Niobium [Nb]

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H01L2924/01041

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/01041Niobium [Nb]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Superconducting bump bonds for quantum computing systems
- Patent number 12,218,091
- Issue date Feb 4, 2025
- Google LLC
- Zhimin Jamie Yao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display substrate and preparation method thereof, and display appar...
- Patent number 12,199,081
- Issue date Jan 14, 2025
- BOE Technology Group Co., Ltd.
- Wenqu Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods for forming a transition metal niobium nitride film on a su...
- Patent number 11,810,788
- Issue date Nov 7, 2023
- ASM IP Holding B.V.
- Jerry Peijun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Superconducting bump bonds for quantum computing systems
- Patent number 11,600,588
- Issue date Mar 7, 2023
- Google LLC
- Zhimin Jamie Yao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 11,239,191
- Issue date Feb 1, 2022
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible hermetic membranes with electrically conducting vias
- Patent number 10,857,368
- Issue date Dec 8, 2020
- Greatbatch Ltd.
- Keith W. Seitz
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,741,517
- Issue date Aug 11, 2020
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,461,053
- Issue date Oct 29, 2019
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,204,878
- Issue date Feb 12, 2019
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,056,336
- Issue date Aug 21, 2018
- Renesas Electronics Corporation
- Masami Koketsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 9,799,609
- Issue date Oct 24, 2017
- Renesas Electronics Corporation
- Masami Koketsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 9,748,191
- Issue date Aug 29, 2017
- Renesas Electronics Corporation
- Shinya Suzuki
- G02 - OPTICS
Information Patent Grant
Epoxy resin composition for encapsulating semiconductor device and...
- Patent number 9,735,076
- Issue date Aug 15, 2017
- Samsung SDI Co., Ltd.
- Yoon Man Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,659,926
- Issue date May 23, 2017
- Renesas Electronics Corporation
- Shinya Suzuki
- G02 - OPTICS
Information Patent Grant
Substrate bonding with diffusion barrier structures
- Patent number 9,620,481
- Issue date Apr 11, 2017
- GLOBALFOUNDRIES Inc.
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip using top post-passivation technology and b...
- Patent number 9,612,615
- Issue date Apr 4, 2017
- QUALCOMM Incorporated
- Mou-Shiung Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor element, semiconductor device and method for manufact...
- Patent number 9,553,063
- Issue date Jan 24, 2017
- Mitsubishi Electric Corporation
- Kenji Ohtsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 9,536,839
- Issue date Jan 3, 2017
- Renesas Electronics Corporation
- Masami Koketsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 9,508,630
- Issue date Nov 29, 2016
- Renesas Electronics Corporation
- Shinya Suzuki
- G02 - OPTICS
Information Patent Grant
Semiconductor device, semiconductor package, and electronic device
- Patent number 9,496,226
- Issue date Nov 15, 2016
- Samsung Electronics Co., Ltd.
- Yong-Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 9,484,287
- Issue date Nov 1, 2016
- Renesas Electronics Corporation
- Shinya Suzuki
- G02 - OPTICS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 9,484,286
- Issue date Nov 1, 2016
- Renesas Electronics Corporation
- Shinya Suzuki
- G02 - OPTICS
Information Patent Grant
Semiconductor device having a chip mounting portion on which a sepa...
- Patent number 9,478,483
- Issue date Oct 25, 2016
- Renesas Electronics Corporation
- Yukihiro Sato
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device
- Patent number 9,391,066
- Issue date Jul 12, 2016
- Renesas Electronics Corporation
- Shinya Suzuki
- G02 - OPTICS
Information Patent Grant
Low fabrication cost, high performance, high reliability chip scale...
- Patent number 9,369,175
- Issue date Jun 14, 2016
- QUALCOMM Incorporated
- Jin-Yuan Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic component and method for producing same
- Patent number 9,299,653
- Issue date Mar 29, 2016
- TDK Corporation
- Minoru Satoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 9,281,291
- Issue date Mar 8, 2016
- Renesas Electronics Corporation
- Masami Koketsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and radio communication device
- Patent number 9,263,559
- Issue date Feb 16, 2016
- Murata Manufacturing Co., Ltd.
- Satoshi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and bonding material for semiconductor device
- Patent number 9,217,192
- Issue date Dec 22, 2015
- Osaka University
- Katsuaki Suganuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carbon nanotube-solder composite structures for interconnects, proc...
- Patent number 9,214,420
- Issue date Dec 15, 2015
- Intel Corporation
- Nachiket Raravikar
- B82 - NANO-TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
