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Narrow band gap semiconductor material, <<1ev
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CPC
Y10S257/916
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GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10
USPC classification
Y10S
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10S257/00
Active solid-state devices
Current Industry
Y10S257/916
Narrow band gap semiconductor material, <<1ev
Industries
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Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Passive within via
Patent number
9,960,079
Issue date
May 1, 2018
Intel Corporation
Todd B. Myers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of embedding passive component within via
Patent number
8,487,446
Issue date
Jul 16, 2013
Intel Corporation
Todd B Myers
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of embedding passive component within via
Patent number
7,952,202
Issue date
May 31, 2011
Intel Corporation
Todd B Myers
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Surface mount multichip devices
Patent number
7,525,183
Issue date
Apr 28, 2009
General Semiconductor, Inc.
Paddy O'Shea
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of embedding passive component within via
Patent number
7,275,316
Issue date
Oct 2, 2007
Intel Corporation
Todd B Myers
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Surface mount multichip devices
Patent number
7,242,078
Issue date
Jul 10, 2007
General Semiconductor, Inc.
Paddy O'Shea
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic component with reduced parasitic inductance and met...
Patent number
7,002,249
Issue date
Feb 21, 2006
Primarion, Inc.
Thomas P. Duffy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Surface mount multichip devices
Patent number
6,919,625
Issue date
Jul 19, 2005
General Semiconductor, Inc.
Paddy O'Shea
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die assembly having leadframe decoupling characters
Patent number
6,781,219
Issue date
Aug 24, 2004
Micron Technology, Inc.
Lucien J. Bissey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integral capacitor using embedded enclosure for effective electroma...
Patent number
6,509,640
Issue date
Jan 21, 2003
Intel Corporation
Yuan-Liang Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die assembly having leadframe decoupling characters a...
Patent number
6,504,236
Issue date
Jan 7, 2003
Micron Technology, Inc.
Lucien J. Bissey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded capacitor assembly in a package
Patent number
6,346,743
Issue date
Feb 12, 2002
Intel Corp.
David G. Figueroa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die assembly having leadframe decoupling characters
Patent number
6,310,388
Issue date
Oct 30, 2001
Micron Technology, Inc.
Lucien J. Bissey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-capacitance lead frame decoupling device
Patent number
6,184,574
Issue date
Feb 6, 2001
Micron Technology, Inc.
Lucien J. Bissey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Controlled dopant diffusion and metal contamination in thin polycid...
Patent number
6,114,736
Issue date
Sep 5, 2000
International Business Machines Corporation
Karanam Balasubramanyam
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-capacitance lead frame decoupling device
Patent number
6,054,754
Issue date
Apr 25, 2000
Micron Technology, Inc.
Lucien J. Bissey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of controlling dopant diffusion and metal contamination in t...
Patent number
5,923,999
Issue date
Jul 13, 1999
International Business Machines Corporation
Karanam Balasubramanyam
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Non-volatile memory board
Patent number
5,373,478
Issue date
Dec 13, 1994
Konica Corporation
Katsuaki Komatsu
G11 - INFORMATION STORAGE
Information
Patent Grant
Schottky barrier diode with ohmic portion
Patent number
5,306,943
Issue date
Apr 26, 1994
Murata Manufacturing Co., Ltd.
Hisashi Ariyoshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Composite semiconductor device with Schottky and pn junctions
Patent number
5,278,443
Issue date
Jan 11, 1994
Hitachi, Ltd.
Mutsuhiro Mori
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Grant
Semiconductor rectifier having high breakdown voltage and high spee...
Patent number
5,262,669
Issue date
Nov 16, 1993
Shindengen Electric Manufacturing Co., Ltd
Masaru Wakatabe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package
Patent number
5,162,264
Issue date
Nov 10, 1992
International Business Machines Corporation
Werner O. Haug
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged integrated circuit with in-cavity decoupling capacitors
Patent number
5,103,283
Issue date
Apr 7, 1992
Larry R. Hite
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
5,067,006
Issue date
Nov 19, 1991
Sumitomo Electric Industries, Ltd.
Nobuo Shiga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Via capacitors within multi-layer, 3 dimensional structures/substrates
Patent number
5,055,966
Issue date
Oct 8, 1991
Hughes Aircraft Company
Hal D. Smith
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Combined flat capacitor and tab integrated circuit chip and method
Patent number
5,049,979
Issue date
Sep 17, 1991
Microelectronics and Computer Technology Corporation
Seyed H. Hashemi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package capacitor cover
Patent number
5,043,533
Issue date
Aug 27, 1991
Honeywell Inc.
Richard K. Spielberger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integration of ceramic capacitor
Patent number
5,031,069
Issue date
Jul 9, 1991
Sundstrand Corporation
Kyle Anderson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printed circuit boards and cards having buried thin film capacitors...
Patent number
5,027,253
Issue date
Jun 25, 1991
IBM Corporation
John M. Lauffer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Integrated circuit package
Patent number
5,016,087
Issue date
May 14, 1991
International Business Machines Corporation
Werner O. Haug
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
PASSIVE WITHIN VIA
Publication number
20130249112
Publication date
Sep 26, 2013
Todd B. Myers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF EMBEDDING PASSIVE COMPONENT WITHIN VIA
Publication number
20110198723
Publication date
Aug 18, 2011
Todd B. Myers
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF EMBEDDING PASSIVE COMPONENT WITHIN VIA
Publication number
20090057910
Publication date
Mar 5, 2009
Intel Corporation
Todd B. Myers
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Surface mount multichip devices
Publication number
20080017959
Publication date
Jan 24, 2008
Paddy O'Shea
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Surface mount multichip devices
Publication number
20050248007
Publication date
Nov 10, 2005
Paddy O'Shea
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Passive within via
Publication number
20050224989
Publication date
Oct 13, 2005
Todd B. Myers
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Surface mount multichip devices
Publication number
20050006731
Publication date
Jan 13, 2005
General Semiconductor, Inc.
Paddy O'Shea
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods and apparatus for reducing parasitic inductance using inter...
Publication number
20040104456
Publication date
Jun 3, 2004
Thomas P. Duffy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor die assembly having leadframe decoupling characters
Publication number
20030011050
Publication date
Jan 16, 2003
Lucien J. Bissey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor die assembly having leadframe decoupling characters
Publication number
20020003294
Publication date
Jan 10, 2002
Lucien J. Bissey
H01 - BASIC ELECTRIC ELEMENTS