Nickel (Ni) as principal constituent

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H01L2224/48755

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48755Nickel (Ni) as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with nickel-silver pre-plated leadframe
- Patent number 12,154,845
- Issue date Nov 26, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and inspection device
- Patent number 12,040,303
- Issue date Jul 16, 2024
- Kabushiki Kaisha Toshiba
- Mitsuaki Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with nickel-silver pre-plated leadframe
- Patent number 11,848,258
- Issue date Dec 19, 2023
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, electronic component and method
- Patent number 11,380,612
- Issue date Jul 5, 2022
- Infineon Technologies Austria AG
- Matthias Stecher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 10,818,620
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs
- Patent number 10,510,731
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with metal film and method for manufacturing s...
- Patent number 10,157,865
- Issue date Dec 18, 2018
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs
- Patent number 10,157,893
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin NiB or CoB capping layer for non-noble metallic bonding landin...
- Patent number 10,066,303
- Issue date Sep 4, 2018
- Imec VZW
- Eric Beyne
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Contact pads with sidewall spacers and method of making contact pad...
- Patent number 10,049,994
- Issue date Aug 14, 2018
- Infineon Technologies AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adding cap to copper passivation flow for electroless plating
- Patent number 10,026,706
- Issue date Jul 17, 2018
- Texas Instruments Incorporated
- Pragnesh R. Vaghela
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,978,701
- Issue date May 22, 2018
- Fuji Electric Co., Ltd.
- Takashi Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the semiconductor...
- Patent number 9,748,186
- Issue date Aug 29, 2017
- Fuji Electric Co., Ltd.
- Fumihiko Momose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,698,096
- Issue date Jul 4, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hiroshige Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass/ceramic replacement of epoxy for high temperature hermeticall...
- Patent number 9,601,400
- Issue date Mar 21, 2017
- Semtech Corporation
- Victor Hugo Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on-Package (PoP) structure including stud bulbs and method
- Patent number 9,502,394
- Issue date Nov 22, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 9,466,559
- Issue date Oct 11, 2016
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,401,333
- Issue date Jul 26, 2016
- Kabushiki Kaisha Toshiba
- Keiju Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,337,172
- Issue date May 10, 2016
- Panasonic Corporation
- Shigefumi Dohi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including a semiconductor chip and wires
- Patent number 9,305,876
- Issue date Apr 5, 2016
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Submount, encapsulated semiconductor element, and methods of manufa...
- Patent number 9,263,411
- Issue date Feb 16, 2016
- Advanced Photonics, Inc.
- Xueliang Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,245,845
- Issue date Jan 26, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kazuhiro Kaibara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable package by using internal stacking modules
- Patent number 9,245,772
- Issue date Jan 26, 2016
- STATS ChipPAC, Ltd.
- JoungIn Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bondable top metal contacts for gallium nitride power devices
- Patent number 8,916,871
- Issue date Dec 23, 2014
- Avogy, Inc.
- Brian Joel Alvarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs and method
- Patent number 8,912,651
- Issue date Dec 16, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing electronic device having contact elements with a spec...
- Patent number 8,871,630
- Issue date Oct 28, 2014
- Infineon Technologies AG
- Ralf Otremba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 8,860,190
- Issue date Oct 14, 2014
- Kabushiki Kaisha Toshiba
- Keiju Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive bonding material, method of bonding with th...
- Patent number 8,840,811
- Issue date Sep 23, 2014
- Hitachi Chemical Company, Ltd.
- Yuusuke Yasuda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Contact pads with sidewall spacers and method of making contact pad...
- Patent number 8,822,327
- Issue date Sep 2, 2014
- Infineon Technologies AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a method for manufacturing a chip package
- Patent number 8,815,647
- Issue date Aug 26, 2014
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME
- Publication number 20240153853
- Publication date May 9, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230105834
- Publication date Apr 6, 2023
- Rohm Co., Ltd.
- Daichi NIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME
- Publication number 20220208665
- Publication date Jun 30, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND INSPECTION DEVICE
- Publication number 20210296279
- Publication date Sep 23, 2021
- Kabushiki Kaisha Toshiba
- Mitsuaki KATO
- G01 - MEASURING TESTING
Information Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20190123027
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDING CAP TO COPPER PASSIVATION FLOW FOR ELECTROLESS PLATING
- Publication number 20180308816
- Publication date Oct 25, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Pragnesh R. Vaghela
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20180047709
- Publication date Feb 15, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable Package by Using Internal Stacking Modules
- Publication number 20140319702
- Publication date Oct 30, 2014
- JoungIn Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Pads with Sidewall Spacers and Method of Making Contact Pad...
- Publication number 20140319689
- Publication date Oct 30, 2014
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK TYPE SEMICONDUCTOR PACKAGE
- Publication number 20140291868
- Publication date Oct 2, 2014
- JIN-HO LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140284776
- Publication date Sep 25, 2014
- KABUSHIKI KAISHA TOSHIBA
- Keiju YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20140264383
- Publication date Sep 18, 2014
- RENESAS ELECTRONICS CORPORATION
- Ryoichi KAJIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A MULTI-CHANNEL AND A RELATED ELECTRON...
- Publication number 20140252640
- Publication date Sep 11, 2014
- Samsung Electronics Co., Ltd.
- Min-Keun Kwak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless Die Attach to a Direct Bonded Aluminum Substrate
- Publication number 20140225267
- Publication date Aug 14, 2014
- IXYS Corporation
- Nathan Zommer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device Including a Semiconductor Chip and Wires
- Publication number 20140218885
- Publication date Aug 7, 2014
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded System with Coated Copper Conductor
- Publication number 20140197539
- Publication date Jul 17, 2014
- INFINEON TECHNOLOGIES AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140124912
- Publication date May 8, 2014
- RENESAS ELECTRONICS CORPORATION
- Yoshiharu Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE SEMICONDUCTOR DEVICE
- Publication number 20140103537
- Publication date Apr 17, 2014
- PANASONIC CORPORATION
- Kazuhiro KAIBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDABLE TOP METAL CONTACTS FOR GALLIUM NITRIDE POWER DEVICES
- Publication number 20140070226
- Publication date Mar 13, 2014
- AVOGY, INC.
- Brian Joel Alvarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140061669
- Publication date Mar 6, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Pads with Sidewall Spacers and Method of Making Contact Pad...
- Publication number 20140048941
- Publication date Feb 20, 2014
- INFINEON TECHNOLOGIES AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pad Sidewall Spacers and Method of Making Pad Sidewall Spacers
- Publication number 20140048958
- Publication date Feb 20, 2014
- INFINEON TECHNOLOGIES AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Double Solid Metal Pad with Reduced Area
- Publication number 20140045327
- Publication date Feb 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-In-Packages and Methods of Formation Thereof
- Publication number 20140001615
- Publication date Jan 2, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless Die Attach to a Direct Bonded Aluminum Substrate
- Publication number 20130328204
- Publication date Dec 12, 2013
- IXYS Corporation
- Nathan Zommer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20130313708
- Publication date Nov 28, 2013
- RENESAS ELECTRONICS CORPORATION
- HIROMI SHIGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire Bonding Structures for Integrated Circuits
- Publication number 20130241058
- Publication date Sep 19, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DENSITY SIM CARD PACKAGE AND PRODUCTION METHOD THEREOF
- Publication number 20130223018
- Publication date Aug 29, 2013
- Tianshui Huatian Technology Co., Ltd.
- Jianyou Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF STRESS BALANCING IN GALLIUM ARSENIDE WAFER PROCESSING
- Publication number 20130193573
- Publication date Aug 1, 2013
- SKYWORKS SOLUTIONS, INC.
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module Including a Discrete Device Mounted on a DCB Substrate
- Publication number 20130161801
- Publication date Jun 27, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Nickel (Ni) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package with nickel-silver pre-plated leadframe