REVERSABLE ATTACHMENT SYSTEM
- Publication number 20240213212
- Publication date Jun 27, 2024
- The Boeing Company
- Peter D. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING A TRANSITION METAL NIOBIUM NITRIDE FILM ON A SU...
- Publication number 20240030035
- Publication date Jan 25, 2024
- ASM IP HOLDING B.V.
- Jerry Peijun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
REWORKABLE INTER-SUBSTRATE BOND STRUCTURE
- Publication number 20230378126
- Publication date Nov 23, 2023
- The Boeing Company
- Peter D. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Superconducting Bump Bonds for Quantum Computing Systems
- Publication number 20230207507
- Publication date Jun 29, 2023
- Google LLC
- Zhimin Jamie Yao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER...
- Publication number 20200211931
- Publication date Jul 2, 2020
- RENESAS ELECTRONICS CORPORATION
- Masahiro MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190027455
- Publication date Jan 24, 2019
- RENESAS ELECTRONICS CORPORATION
- SHINYA SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE HERMETIC MEMBRANES WITH ELECTRICALLY CONDUCTING VIAS
- Publication number 20180272137
- Publication date Sep 27, 2018
- Greatbatch Ltd.
- Keith W. Seitz
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20180025991
- Publication date Jan 25, 2018
- Renesas Electronics Corporation
- Masami KOKETSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20170338197
- Publication date Nov 23, 2017
- RENESAS ELECTRONICS CORPORATION
- Shinya SUZUKI
- G02 - OPTICS
Information Patent Application
EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND...
- Publication number 20160351461
- Publication date Dec 1, 2016
- Samsung SDI Co., Ltd.
- Yoon Man LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160315078
- Publication date Oct 27, 2016
- RENESAS ELECTRONICS CORPORATION
- SHINYA SUZUKI
- G02 - OPTICS
Information Patent Application
SUBSTRATE BONDING WITH DIFFUSION BARRIER STRUCTURES
- Publication number 20150262976
- Publication date Sep 17, 2015
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYER STACKS AND INTEGRATED CIRCUIT ARRANGEMENTS
- Publication number 20150228607
- Publication date Aug 13, 2015
- INFINEON TECHNOLOGIES AG
- Tobias Schmidt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATION, DEVICE STRUCTURE AND SUBMOUNT COMPRISING DIA...
- Publication number 20150140740
- Publication date May 21, 2015
- Advanced Diamond Technologies, Inc.
- Nicolaie A. Moldovan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150048510
- Publication date Feb 19, 2015
- Denso Corporation
- Manabu Tomisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140367863
- Publication date Dec 18, 2014
- NEC Corporation
- Shintaro Yamamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND RADIO COMMUNICATION DEVICE
- Publication number 20140361406
- Publication date Dec 11, 2014
- Satoshi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING WITH DIFFUSION BARRIER STRUCTURES
- Publication number 20140353828
- Publication date Dec 4, 2014
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20140312493
- Publication date Oct 23, 2014
- Shinya Suzuki
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR ELEMENT, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACT...
- Publication number 20140312361
- Publication date Oct 23, 2014
- MITSUBISHI ELECTRIC CORPORATION
- Kenji Ohtsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGN SYSTEM FOR SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SE...
- Publication number 20140304674
- Publication date Oct 9, 2014
- Isao SUGAYA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE
- Publication number 20140225236
- Publication date Aug 14, 2014
- Yong-Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGN SYSTEM FOR SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SE...
- Publication number 20140181781
- Publication date Jun 26, 2014
- Isao SUGAYA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20140110789
- Publication date Apr 24, 2014
- Renesas Electronics Corporation
- Masami KOKETSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED PROTECTION LAYER FOR COPPER POST STRUCTURE
- Publication number 20140103526
- Publication date Apr 17, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140008793
- Publication date Jan 9, 2014
- RENESAS ELECTRONICS CORPORATION
- Shinya Suzuki
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20130344693
- Publication date Dec 26, 2013
- Renesas Electronics Corporation
- Shinya SUZUKI
- G02 - OPTICS
Information Patent Application
CARBON NANOTUBE-SOLDER COMPOSITE STRUCTURES FOR INTERCONNECTS, PROC...
- Publication number 20130341787
- Publication date Dec 26, 2013
- Nachiket Raravikar
- B82 - NANO-TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20130307036
- Publication date Nov 21, 2013
- RENESAS ELECTRONICS CORPORATION
- Masami KOKETSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED PROTECTION LAYER FOR COPPER POST STRUCTURE
- Publication number 20130299972
- Publication date Nov 14, 2013
- Chung-Shi LIU
- H01 - BASIC ELECTRIC ELEMENTS

