Nickel [Ni] as principal constituent

Industry

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H01L2224/13355

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13355Nickel [Ni] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Advanced solder alloys for electronic interconnects
- Patent number 11,411,150
- Issue date Aug 9, 2022
- Alpha Assembly Solutions Inc.
- Morgana de Avila Ribas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Low pressure sintering powder
- Patent number 10,998,284
- Issue date May 4, 2021
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Light emitting diode display device
- Patent number 10,957,833
- Issue date Mar 23, 2021
- Samsung Electronics Co., Ltd.
- Tan Sakong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a solder bump structure
- Patent number 10,930,609
- Issue date Feb 23, 2021
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element and electronic device comprising the same
- Patent number 10,825,787
- Issue date Nov 3, 2020
- Innolux Corporation
- Wei-Cheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a solder bump structure
- Patent number 10,692,829
- Issue date Jun 23, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a solder bump structure
- Patent number 10,607,956
- Issue date Mar 31, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive resin composition, film adhesive, adhesive sheet, ad...
- Patent number 10,428,253
- Issue date Oct 1, 2019
- Hitachi Chemical Company, Ltd.
- Tomonori Minegishi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Conductive connecting member and manufacturing method of same
- Patent number 10,177,079
- Issue date Jan 8, 2019
- Furukawa Electric Co., Ltd.
- Hideo Nishikubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structures and methods to enable a full intermetallic interconnect
- Patent number 10,170,446
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing metal ball, joining material, and metal ball
- Patent number 10,150,185
- Issue date Dec 11, 2018
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing metal powder
- Patent number 10,130,995
- Issue date Nov 20, 2018
- Alpha Assembly Solutions Inc.
- Nirmalya Kumar Chaki
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 10,090,231
- Issue date Oct 2, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 9,966,322
- Issue date May 8, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hisao Teshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic intermetallic compound interconnect
- Patent number 9,847,308
- Issue date Dec 19, 2017
- Intel Corporation
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming pillar bumps on semiconductor wafers
- Patent number 9,831,201
- Issue date Nov 28, 2017
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 9,793,198
- Issue date Oct 17, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrode connection structure and electrode connection method
- Patent number 9,601,448
- Issue date Mar 21, 2017
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic contacts
- Patent number 9,601,468
- Issue date Mar 21, 2017
- Intel Corporation
- Michael P. Skinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component built-in board and method of manufacturing the same, and...
- Patent number 9,591,767
- Issue date Mar 7, 2017
- Fujikura Ltd.
- Kazuhisa Itoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component-mounted structure, IC card and COF package
- Patent number 9,516,749
- Issue date Dec 6, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshiyuki Wada
- G02 - OPTICS
Information Patent Grant
Magnetic contacts
- Patent number 9,343,389
- Issue date May 17, 2016
- Intel Corporation
- Michael P. Skinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure of semiconductor package, method for fabricating...
- Patent number 9,269,670
- Issue date Feb 23, 2016
- SK Hynix Inc.
- Seong Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making bumpless flipchip interco...
- Patent number 9,240,331
- Issue date Jan 19, 2016
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package structure and method of manufacturing the same
- Patent number 9,230,935
- Issue date Jan 5, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnetic intermetallic compound interconnect
- Patent number 8,939,347
- Issue date Jan 27, 2015
- Intel Corporation
- Rajasekaran Swaminathan
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Bonding structure of semiconductor package, method for fabricating...
- Patent number 8,766,457
- Issue date Jul 1, 2014
- SK Hynix Inc.
- Seong Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,563,397
- Issue date Oct 22, 2013
- Semiconductor Energy Laboratory Co., Ltd.
- Akihiro Chida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LOW PRESSURE SINTERING POWDER
- Publication number 20240413117
- Publication date Dec 12, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD OF FORMING A SOLDER BUMP STRUCTURE
- Publication number 20200152590
- Publication date May 14, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING A SOLDER BUMP STRUCTURE
- Publication number 20200058612
- Publication date Feb 20, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING DIODE DISPLAY DEVICE
- Publication number 20190305202
- Publication date Oct 3, 2019
- Samsung Electronics Co., Ltd.
- Tan SAKONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Solder Alloys For Electronic Interconnects
- Publication number 20190157535
- Publication date May 23, 2019
- Alpha Assembly Solutions Inc.
- Morgana de Avila Ribas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Advanced Solder Alloys For Electronic Interconnects
- Publication number 20180102464
- Publication date Apr 12, 2018
- Alpha Assembly Solutions Inc.
- Morgana de Avila Ribas
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...
- Publication number 20180019191
- Publication date Jan 18, 2018
- Invensas Corporation
- Cyprian Emeka UZOH
- B32 - LAYERED PRODUCTS
Information Patent Application
COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND...
- Publication number 20140268574
- Publication date Sep 18, 2014
- FUJIKURA LTD.
- Kazuhisa Itoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE, METHOD FOR FABRICATING...
- Publication number 20140252652
- Publication date Sep 11, 2014
- SK HYNIX INC.
- Seong Cheol KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making Bumpless Flipchip Interco...
- Publication number 20140175661
- Publication date Jun 26, 2014
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140159233
- Publication date Jun 12, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140061920
- Publication date Mar 6, 2014
- PANASONIC CORPORATION
- Hiroshige HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE...
- Publication number 20130001280
- Publication date Jan 3, 2013
- SHINKAWA LTD.
- Toru MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME
- Publication number 20130001775
- Publication date Jan 3, 2013
- Hideo Nishikubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE, METHOD FOR FABRICATING...
- Publication number 20120139126
- Publication date Jun 7, 2012
- Hynix Semiconductor Inc.
- Seong Cheol KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC INTERMETALLIC COMPOUND INTERCONNECT
- Publication number 20110266030
- Publication date Nov 3, 2011
- Rajasekaran Swaminathan
- B82 - NANO-TECHNOLOGY
Information Patent Application
Encapsulated Semiconductor Chip with External Contact Pads and Manu...
- Publication number 20110233754
- Publication date Sep 29, 2011
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE...
- Publication number 20110114708
- Publication date May 19, 2011
- SHINKAWAL LTD
- Toru Maeda
- B22 - CASTING POWDER METALLURGY
Information Patent Application
TERMINAL STRUCTURE AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC...
- Publication number 20110032684
- Publication date Feb 10, 2011
- Semiconductor Energy Laboratory Co., Ltd.
- Toshiji HAMATANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20100171221
- Publication date Jul 8, 2010
- Akihiro CHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Microstructure Apparatus and Method for Manufacturing Microstructur...
- Publication number 20100059244
- Publication date Mar 11, 2010
- KYOCERA CORPORATION
- Itaru Ishii
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SAME AND METHOD OF RE...
- Publication number 20100052163
- Publication date Mar 4, 2010
- NEC Corporation
- Akira Ouchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Optical display package and the method thereof
- Publication number 20070241435
- Publication date Oct 18, 2007
- Wintek Corporation
- Chih-Yuan Wang
- G02 - OPTICS
Information Patent Application
Semiconductor device and manufacturing method for the same
- Publication number 20070197016
- Publication date Aug 23, 2007
- FUJITSU LIMITED
- Joji Fujimori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20070108627
- Publication date May 17, 2007
- Matsushita Electric Industrial Co., Ltd.
- Yukihiro KOZAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit substrate for packaging semiconductor device, method for pr...
- Publication number 20050163982
- Publication date Jul 28, 2005
- Masahiro Ono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonded structure using conductive adhesives, and a manufacturing me...
- Publication number 20050062168
- Publication date Mar 24, 2005
- Takeshi Sano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device, mounting circuit board, method of producing t...
- Publication number 20030049425
- Publication date Mar 13, 2003
- Masahiro Ono
- H01 - BASIC ELECTRIC ELEMENTS

