Needle-like

Industry

CPC
G01R1/0675

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

GPHYSICS G01Measuring instruments G01RMEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00

Current Industry

G01R1/0675Needle-like

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Probe card needle shape and method of manufacturing
- Patent number 12,326,463
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Yu Chiu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Probe head and probe assembly
- Patent number 12,326,462
- Issue date Jun 10, 2025
- AZOTH STUDIO LTD. CO.
- Zhou Yi Lin
- G01 - MEASURING TESTING
Information Patent Grant
Micromachined mechanical part and methods of fabrication thereof
- Patent number 12,313,652
- Issue date May 27, 2025
- The University Court of the University of Glasgow
- Thomas McMullen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Carbon nanomaterial functionalized needle tip modified with low wor...
- Patent number 12,313,653
- Issue date May 27, 2025
- National Center for Nanoscience and Technology
- Jianxun Xu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Probe joint and spring probe comprising the same
- Patent number 12,313,651
- Issue date May 27, 2025
- AZOTH STUDIO LTD. CO.
- Zhou Yi Lin
- G01 - MEASURING TESTING
Information Patent Grant
Load pull tuner for waveguide wafer probe
- Patent number 12,265,101
- Issue date Apr 1, 2025
- Christos Tsironis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe head and probe card having same
- Patent number 12,222,370
- Issue date Feb 11, 2025
- POINT ENGINEERING CO., LTD.
- Bum Mo Ahn
- G01 - MEASURING TESTING
Information Patent Grant
Probe and elastic structure thereof
- Patent number 12,163,980
- Issue date Dec 10, 2024
- TECAT TECHNOLOGIES (SUZHOU) LIMITED
- Choon Leong Lou
- G01 - MEASURING TESTING
Information Patent Grant
Electrical inspection method
- Patent number 12,123,799
- Issue date Oct 22, 2024
- Hamamatsu Photonics K.K.
- Takashi Kasahara
- G01 - MEASURING TESTING
Information Patent Grant
Securing a probe to a device under test
- Patent number 12,055,578
- Issue date Aug 6, 2024
- Tektronix, Inc.
- Julie A. Campbell
- G01 - MEASURING TESTING
Information Patent Grant
Contact probe for high-frequency applications with improved current...
- Patent number 12,044,703
- Issue date Jul 23, 2024
- Technoprobe S.p.A.
- Raffaele Vallauri
- G01 - MEASURING TESTING
Information Patent Grant
Chevron interconnect for very fine pitch probing
- Patent number 12,032,002
- Issue date Jul 9, 2024
- Intel Corporation
- Pooya Tadayon
- G01 - MEASURING TESTING
Information Patent Grant
Clad wire and method for producing clad wires
- Patent number 12,020,829
- Issue date Jun 25, 2024
- Heraeus Deutschland GmbH & Co. KG
- Marc Rättig
- G01 - MEASURING TESTING
Information Patent Grant
Sensor-based planar wafer probe alignment
- Patent number 12,019,096
- Issue date Jun 25, 2024
- Infineon Technologies AG
- Stefano Di Martino
- G01 - MEASURING TESTING
Information Patent Grant
Prober controlling device, prober controlling method, and prober
- Patent number 12,007,413
- Issue date Jun 11, 2024
- Tokyo Seimitsu Co., Ltd.
- Tetsuo Yoshida
- G01 - MEASURING TESTING
Information Patent Grant
Probe pin having gripping structure
- Patent number 12,000,863
- Issue date Jun 4, 2024
- TSE CO., LTD.
- Seung Bae An
- G01 - MEASURING TESTING
Information Patent Grant
Probe head for reduced-pitch applications
- Patent number 11,953,522
- Issue date Apr 9, 2024
- Technoprobe S.p.A.
- Roberto Crippa
- G01 - MEASURING TESTING
Information Patent Grant
Ceramic, probe guiding member, probe card, and socket for package i...
- Patent number 11,940,466
- Issue date Mar 26, 2024
- FERROTEC MATERIAL TECHNOLOGIES CORPORATION
- Wataru Yamagishi
- G01 - MEASURING TESTING
Information Patent Grant
Optical probe for process Raman spectroscopy and method of use
- Patent number 11,940,464
- Issue date Mar 26, 2024
- Endress+Hauser Optical Analysis, Inc.
- Carsten Uerpmann
- G01 - MEASURING TESTING
Information Patent Grant
Inspection apparatus and inspection method
- Patent number 11,940,485
- Issue date Mar 26, 2024
- Tokyo Electron Limited
