Needle-like

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CPC
G01R1/0675

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Parent Industries

GPHYSICS G01Measuring instruments G01RMEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00

Current Industry

G01R1/0675Needle-like

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Probe head and probe card having same
- Patent number 12,222,370
- Issue date Feb 11, 2025
- POINT ENGINEERING CO., LTD.
- Bum Mo Ahn
- G01 - MEASURING TESTING
Information Patent Grant
Probe and elastic structure thereof
- Patent number 12,163,980
- Issue date Dec 10, 2024
- TECAT TECHNOLOGIES (SUZHOU) LIMITED
- Choon Leong Lou
- G01 - MEASURING TESTING
Information Patent Grant
Electrical inspection method
- Patent number 12,123,799
- Issue date Oct 22, 2024
- Hamamatsu Photonics K.K.
- Takashi Kasahara
- G01 - MEASURING TESTING
Information Patent Grant
Securing a probe to a device under test
- Patent number 12,055,578
- Issue date Aug 6, 2024
- Tektronix, Inc.
- Julie A. Campbell
- G01 - MEASURING TESTING
Information Patent Grant
Contact probe for high-frequency applications with improved current...
- Patent number 12,044,703
- Issue date Jul 23, 2024
- Technoprobe S.p.A.
- Raffaele Vallauri
- G01 - MEASURING TESTING
Information Patent Grant
Chevron interconnect for very fine pitch probing
- Patent number 12,032,002
- Issue date Jul 9, 2024
- Intel Corporation
- Pooya Tadayon
- G01 - MEASURING TESTING
Information Patent Grant
Clad wire and method for producing clad wires
- Patent number 12,020,829
- Issue date Jun 25, 2024
- Heraeus Deutschland GmbH & Co. KG
- Marc Rättig
- G01 - MEASURING TESTING
Information Patent Grant
Sensor-based planar wafer probe alignment
- Patent number 12,019,096
- Issue date Jun 25, 2024
- Infineon Technologies AG
- Stefano Di Martino
- G01 - MEASURING TESTING
Information Patent Grant
Prober controlling device, prober controlling method, and prober
- Patent number 12,007,413
- Issue date Jun 11, 2024
- Tokyo Seimitsu Co., Ltd.
- Tetsuo Yoshida
- G01 - MEASURING TESTING
Information Patent Grant
Probe pin having gripping structure
- Patent number 12,000,863
- Issue date Jun 4, 2024
- TSE CO., LTD.
- Seung Bae An
- G01 - MEASURING TESTING
Information Patent Grant
Probe head for reduced-pitch applications
- Patent number 11,953,522
- Issue date Apr 9, 2024
- Technoprobe S.p.A.
- Roberto Crippa
- G01 - MEASURING TESTING
Information Patent Grant
Ceramic, probe guiding member, probe card, and socket for package i...
- Patent number 11,940,466
- Issue date Mar 26, 2024
- FERROTEC MATERIAL TECHNOLOGIES CORPORATION
- Wataru Yamagishi
- G01 - MEASURING TESTING
Information Patent Grant
Optical probe for process Raman spectroscopy and method of use
- Patent number 11,940,464
- Issue date Mar 26, 2024
- Endress+Hauser Optical Analysis, Inc.
- Carsten Uerpmann
- G01 - MEASURING TESTING
Information Patent Grant
Inspection apparatus and inspection method
- Patent number 11,940,485
- Issue date Mar 26, 2024
- Tokyo Electron Limited
- Naoki Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe test card and method of manufacturing the same
- Patent number 11,933,818
- Issue date Mar 19, 2024
- SK hynix Inc.
- Gyung Jin Kim
- G01 - MEASURING TESTING
Information Patent Grant
Electrical connecting device
- Patent number 11,828,773
- Issue date Nov 28, 2023
- Kabushiki Kaisha Nihon Micronics
- Akihiro Shuto
- G01 - MEASURING TESTING
Information Patent Grant
Ethylene sensor and method of making same
- Patent number 11,788,998
- Issue date Oct 17, 2023
- KING FAISAL UNIVERSITY
- Nagih Mohammed Shaalan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pogo pin-free testing device for IC chip test and testing method of...
- Patent number 11,740,260
- Issue date Aug 29, 2023
- Global Unichip Corporation
- Chih-Chieh Liao
- G01 - MEASURING TESTING
Information Patent Grant
Spring probe
- Patent number 11,719,720
- Issue date Aug 8, 2023
- SHENZHEN POMAGTOR PRECISION ELECTRONICS CO., LTD
- Zhengpeng Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Evaluation apparatus for semiconductor device
- Patent number 11,709,199
- Issue date Jul 25, 2023
