Nickel [Ni] as principal constituent

Industry

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H01L2224/83455

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83455Nickel [Ni] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding sheet and bonded structure
- Patent number 12,046,572
- Issue date Jul 23, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Kei Anai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Solder material
- Patent number 11,850,685
- Issue date Dec 26, 2023
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 11,842,975
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element bonding structure, method for producing semic...
- Patent number 11,810,885
- Issue date Nov 7, 2023
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a solder compound containing a compo...
- Patent number 11,776,927
- Issue date Oct 3, 2023
- Infineon Technologies AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
- Patent number 11,626,388
- Issue date Apr 11, 2023
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,552,065
- Issue date Jan 10, 2023
- Fuji Electric Co., Ltd.
- Bin Wan Mat Wan Azha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering a conductor to an aluminum layer
- Patent number 11,424,217
- Issue date Aug 23, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
- Patent number 11,233,036
- Issue date Jan 25, 2022
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit package, an electronic circuit package, and methods for enc...
- Patent number 11,189,537
- Issue date Nov 30, 2021
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-eutectic bonding
- Patent number 11,141,810
- Issue date Oct 12, 2021
- TECHNI HOLDING AS
- Andreas Larsson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having chips attached to support members throu...
- Patent number 11,101,246
- Issue date Aug 24, 2021
- Denso Corporation
- Tomohito Iwashige
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a solder compound containing a compo...
- Patent number 11,069,644
- Issue date Jul 20, 2021
- Infineon Technologies AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for electrically contacting a component by galvanic connecti...
- Patent number 11,037,862
- Issue date Jun 15, 2021
- Siemens Aktiengesellschaft
- Hubert Baueregger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
- Patent number 10,943,888
- Issue date Mar 9, 2021
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for creating a bond between objects based on f...
- Patent number 10,923,454
- Issue date Feb 16, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having semiconductor chips disposed in openi...
- Patent number 10,825,776
- Issue date Nov 3, 2020
- Samsung Electronics Co., Ltd.
- Yoonha Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste for bonding
- Patent number 10,756,047
- Issue date Aug 25, 2020
- E I du Pont de Nemours and Company
- Takuya Konno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding structure on gold thin film
- Patent number 10,668,696
- Issue date Jun 2, 2020
- Fujikura Ltd.
- Shohei Kumeta
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Chip assembly
- Patent number 10,636,766
- Issue date Apr 28, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vibrator device, oscillator, electronic device, and vehicle
- Patent number 10,615,747
- Issue date Apr 7, 2020
- Seiko Epson Corporation
- Hisahiro Ito
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device and method of forming PIP with inner known goo...
- Patent number RE47923
- Issue date Mar 31, 2020
- STATS ChipPAC Pte. Ltd.
- Zigmund R. Camacho
Information Patent Grant
Semiconductor device
- Patent number 10,529,644
- Issue date Jan 7, 2020
- Nexperia B.V.
- Shun Tik Yeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and corresponding method
- Patent number 10,522,504
- Issue date Dec 31, 2019
- STMicroelectronics S.r.l.
- Pierangelo Magni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing electronic device with multi-layer contact
- Patent number 10,475,761
- Issue date Nov 12, 2019
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sinterable bonding material and semiconductor device using the same
- Patent number 10,446,518
- Issue date Oct 15, 2019
- Henkel AG & Co. KGaA
- Hajime Inoue
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Die attach methods and semiconductor devices manufactured based on...
- Patent number 10,396,015
- Issue date Aug 27, 2019
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for soldering surface-mount component and surface-mount comp...
- Patent number 10,354,944
- Issue date Jul 16, 2019
- Senju Metal Industry Co., Ltd.
- Minoru Ueshima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting device and light emitting module
- Patent number 10,297,716
- Issue date May 21, 2019
- LG Innotek Co., Ltd
- Shuhei Matsuda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Lid Structure With Openings To Alleviate Leakage Of Thermal Interfa...
- Publication number 20240332113
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240178125
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINT STRUCTURE
- Publication number 20240149340
- Publication date May 9, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Shinichi YAMAUCHI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Method for Fabricating a Power Semiconductor Device
- Publication number 20240096842
- Publication date Mar 21, 2024
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
- Publication number 20240088087
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Alexander HEINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240071847
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Huan Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Package and Method Forming the Same
- Publication number 20240072034
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230298983
- Publication date Sep 21, 2023
- Hitachi Astemo, Ltd.
- Osamu IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20230282611
- Publication date Sep 7, 2023
- FUJI ELECTRIC CO., LTD.
- Hiroki TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE-COATED HEAT SPREADER FOR INTEGRATED CIRCUIT DEVICE ASSEMBLIES
- Publication number 20230197555
- Publication date Jun 22, 2023
- ADVANCED MICRO DEVICES, INC.
- XIAOYANG JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SHEET AND BONDED STRUCTURE
- Publication number 20230005871
- Publication date Jan 5, 2023
- Mitsui Mining and Smelting Co., Ltd.
- Kei ANAI
- B32 - LAYERED PRODUCTS
Information Patent Application
LID BODY, ELECTRONIC COMPONENT ACCOMMODATION PACKAGE, AND ELECTRONI...
- Publication number 20220344226
- Publication date Oct 27, 2022
- KYOCERA CORPORATION
- Takayuki KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A SOLDER COMPOUND CONTAINING A COMPO...
- Publication number 20220216173
- Publication date Jul 7, 2022
- INFINEON TECHNOLOGIES AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power Semiconductor Device and Method for Fabricating a Power Semic...
- Publication number 20210225795
- Publication date Jul 22, 2021
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...
- Publication number 20210167035
- Publication date Jun 3, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210082898
- Publication date Mar 18, 2021
- Fuji Electric Co., Ltd.
- Bin Wan Mat WAN AZHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
- Publication number 20200312818
- Publication date Oct 1, 2020
- DENSO CORPORATION
- Tomohito IWASHIGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY
- Publication number 20200219848
- Publication date Jul 9, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A SOLDER COMPOUND CONTAINING A COMPO...
- Publication number 20200105704
- Publication date Apr 2, 2020
- INFINEON TECHNOLOGIES AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Device with Multi-Layer Contact and System
- Publication number 20200075530
- Publication date Mar 5, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Attach Methods and Semiconductor Devices Manufactured based on...
- Publication number 20190348347
- Publication date Nov 14, 2019
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING SEMICONDUCTOR CHIPS DISPOSED IN OPENI...
- Publication number 20190139899
- Publication date May 9, 2019
- Samsung Electronics Co., Ltd.
- Yoonha JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING TO A BOARD
- Publication number 20190013308
- Publication date Jan 10, 2019
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Electronic Device With Multi-Layer Contact
- Publication number 20190006311
- Publication date Jan 3, 2019
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING CONDUCTIVE ADHESIV...
- Publication number 20180342653
- Publication date Nov 29, 2018
- Chung Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Paste For Bonding
- Publication number 20180102341
- Publication date Apr 12, 2018
- E I DU PONT DE NEMOURS AND COMPANY
- Takuya Konno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO-TRANSFER PRINTING WITH VOLATILE ADHESIVE LAYER
- Publication number 20180096964
- Publication date Apr 5, 2018
- X-Celeprint Limited
- Salvatore Bonafede
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS MODULE WITH A SUPPORT WITH A PALLADIUM/OXYGEN DIF...
- Publication number 20180040580
- Publication date Feb 8, 2018
- Heraeus Deutschland GmbH & Co. KG
- Frank KRÜGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH REDUNDANT ELECTRICAL CONNECTORS AND ASS...
- Publication number 20180026015
- Publication date Jan 25, 2018
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING GANG BONDING AND S...
- Publication number 20170317247
- Publication date Nov 2, 2017
- Chung Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS

Nickel [Ni] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding sheet and bonded structure

Solder material

Electronic device with multi-layer contact and system

Semiconductor element bonding structure, method for producing semic...

Semiconductor device including a solder compound containing a compo...

Interconnect structure with redundant electrical connectors and ass...

Semiconductor device

Chip assembly

Soldering a conductor to an aluminum layer

Interconnect structure with redundant electrical connectors and ass...

Circuit package, an electronic circuit package, and methods for enc...

Non-eutectic bonding

Semiconductor device having chips attached to support members throu...

Semiconductor device including a solder compound containing a compo...

Method for electrically contacting a component by galvanic connecti...

Interconnect structure with redundant electrical connectors and ass...

Method and apparatus for creating a bond between objects based on f...

Semiconductor packages having semiconductor chips disposed in openi...

Conductive paste for bonding

Bonding structure on gold thin film

Chip assembly

Vibrator device, oscillator, electronic device, and vehicle

Semiconductor device and method of forming PIP with inner known goo...

Semiconductor device

Semiconductor device and corresponding method

Method for producing electronic device with multi-layer contact

Sinterable bonding material and semiconductor device using the same

Die attach methods and semiconductor devices manufactured based on...

Method for soldering surface-mount component and surface-mount comp...

Light emitting device and light emitting module

Patents Applicationslast 30 patents

Lid Structure With Openings To Alleviate Leakage Of Thermal Interfa...

WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE

JOINT STRUCTURE

Method for Fabricating a Power Semiconductor Device

ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM

SEMICONDUCTOR PACKAGE AND METHOD

3DIC Package and Method Forming the Same

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

GRAPHENE-COATED HEAT SPREADER FOR INTEGRATED CIRCUIT DEVICE ASSEMBLIES

BONDING SHEET AND BONDED STRUCTURE

LID BODY, ELECTRONIC COMPONENT ACCOMMODATION PACKAGE, AND ELECTRONI...

SEMICONDUCTOR DEVICE INCLUDING A SOLDER COMPOUND CONTAINING A COMPO...

Power Semiconductor Device and Method for Fabricating a Power Semic...

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME

METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY

SEMICONDUCTOR DEVICE INCLUDING A SOLDER COMPOUND CONTAINING A COMPO...

Electronic Device with Multi-Layer Contact and System

Die Attach Methods and Semiconductor Devices Manufactured based on...

SEMICONDUCTOR PACKAGES HAVING SEMICONDUCTOR CHIPS DISPOSED IN OPENI...

DIE BONDING TO A BOARD

Method for Producing Electronic Device With Multi-Layer Contact

METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING CONDUCTIVE ADHESIV...

Conductive Paste For Bonding

MICRO-TRANSFER PRINTING WITH VOLATILE ADHESIVE LAYER

POWER ELECTRONICS MODULE WITH A SUPPORT WITH A PALLADIUM/OXYGEN DIF...

INTERCONNECT STRUCTURE WITH REDUNDANT ELECTRICAL CONNECTORS AND ASS...

METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING GANG BONDING AND S...