- Naoki Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe test card and method of manufacturing the same
- Patent number 11,933,818
- Issue date Mar 19, 2024
- SK hynix Inc.
- Gyung Jin Kim
- G01 - MEASURING TESTING
Information Patent Grant
Electrical connecting device
- Patent number 11,828,773
- Issue date Nov 28, 2023
- Kabushiki Kaisha Nihon Micronics
- Akihiro Shuto
- G01 - MEASURING TESTING
Information Patent Grant
Ethylene sensor and method of making same
- Patent number 11,788,998
- Issue date Oct 17, 2023
- KING FAISAL UNIVERSITY
- Nagih Mohammed Shaalan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pogo pin-free testing device for IC chip test and testing method of...
- Patent number 11,740,260
- Issue date Aug 29, 2023
- Global Unichip Corporation
- Chih-Chieh Liao
- G01 - MEASURING TESTING
Information Patent Grant
Spring probe
- Patent number 11,719,720
- Issue date Aug 8, 2023
- SHENZHEN POMAGTOR PRECISION ELECTRONICS CO., LTD
- Zhengpeng Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Evaluation apparatus for semiconductor device
- Patent number 11,709,199
- Issue date Jul 25, 2023
- HITACHI HIGH-TECH CORPORATION
- Tomohisa Ohtaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency data differential testing probe
- Patent number 11,698,390
- Issue date Jul 11, 2023
- Signal Microwave, LLC
- William Rosas
- G01 - MEASURING TESTING
Information Patent Grant
Chip testing apparatus and system with sharing test interface
- Patent number 11,630,153
- Issue date Apr 18, 2023
- Winbond Electronics Corp.
- Chih-Chiang Lai
- G11 - INFORMATION STORAGE
Information Patent Grant
Cantilever-type probe with multiple metallic coatings
- Patent number 11,543,431
- Issue date Jan 3, 2023
- KLA Corporation
- Hongshuo Zou
- G01 - MEASURING TESTING
Information Patent Grant
Probe test card and method of manufacturing the same
- Patent number 11,543,433
- Issue date Jan 3, 2023
- SK hynix Inc.
- Gyung Jin Kim
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
PROBE
- Publication number 20250216417
- Publication date Jul 3, 2025
- YOKOWO CO., LTD
- Kenichi SATO
- G01 - MEASURING TESTING
Information Patent Application
TEST SYSTEM FOR HIGH-VOLTAGE AND HIGH-CURRENT TESTING ON A PLURALIT...
- Publication number 20250216418
- Publication date Jul 3, 2025
- CREA COLLAUDI ELETTRONICI AUTOMATIZZATI S.R.L.
- Marco MARCINNO'
- G01 - MEASURING TESTING
Information Patent Application
METAL MOLDED ARTICLE, MANUFACTURING METHOD THEREFOR, AND INSPECTION...
- Publication number 20250199032
- Publication date Jun 19, 2025
- POINT ENGINEERING CO., LTD.
- Bum Mo AHN
- G01 - MEASURING TESTING
Information Patent Application
CHIP TESTING STRUCTURE
- Publication number 20250180604
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Chun CHEN
- G01 - MEASURING TESTING
Information Patent Application
AUTOMATIC CALIBRATION METHOD AND AUTOMATIC CALIBRATION EQUIPMENT FO...
- Publication number 20250180687
- Publication date Jun 5, 2025
- United Microelectronics Corp.
- Zheng-Yang LI
- G01 - MEASURING TESTING
Information Patent Application
PROBE SYSTEM WITH INTEGRATED CHOKE INDUCTOR
- Publication number 20250147069
- Publication date May 8, 2025
- Northrop Grumman Systems Corporation
- Jesse H. Gonzales
- G01 - MEASURING TESTING
Information Patent Application
PROBE CARD, PROBE HEAD, METHOD FOR MANUFACTURING THE PROBE HEAD, AN...
- Publication number 20250147072
- Publication date May 8, 2025
- MPI CORPORATION
- Chin-Tien YANG
- G01 - MEASURING TESTING
Information Patent Application
CIRCUIT TESTING DEVICE
- Publication number 20250138057
- Publication date May 1, 2025
- Richard Martinez
- G01 - MEASURING TESTING
Information Patent Application
PROBE
- Publication number 20250138049
- Publication date May 1, 2025
- Kabushiki Kaisha Nihon Micronics
- Akihiro SHUTO
- G01 - MEASURING TESTING
Information Patent Application
APPROACHES AND PROBES FOR EXCITATION, DETECTION, AND SENSING OF DEV...
- Publication number 20250123320
- Publication date Apr 17, 2025
- InZiv Ltd.
- David Judah Lewis
- G01 - MEASURING TESTING
Information Patent Application
LOW CROSS-TALK INTERCONNECTION DEVICE WITH IMPEDANCE-TUNED HYBRID S...