- HITACHI HIGH-TECH CORPORATION
- Tomohisa Ohtaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency data differential testing probe
- Patent number 11,698,390
- Issue date Jul 11, 2023
- Signal Microwave, LLC
- William Rosas
- G01 - MEASURING TESTING
Information Patent Grant
Chip testing apparatus and system with sharing test interface
- Patent number 11,630,153
- Issue date Apr 18, 2023
- Winbond Electronics Corp.
- Chih-Chiang Lai
- G11 - INFORMATION STORAGE
Information Patent Grant
Cantilever-type probe with multiple metallic coatings
- Patent number 11,543,431
- Issue date Jan 3, 2023
- KLA Corporation
- Hongshuo Zou
- G01 - MEASURING TESTING
Information Patent Grant
Probe test card and method of manufacturing the same
- Patent number 11,543,433
- Issue date Jan 3, 2023
- SK hynix Inc.
- Gyung Jin Kim
- G01 - MEASURING TESTING
Information Patent Grant
High-frequency data differential testing probe
- Patent number 11,543,434
- Issue date Jan 3, 2023
- Signal Microwave, LLC
- William Rosas
- G01 - MEASURING TESTING
Information Patent Grant
Contact element system with at least two contact elements having di...
- Patent number 11,519,937
- Issue date Dec 6, 2022
- Feinmetall GmbH
- Gunther Böhm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe head with linear probe
- Patent number 11,493,536
- Issue date Nov 8, 2022
- MPI Corporation
- Tzu-Yang Chen
- G01 - MEASURING TESTING
Information Patent Grant
Multi-conductor transmission line probe
- Patent number 11,486,898
- Issue date Nov 1, 2022
- FormFactor, Inc.
- Tim Lesher
- G01 - MEASURING TESTING
Information Patent Grant
Probe, inspection jig, inspection device, and method for manufactur...
- Patent number 11,454,650
- Issue date Sep 27, 2022
- Nidec-Read Corporation
- Hidekazu Yamazaki
- G01 - MEASURING TESTING
Information Patent Grant
Contact device for electrical test
- Patent number 11,442,079
- Issue date Sep 13, 2022
- ISC CO., LTD.
- Young Bae Chung
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR WAFER
- Publication number 20240410934
- Publication date Dec 12, 2024
- NANYA TECHNOLOGY CORPORATION
- Wei Zhong LI
- G01 - MEASURING TESTING
Information Patent Application
PROBE CARD STRUCTURE FOR HIGH FREQUENCY TEST AND TESTING METHOD THE...
- Publication number 20240410918
- Publication date Dec 12, 2024
- STAR TECHNOLOGIES, INC.
- CHOON LEONG LOU
- G01 - MEASURING TESTING
Information Patent Application
SYSTEMS AND METHODS FOR COAXIAL TEST SOCKET AND PRINTED CIRCUIT BOA...
- Publication number 20240402217
- Publication date Dec 5, 2024
- Smiths Interconnect Americas, Inc.
- Khaled Elmadbouly
- G01 - MEASURING TESTING
Information Patent Application
PROBE SYSTEM FOR TESTING OF DEVICES UNDER TEST INTEGRATED ON A SEMI...
- Publication number 20240393368
- Publication date Nov 28, 2024
- MPI CORPORATION
- CHIN-TIEN YANG
- G01 - MEASURING TESTING
Information Patent Application
PROBE SYSTEM FOR TESTING OF DEVICES UNDER TEST INTEGRATED ON A SEMI...
- Publication number 20240393367
- Publication date Nov 28, 2024
- MPI CORPORATION
- CHIN-TIEN YANG
- G01 - MEASURING TESTING
Information Patent Application
MEMS PROBE MODULE STRUCTURE
- Publication number 20240377434
- Publication date Nov 14, 2024
- TAIWAN MASK CORPORATION
- SHANG-KUANG WU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STATIONARY PROBE, MOVABLE PROBE, AND PROBING DEVICE CAPABLE OF ADJU...
- Publication number 20240329083
- Publication date Oct 3, 2024
- MPI CORPORATION
- CHIA-NAN CHOU
- G01 - MEASURING TESTING
Information Patent Application
MAGNETO-OPTIC MAGNETOMETER
- Publication number 20240295616
- Publication date Sep 5, 2024
- Arizona Board of Regents on behalf of The University of Arizona
- Sasaan Showghi
- G01 - MEASURING TESTING
Information Patent Application
TEST SOCKET AND METHOD FOR FABRICATING THE SAME
- Publication number 20240248118
- Publication date Jul 25, 2024
- LEENO INDUSTRIAL INC.
- Geunsu KIM
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC DEVICE AND TEST METHOD FOR ELECTRONIC DEVICE
- Publication number 20240230749
- Publication date Jul 11, 2024
- CARUX TECHNOLOGY PTE. LTD.
- Chao-Chin Sung
- G01 - MEASURING TESTING
