Nickel [Ni] as principal constituent

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H01L2224/29655

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29655Nickel [Ni] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 11,049,833
- Issue date Jun 29, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 10,181,445
- Issue date Jan 15, 2019
- Mitsubishi Electric Corporation
- Akihisa Fukumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 9,466,584
- Issue date Oct 11, 2016
- Fuji Electric Co., Ltd.
- Shoji Sakaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump package and methods of formation thereof
- Patent number 9,373,609
- Issue date Jun 21, 2016
- Infineon Technologies AG
- Meng Tong Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-reflective conductive particle, anisotropic conductive adhesi...
- Patent number 9,340,710
- Issue date May 17, 2016
- Dexerials Corporation
- Hidetsugu Namiki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device having electrode interconnections within a con...
- Patent number 9,252,346
- Issue date Feb 2, 2016
- LG Electronics Inc.
- Byungjoon Rhee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Light-reflective conductive particle, anisotropic conductive adhesi...
- Patent number 8,796,725
- Issue date Aug 5, 2014
- Dexerials Corporation
- Hidetsugu Namiki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Three-dimensional (3D) integrated circuit with enhanced copper-to-c...
- Patent number 8,546,956
- Issue date Oct 1, 2013
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting structure
- Patent number 8,497,432
- Issue date Jul 30, 2013
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional (3D) integrated circuit with enhanced copper-to-c...
- Patent number 8,431,436
- Issue date Apr 30, 2013
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for wafer to wafer bonding in semiconductor pa...
- Patent number 8,377,798
- Issue date Feb 19, 2013
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Huei Peng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device, circuit board, electro-optic device, electron...
- Patent number 7,375,427
- Issue date May 20, 2008
- Seiko Epson Corporation
- Shuichi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Electroless Die-Attach Process for Semiconductor Packaging
- Publication number 20240274514
- Publication date Aug 15, 2024
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230387062
- Publication date Nov 30, 2023
- Fuji Electric Co., Ltd.
- Fumihiko MOMOSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20170352629
- Publication date Dec 7, 2017
- MITSUBISHI ELECTRIC CORPORATION
- Akihisa FUKUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20170133341
- Publication date May 11, 2017
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead-Free Solder Alloy and Semiconductor Device
- Publication number 20160300809
- Publication date Oct 13, 2016
- Hitachi, Ltd
- Takaaki MIYAZAKI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160240504
- Publication date Aug 18, 2016
- Fuji Electric Co., Ltd.
- Shoji SAKAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Assembly for Prognostics of Solder Joint
- Publication number 20160146878
- Publication date May 26, 2016
- Hitachi, Ltd
- Lina Jaya DIGUNA
- G01 - MEASURING TESTING
Information Patent Application
Bump Package and Methods of Formation Thereof
- Publication number 20140110835
- Publication date Apr 24, 2014
- INFINEON TECHNOLOGIES AG
- Meng Tong Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-REFLECTIVE CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE ADHESI...
- Publication number 20140103266
- Publication date Apr 17, 2014
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Hidetsugu Namiki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...
- Publication number 20130200520
- Publication date Aug 8, 2013
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...
- Publication number 20130113106
- Publication date May 9, 2013
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-REFLECTIVE CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE ADHESI...
- Publication number 20120175660
- Publication date Jul 12, 2012
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Hidetsugu Namiki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD AND STRUCTURE FOR WAFER TO WAFER BONDING IN SEMICONDUCTOR PA...
- Publication number 20120115305
- Publication date May 10, 2012
- Taiwan Semiconductor Manufacturing Co., LTD
- Jung-Huei PENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE
- Publication number 20100071946
- Publication date Mar 25, 2010
- SEIKO EPSON CORPORATION
- Nobuaki HASHIMOTO
- G02 - OPTICS
Information Patent Application
Semiconductor device, circuit board, electro-optic device, electron...
- Publication number 20060091539
- Publication date May 4, 2006
- Seiko Epson Corporation
- Shuichi Tanaka
- G02 - OPTICS

Nickel [Ni] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packages with an intermetallic layer

Power module

Method for manufacturing semiconductor device

Bump package and methods of formation thereof

Light-reflective conductive particle, anisotropic conductive adhesi...

Semiconductor device having electrode interconnections within a con...

Light-reflective conductive particle, anisotropic conductive adhesi...

Three-dimensional (3D) integrated circuit with enhanced copper-to-c...

Electronic component mounting structure

Three-dimensional (3D) integrated circuit with enhanced copper-to-c...

Method and structure for wafer to wafer bonding in semiconductor pa...

Semiconductor device, circuit board, electro-optic device, electron...

Patents Applicationslast 30 patents

Electroless Die-Attach Process for Semiconductor Packaging

SEMICONDUCTOR DEVICE

POWER MODULE

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

Lead-Free Solder Alloy and Semiconductor Device

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Electronic Assembly for Prognostics of Solder Joint

Bump Package and Methods of Formation Thereof

LIGHT-REFLECTIVE CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE ADHESI...

THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...

THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...

LIGHT-REFLECTIVE CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE ADHESI...

METHOD AND STRUCTURE FOR WAFER TO WAFER BONDING IN SEMICONDUCTOR PA...

ELECTRONIC COMPONENT MOUNTING STRUCTURE

Semiconductor device, circuit board, electro-optic device, electron...