- Publication number 20250085309
- Publication date Mar 13, 2025
- ESSAI, INC.
- Nasser Barabi
- G01 - MEASURING TESTING
Information Patent Application
TESTING MODULE
- Publication number 20250060405
- Publication date Feb 20, 2025
- NANYA TECHNOLOGY CORPORATION
- Wei-Zhong LI
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR WAFER
- Publication number 20240410934
- Publication date Dec 12, 2024
- NANYA TECHNOLOGY CORPORATION
- Wei Zhong LI
- G01 - MEASURING TESTING
Information Patent Application
PROBE CARD STRUCTURE FOR HIGH FREQUENCY TEST AND TESTING METHOD THE...
- Publication number 20240410918
- Publication date Dec 12, 2024
- STAR TECHNOLOGIES, INC.
- CHOON LEONG LOU
- G01 - MEASURING TESTING
Information Patent Application
SYSTEMS AND METHODS FOR COAXIAL TEST SOCKET AND PRINTED CIRCUIT BOA...
- Publication number 20240402217
- Publication date Dec 5, 2024
- Smiths Interconnect Americas, Inc.
- Khaled Elmadbouly
- G01 - MEASURING TESTING
Information Patent Application
PROBE SYSTEM FOR TESTING OF DEVICES UNDER TEST INTEGRATED ON A SEMI...
- Publication number 20240393368
- Publication date Nov 28, 2024
- MPI CORPORATION
- CHIN-TIEN YANG
- G01 - MEASURING TESTING
Information Patent Application
PROBE SYSTEM FOR TESTING OF DEVICES UNDER TEST INTEGRATED ON A SEMI...
- Publication number 20240393367
- Publication date Nov 28, 2024
- MPI CORPORATION
- CHIN-TIEN YANG
- G01 - MEASURING TESTING
Information Patent Application
MEMS PROBE MODULE STRUCTURE
- Publication number 20240377434
- Publication date Nov 14, 2024
- TAIWAN MASK CORPORATION
- SHANG-KUANG WU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STATIONARY PROBE, MOVABLE PROBE, AND PROBING DEVICE CAPABLE OF ADJU...
- Publication number 20240329083
- Publication date Oct 3, 2024
- MPI CORPORATION
- CHIA-NAN CHOU
- G01 - MEASURING TESTING
Information Patent Application
MAGNETO-OPTIC MAGNETOMETER
- Publication number 20240295616
- Publication date Sep 5, 2024
- Arizona Board of Regents on behalf of The University of Arizona
- Sasaan Showghi
- G01 - MEASURING TESTING
Information Patent Application
TEST SOCKET AND METHOD FOR FABRICATING THE SAME
- Publication number 20240248118
- Publication date Jul 25, 2024
- LEENO INDUSTRIAL INC.
- Geunsu KIM
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC DEVICE AND TEST METHOD FOR ELECTRONIC DEVICE
- Publication number 20240230749
- Publication date Jul 11, 2024
- CARUX TECHNOLOGY PTE. LTD.
- Chao-Chin Sung
- G01 - MEASURING TESTING
Information Patent Application
ALLOY MATERIAL FOR PROBE PINS
- Publication number 20240167125
- Publication date May 23, 2024
- ISHIFUKU METAL INDUSTRY CO., LTD.
- Yasunori EGAWA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
PROBE CARD NEEDLE SHAPE AND METHOD OF MANUFACTURING
- Publication number 20240151743
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Yu CHIU
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC DEVICE AND TEST METHOD FOR ELECTRONIC DEVICE
- Publication number 20240133941
- Publication date Apr 25, 2024
- CARUX TECHNOLOGY PTE. LTD.
- Chao-Chin Sung
- G01 - MEASURING TESTING
Information Patent Application
HIGH-IMPEDANCE DIFFERENTIAL FLEXIBLE PROBE TIP
- Publication number 20240118314
- Publication date Apr 11, 2024
- Tektronix, Inc.
- Julie A. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Circuits Testing Device and Method of Use
- Publication number 20240110944
- Publication date Apr 4, 2024
- Milton Solis
- G01 - MEASURING TESTING
Information Patent Application
METHODS OF REINFORCING PLATED METAL STRUCTURES AND MODULATING MECHA...
- Publication number 20240110943
- Publication date Apr 4, 2024
- Microfabrica Inc.
- Onnik Yaglioglu
- G01 - MEASURING TESTING
Information Patent Application
PROBER CONTROLLING DEVICE, PROBER CONTROLLING METHOD, AND PROBER
- Publication number 20240094254
- Publication date Mar 21, 2024
- TOKYO SEIMITSU CO., LTD.
- Tetsuo YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Reinforcing Plated Metal Structures and Independently Mo...
- Publication number 20240094247
- Publication date Mar 21, 2024
- Microfabrica Inc.
- Onnik Yaglioglu
- H01 - BASIC ELECTRIC ELEMENTS