Information Patent Application
ALLOY MATERIAL FOR PROBE PINS
- Publication number 20240167125
- Publication date May 23, 2024
- ISHIFUKU METAL INDUSTRY CO., LTD.
- Yasunori EGAWA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
PROBE CARD NEEDLE SHAPE AND METHOD OF MANUFACTURING
- Publication number 20240151743
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Yu CHIU
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC DEVICE AND TEST METHOD FOR ELECTRONIC DEVICE
- Publication number 20240133941
- Publication date Apr 25, 2024
- CARUX TECHNOLOGY PTE. LTD.
- Chao-Chin Sung
- G01 - MEASURING TESTING
Information Patent Application
HIGH-IMPEDANCE DIFFERENTIAL FLEXIBLE PROBE TIP
- Publication number 20240118314
- Publication date Apr 11, 2024
- Tektronix, Inc.
- Julie A. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Circuits Testing Device and Method of Use
- Publication number 20240110944
- Publication date Apr 4, 2024
- Milton Solis
- G01 - MEASURING TESTING
Information Patent Application
METHODS OF REINFORCING PLATED METAL STRUCTURES AND MODULATING MECHA...
- Publication number 20240110943
- Publication date Apr 4, 2024
- Microfabrica Inc.
- Onnik Yaglioglu
- G01 - MEASURING TESTING
Information Patent Application
PROBER CONTROLLING DEVICE, PROBER CONTROLLING METHOD, AND PROBER
- Publication number 20240094254
- Publication date Mar 21, 2024
- TOKYO SEIMITSU CO., LTD.
- Tetsuo YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Reinforcing Plated Metal Structures and Independently Mo...
- Publication number 20240094247
- Publication date Mar 21, 2024
- Microfabrica Inc.
- Onnik Yaglioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE JOINT AND SPRING PROBE COMPRISING THE SAME
- Publication number 20240085458
- Publication date Mar 14, 2024
- AZOTH STUDIO LTD. CO.
- Zhou Yi Lin
- G01 - MEASURING TESTING
Information Patent Application
PROBE HEAD, PROBE ASSEMBLY AND SPRING PROBE STRUCTURE INCLUDING THE...
- Publication number 20240085455
- Publication date Mar 14, 2024
- AZOTH STUDIO LTD. CO.
- Zhou Yi Lin
- G01 - MEASURING TESTING
Information Patent Application
TEST SOCKET AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240069066
- Publication date Feb 29, 2024
- LEENO INDUSTRIAL INC.
- Woesuk YANG
- G01 - MEASURING TESTING
Information Patent Application
TUNGSTEN WIRE, AND TUNGSTEN WIRE PROCESSING METHOD AND ELECTROLYTIC...
- Publication number 20240052461
- Publication date Feb 15, 2024
- Kabushiki Kaisha Toshiba
- Hitoshi AOYAMA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
PROBE PIN AND METHOD OF MANUFACTURING PROBE PIN
- Publication number 20240053382
- Publication date Feb 15, 2024
- PT&K CO., LTD.
- Tae Yoon KIM
- G01 - MEASURING TESTING
Information Patent Application
PROBE HEAD AND PROBE ASSEMBLY
- Publication number 20240036073
- Publication date Feb 1, 2024
- AZOTH STUDIO LTD. CO.
- Zhou Yi Lin
- G01 - MEASURING TESTING
Information Patent Application
CASSETTE HOUSING, PROBER, SERVER RACK, AND STORAGE SYSTEM
- Publication number 20240014061
- Publication date Jan 11, 2024
- KIOXIA Corporation
- Tatsuro HITOMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE AND ELASTIC STRUCTURE THEREOF
- Publication number 20230314473
- Publication date Oct 5, 2023
- CHOON LEONG LOU
- G01 - MEASURING TESTING
Information Patent Application
Micromachined Mechanical Part and Methods of Fabrication Thereof
- Publication number 20230296645
- Publication date Sep 21, 2023
- THE UNIVERSITY COURT OF THE UNIVERSITY OF GLASGOW
- Thomas McMullen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PALLADIUM-COPPER-SILVER ALLOY
- Publication number 20230273240
- Publication date Aug 31, 2023
- Heraeus Deutschland GmbH & Co. KG
- Jonas FECHER
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
PROBE PIN HAVING IMPROVED GRIPPING STRUCTURE
- Publication number 20230266361
- Publication date Aug 24, 2023
- TSE CO., LTD.
- Seung Bae AN
- G01 - MEASURING TESTING
Information Patent Application
PROBE CARD AND SEMICONDUCTOR TEST METHOD USING THE SAME
- Publication number 20230221351
- Publication date Jul 13, 2023
- Samsung Electronics Co., Ltd.
- BYUNGWOOK CHOI
- G01 - MEASURING TESTING