Nickel [Ni] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low pressure sintering powder

Advanced solder alloys for electronic interconnects

Sintering materials and attachment methods using same

Low pressure sintering powder

Light emitting diode display device

Method of forming a solder bump structure

Electronic element and electronic device comprising the same

Method of forming a solder bump structure

Method of forming a solder bump structure

Photosensitive resin composition, film adhesive, adhesive sheet, ad...

Conductive connecting member and manufacturing method of same

Structures and methods to enable a full intermetallic interconnect

Method for producing metal ball, joining material, and metal ball

Method for manufacturing metal powder

Conductive connections, structures with such connections, and metho...

Semiconductor device

Magnetic intermetallic compound interconnect

Methods for forming pillar bumps on semiconductor wafers

Conductive connections, structures with such connections, and metho...

Electrode connection structure and electrode connection method

Magnetic contacts

Component built-in board and method of manufacturing the same, and...

Electronic component-mounted structure, IC card and COF package

Magnetic contacts

Bonding structure of semiconductor package, method for fabricating...

Semiconductor device and method of making bumpless flipchip interco...

Package on package structure and method of manufacturing the same

Magnetic intermetallic compound interconnect

Bonding structure of semiconductor package, method for fabricating...

Semiconductor device and manufacturing method thereof

Patents Applicationslast 30 patents

LOW PRESSURE SINTERING POWDER

METHOD OF FORMING A SOLDER BUMP STRUCTURE

METHOD OF FORMING A SOLDER BUMP STRUCTURE

LIGHT EMITTING DIODE DISPLAY DEVICE

Advanced Solder Alloys For Electronic Interconnects

Advanced Solder Alloys For Electronic Interconnects

CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...

COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND...

BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE, METHOD FOR FABRICATING...

Semiconductor Device and Method of Making Bumpless Flipchip Interco...

PACKAGE ON PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE...

CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME

BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE, METHOD FOR FABRICATING...

MAGNETIC INTERMETALLIC COMPOUND INTERCONNECT

Encapsulated Semiconductor Chip with External Contact Pads and Manu...

METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE...

TERMINAL STRUCTURE AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Microstructure Apparatus and Method for Manufacturing Microstructur...

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SAME AND METHOD OF RE...

Optical display package and the method thereof

Semiconductor device and manufacturing method for the same

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Circuit substrate for packaging semiconductor device, method for pr...

Bonded structure using conductive adhesives, and a manufacturing me...

Semiconductor device, mounting circuit board, method of producing t...