Bissey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlled dopant diffusion and metal contamination in thin polycid...
- Patent number 6,114,736
- Issue date Sep 5, 2000
- International Business Machines Corporation
- Karanam Balasubramanyam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-capacitance lead frame decoupling device
- Patent number 6,054,754
- Issue date Apr 25, 2000
- Micron Technology, Inc.
- Lucien J. Bissey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of controlling dopant diffusion and metal contamination in t...
- Patent number 5,923,999
- Issue date Jul 13, 1999
- International Business Machines Corporation
- Karanam Balasubramanyam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile memory board
- Patent number 5,373,478
- Issue date Dec 13, 1994
- Konica Corporation
- Katsuaki Komatsu
- G11 - INFORMATION STORAGE
Information Patent Grant
Schottky barrier diode with ohmic portion
- Patent number 5,306,943
- Issue date Apr 26, 1994
- Murata Manufacturing Co., Ltd.
- Hisashi Ariyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite semiconductor device with Schottky and pn junctions
- Patent number 5,278,443
- Issue date Jan 11, 1994
- Hitachi, Ltd.
- Mutsuhiro Mori
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor rectifier having high breakdown voltage and high spee...
- Patent number 5,262,669
- Issue date Nov 16, 1993
- Shindengen Electric Manufacturing Co., Ltd
- Masaru Wakatabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package
- Patent number 5,162,264
- Issue date Nov 10, 1992
- International Business Machines Corporation
- Werner O. Haug
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit with in-cavity decoupling capacitors
- Patent number 5,103,283
- Issue date Apr 7, 1992
- Larry R. Hite
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 5,067,006
- Issue date Nov 19, 1991
- Sumitomo Electric Industries, Ltd.
- Nobuo Shiga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via capacitors within multi-layer, 3 dimensional structures/substrates
- Patent number 5,055,966
- Issue date Oct 8, 1991
- Hughes Aircraft Company
- Hal D. Smith
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Combined flat capacitor and tab integrated circuit chip and method
- Patent number 5,049,979
- Issue date Sep 17, 1991
- Microelectronics and Computer Technology Corporation
- Seyed H. Hashemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package capacitor cover
- Patent number 5,043,533
- Issue date Aug 27, 1991
- Honeywell Inc.
- Richard K. Spielberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of ceramic capacitor
- Patent number 5,031,069
- Issue date Jul 9, 1991
- Sundstrand Corporation
- Kyle Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit boards and cards having buried thin film capacitors...
- Patent number 5,027,253
- Issue date Jun 25, 1991
- IBM Corporation
- John M. Lauffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package
- Patent number 5,016,087
- Issue date May 14, 1991
- International Business Machines Corporation
- Werner O. Haug
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PASSIVE WITHIN VIA
- Publication number 20130249112
- Publication date Sep 26, 2013
- Todd B. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF EMBEDDING PASSIVE COMPONENT WITHIN VIA
- Publication number 20110198723
- Publication date Aug 18, 2011
- Todd B. Myers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF EMBEDDING PASSIVE COMPONENT WITHIN VIA
- Publication number 20090057910
- Publication date Mar 5, 2009
- Intel Corporation
- Todd B. Myers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Surface mount multichip devices
- Publication number 20080017959
- Publication date Jan 24, 2008
- Paddy O'Shea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface mount multichip devices
- Publication number 20050248007
- Publication date Nov 10, 2005
- Paddy O'Shea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passive within via
- Publication number 20050224989
- Publication date Oct 13, 2005
- Todd B. Myers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Surface mount multichip devices
- Publication number 20050006731
- Publication date Jan 13, 2005
- General Semiconductor, Inc.
- Paddy O'Shea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatus for reducing parasitic inductance using inter...
- Publication number 20040104456
- Publication date Jun 3, 2004
- Thomas P. Duffy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor die assembly having leadframe decoupling characters
- Publication number 20030011050
- Publication date Jan 16, 2003
- Lucien J. Bissey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor die assembly having leadframe decoupling characters
- Publication number 20020003294
- Publication date Jan 10, 2002
- Lucien J. Bissey
- H01 - BASIC ELECTRIC ELEMENTS

Narrow band gap semiconductor material, <<1ev

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Passive within via

Method of embedding passive component within via

Method of embedding passive component within via

Surface mount multichip devices

Method of embedding passive component within via

Surface mount multichip devices

Microelectronic component with reduced parasitic inductance and met...

Surface mount multichip devices

Semiconductor die assembly having leadframe decoupling characters

Integral capacitor using embedded enclosure for effective electroma...

Semiconductor die assembly having leadframe decoupling characters a...

Embedded capacitor assembly in a package

Semiconductor die assembly having leadframe decoupling characters

Multi-capacitance lead frame decoupling device

Controlled dopant diffusion and metal contamination in thin polycid...

Multi-capacitance lead frame decoupling device

Method of controlling dopant diffusion and metal contamination in t...

Non-volatile memory board

Schottky barrier diode with ohmic portion

Composite semiconductor device with Schottky and pn junctions

Semiconductor rectifier having high breakdown voltage and high spee...

Integrated circuit package

Packaged integrated circuit with in-cavity decoupling capacitors

Semiconductor device

Via capacitors within multi-layer, 3 dimensional structures/substrates

Combined flat capacitor and tab integrated circuit chip and method

Chip package capacitor cover

Integration of ceramic capacitor

Printed circuit boards and cards having buried thin film capacitors...

Integrated circuit package

Patents Applicationslast 30 patents

PASSIVE WITHIN VIA

METHOD OF EMBEDDING PASSIVE COMPONENT WITHIN VIA

METHOD OF EMBEDDING PASSIVE COMPONENT WITHIN VIA

Surface mount multichip devices

Surface mount multichip devices

Passive within via

Surface mount multichip devices

Methods and apparatus for reducing parasitic inductance using inter...

Semiconductor die assembly having leadframe decoupling characters

Semiconductor die assembly having leadframe decoupling characters