Needle-like

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Probe head and probe card having same

Probe and elastic structure thereof

Electrical inspection method

Securing a probe to a device under test

Contact probe for high-frequency applications with improved current...

Chevron interconnect for very fine pitch probing

Clad wire and method for producing clad wires

Sensor-based planar wafer probe alignment

Prober controlling device, prober controlling method, and prober

Probe pin having gripping structure

Probe head for reduced-pitch applications

Ceramic, probe guiding member, probe card, and socket for package i...

Optical probe for process Raman spectroscopy and method of use

Inspection apparatus and inspection method

Probe test card and method of manufacturing the same

Electrical connecting device

Ethylene sensor and method of making same

Pogo pin-free testing device for IC chip test and testing method of...

Spring probe

Evaluation apparatus for semiconductor device

High-frequency data differential testing probe

Chip testing apparatus and system with sharing test interface

Cantilever-type probe with multiple metallic coatings

Probe test card and method of manufacturing the same

High-frequency data differential testing probe

Contact element system with at least two contact elements having di...

Probe head with linear probe

Multi-conductor transmission line probe

Probe, inspection jig, inspection device, and method for manufactur...

Contact device for electrical test

Patents Applicationslast 30 patents

SEMICONDUCTOR WAFER

PROBE CARD STRUCTURE FOR HIGH FREQUENCY TEST AND TESTING METHOD THE...

SYSTEMS AND METHODS FOR COAXIAL TEST SOCKET AND PRINTED CIRCUIT BOA...

PROBE SYSTEM FOR TESTING OF DEVICES UNDER TEST INTEGRATED ON A SEMI...

PROBE SYSTEM FOR TESTING OF DEVICES UNDER TEST INTEGRATED ON A SEMI...

MEMS PROBE MODULE STRUCTURE

STATIONARY PROBE, MOVABLE PROBE, AND PROBING DEVICE CAPABLE OF ADJU...

MAGNETO-OPTIC MAGNETOMETER

TEST SOCKET AND METHOD FOR FABRICATING THE SAME

ELECTRONIC DEVICE AND TEST METHOD FOR ELECTRONIC DEVICE

ALLOY MATERIAL FOR PROBE PINS

PROBE CARD NEEDLE SHAPE AND METHOD OF MANUFACTURING

ELECTRONIC DEVICE AND TEST METHOD FOR ELECTRONIC DEVICE

HIGH-IMPEDANCE DIFFERENTIAL FLEXIBLE PROBE TIP

Electrical Circuits Testing Device and Method of Use

METHODS OF REINFORCING PLATED METAL STRUCTURES AND MODULATING MECHA...

PROBER CONTROLLING DEVICE, PROBER CONTROLLING METHOD, AND PROBER

Methods of Reinforcing Plated Metal Structures and Independently Mo...

PROBE JOINT AND SPRING PROBE COMPRISING THE SAME

PROBE HEAD, PROBE ASSEMBLY AND SPRING PROBE STRUCTURE INCLUDING THE...

TEST SOCKET AND METHOD OF MANUFACTURING THE SAME

TUNGSTEN WIRE, AND TUNGSTEN WIRE PROCESSING METHOD AND ELECTROLYTIC...

PROBE PIN AND METHOD OF MANUFACTURING PROBE PIN

PROBE HEAD AND PROBE ASSEMBLY

CASSETTE HOUSING, PROBER, SERVER RACK, AND STORAGE SYSTEM

PROBE AND ELASTIC STRUCTURE THEREOF

Micromachined Mechanical Part and Methods of Fabrication Thereof

PALLADIUM-COPPER-SILVER ALLOY

PROBE PIN HAVING IMPROVED GRIPPING STRUCTURE

PROBE CARD AND SEMICONDUCTOR TEST METHOD USING THE SAME