Niobium [Nb]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Superconducting bump bonds for quantum computing systems

Display substrate and preparation method thereof, and display appar...

Methods for forming a transition metal niobium nitride film on a su...

Superconducting bump bonds for quantum computing systems

Semiconductor device and a method of manufacturing the same

Flexible hermetic membranes with electrically conducting vias

Semiconductor device and a method of manufacturing the same

Semiconductor device

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Epoxy resin composition for encapsulating semiconductor device and...

Semiconductor device

Substrate bonding with diffusion barrier structures

Integrated circuit chip using top post-passivation technology and b...

Semiconductor element, semiconductor device and method for manufact...

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Semiconductor device, semiconductor package, and electronic device

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Semiconductor device having a chip mounting portion on which a sepa...

Semiconductor device

Low fabrication cost, high performance, high reliability chip scale...

Electronic component and method for producing same

Semiconductor device and a method of manufacturing the same

Semiconductor device and radio communication device

Semiconductor device and bonding material for semiconductor device

Carbon nanotube-solder composite structures for interconnects, proc...

Patents Applicationslast 30 patents

REVERSABLE ATTACHMENT SYSTEM

METHODS FOR FORMING A TRANSITION METAL NIOBIUM NITRIDE FILM ON A SU...

REWORKABLE INTER-SUBSTRATE BOND STRUCTURE

Superconducting Bump Bonds for Quantum Computing Systems

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER...

SEMICONDUCTOR DEVICE

FLEXIBLE HERMETIC MEMBRANES WITH ELECTRICALLY CONDUCTING VIAS

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND...

SEMICONDUCTOR DEVICE

SUBSTRATE BONDING WITH DIFFUSION BARRIER STRUCTURES

LAYER STACKS AND INTEGRATED CIRCUIT ARRANGEMENTS

METHOD OF FABRICATION, DEVICE STRUCTURE AND SUBMOUNT COMPRISING DIA...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND RADIO COMMUNICATION DEVICE

SUBSTRATE BONDING WITH DIFFUSION BARRIER STRUCTURES

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR ELEMENT, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACT...

DESIGN SYSTEM FOR SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SE...

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE

DESIGN SYSTEM FOR SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SE...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SELF-ALIGNED PROTECTION LAYER FOR COPPER POST STRUCTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

CARBON NANOTUBE-SOLDER COMPOSITE STRUCTURES FOR INTERCONNECTS, PROC...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SELF-ALIGNED PROTECTION LAYER FOR COPPER POST STRUCTURE