Needle-like

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Probe card needle shape and method of manufacturing

Probe head and probe assembly

Micromachined mechanical part and methods of fabrication thereof

Carbon nanomaterial functionalized needle tip modified with low wor...

Probe joint and spring probe comprising the same

Load pull tuner for waveguide wafer probe

Probe head and probe card having same

Probe and elastic structure thereof

Electrical inspection method

Securing a probe to a device under test

Contact probe for high-frequency applications with improved current...

Chevron interconnect for very fine pitch probing

Clad wire and method for producing clad wires

Sensor-based planar wafer probe alignment

Prober controlling device, prober controlling method, and prober

Probe pin having gripping structure

Probe head for reduced-pitch applications

Ceramic, probe guiding member, probe card, and socket for package i...

Optical probe for process Raman spectroscopy and method of use

Inspection apparatus and inspection method

Probe test card and method of manufacturing the same

Electrical connecting device

Ethylene sensor and method of making same

Pogo pin-free testing device for IC chip test and testing method of...

Spring probe

Evaluation apparatus for semiconductor device

High-frequency data differential testing probe

Chip testing apparatus and system with sharing test interface

Cantilever-type probe with multiple metallic coatings

Probe test card and method of manufacturing the same

Patents Applicationslast 30 patents

PROBE

TEST SYSTEM FOR HIGH-VOLTAGE AND HIGH-CURRENT TESTING ON A PLURALIT...

METAL MOLDED ARTICLE, MANUFACTURING METHOD THEREFOR, AND INSPECTION...

CHIP TESTING STRUCTURE

AUTOMATIC CALIBRATION METHOD AND AUTOMATIC CALIBRATION EQUIPMENT FO...

PROBE SYSTEM WITH INTEGRATED CHOKE INDUCTOR

PROBE CARD, PROBE HEAD, METHOD FOR MANUFACTURING THE PROBE HEAD, AN...

CIRCUIT TESTING DEVICE

PROBE

APPROACHES AND PROBES FOR EXCITATION, DETECTION, AND SENSING OF DEV...

LOW CROSS-TALK INTERCONNECTION DEVICE WITH IMPEDANCE-TUNED HYBRID S...

TESTING MODULE

SEMICONDUCTOR WAFER

PROBE CARD STRUCTURE FOR HIGH FREQUENCY TEST AND TESTING METHOD THE...

SYSTEMS AND METHODS FOR COAXIAL TEST SOCKET AND PRINTED CIRCUIT BOA...

PROBE SYSTEM FOR TESTING OF DEVICES UNDER TEST INTEGRATED ON A SEMI...

PROBE SYSTEM FOR TESTING OF DEVICES UNDER TEST INTEGRATED ON A SEMI...

MEMS PROBE MODULE STRUCTURE

STATIONARY PROBE, MOVABLE PROBE, AND PROBING DEVICE CAPABLE OF ADJU...

MAGNETO-OPTIC MAGNETOMETER

TEST SOCKET AND METHOD FOR FABRICATING THE SAME

ELECTRONIC DEVICE AND TEST METHOD FOR ELECTRONIC DEVICE

ALLOY MATERIAL FOR PROBE PINS

PROBE CARD NEEDLE SHAPE AND METHOD OF MANUFACTURING

ELECTRONIC DEVICE AND TEST METHOD FOR ELECTRONIC DEVICE

HIGH-IMPEDANCE DIFFERENTIAL FLEXIBLE PROBE TIP

Electrical Circuits Testing Device and Method of Use

METHODS OF REINFORCING PLATED METAL STRUCTURES AND MODULATING MECHA...

PROBER CONTROLLING DEVICE, PROBER CONTROLLING METHOD, AND PROBER

Methods of Reinforcing Plated Metal Structures and Independently Mo...