Semiconductor device and inspection device

Semiconductor package with nickel-silver pre-plated leadframe

Semiconductor device, electronic component and method

Semiconductor integrated circuit device

Package-on-package (PoP) structure including stud bulbs

Semiconductor device with metal film and method for manufacturing s...

Package-on-package (PoP) structure including stud bulbs

Thin NiB or CoB capping layer for non-noble metallic bonding landin...

Contact pads with sidewall spacers and method of making contact pad...

Adding cap to copper passivation flow for electroless plating

Semiconductor device

Semiconductor device and method for manufacturing the semiconductor...

Semiconductor device

Glass/ceramic replacement of epoxy for high temperature hermeticall...

Package on-Package (PoP) structure including stud bulbs and method

Semiconductor integrated circuit device

Semiconductor device

Semiconductor device

Device including a semiconductor chip and wires

Submount, encapsulated semiconductor element, and methods of manufa...

Semiconductor device

Stackable package by using internal stacking modules

Bondable top metal contacts for gallium nitride power devices

Package-on-package (PoP) structure including stud bulbs and method

Manufacturing electronic device having contact elements with a spec...

Semiconductor device

Electrically conductive bonding material, method of bonding with th...

Contact pads with sidewall spacers and method of making contact pad...

Chip package and a method for manufacturing a chip package

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME

SEMICONDUCTOR DEVICE AND INSPECTION DEVICE

Package-On-Package (PoP) Structure Including Stud Bulbs

ADDING CAP TO COPPER PASSIVATION FLOW FOR ELECTROLESS PLATING

Package-On-Package (PoP) Structure Including Stud Bulbs

Stackable Package by Using Internal Stacking Modules

Contact Pads with Sidewall Spacers and Method of Making Contact Pad...

STACK TYPE SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR PACKAGE HAVING A MULTI-CHANNEL AND A RELATED ELECTRON...

Solderless Die Attach to a Direct Bonded Aluminum Substrate

Device Including a Semiconductor Chip and Wires

Bonded System with Coated Copper Conductor

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

NITRIDE SEMICONDUCTOR DEVICE

BONDABLE TOP METAL CONTACTS FOR GALLIUM NITRIDE POWER DEVICES

CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE

Contact Pads with Sidewall Spacers and Method of Making Contact Pad...

Pad Sidewall Spacers and Method of Making Pad Sidewall Spacers

Double Solid Metal Pad with Reduced Area

Package-In-Packages and Methods of Formation Thereof

Solderless Die Attach to a Direct Bonded Aluminum Substrate

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

Wire Bonding Structures for Integrated Circuits

HIGH-DENSITY SIM CARD PACKAGE AND PRODUCTION METHOD THEREOF

METHODS OF STRESS BALANCING IN GALLIUM ARSENIDE WAFER PROCESSING

Module Including a Discrete Device Mounted on a DCB Substrate