non conformal layer on a patterned surface

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H01L2224/05559

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/05559non conformal layer on a patterned surface

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating semiconductor package
- Patent number 12,266,639
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,255,161
- Issue date Mar 18, 2025
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 12,237,282
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Huan Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,218,087
- Issue date Feb 4, 2025
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip structure
- Patent number 12,176,245
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Sangjun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,998
- Issue date Dec 10, 2024
- Fuji Electric Co., Ltd.
- Tohru Shirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel, manufacturing method thereof, and display device
- Patent number 12,034,014
- Issue date Jul 9, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Zhongliu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including through-silicon-vias and methods of...
- Patent number 12,014,972
- Issue date Jun 18, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,002,772
- Issue date Jun 4, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal structure
- Patent number 11,961,880
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,935,871
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,901,390
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chien Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,862,586
- Issue date Jan 2, 2024
- Kioxia Corporation
- Mizuki Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package including under bump metal layer
- Patent number 11,862,589
- Issue date Jan 2, 2024
- Samsung Electronics Co., Ltd.
- Hyung Sun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive bump of a semiconductor device and fabricating method th...
- Patent number 11,837,562
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package including under bump metal layer
- Patent number 11,810,878
- Issue date Nov 7, 2023
- Samsung Electronics Co., Ltd.
- Hyung Sun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 11,791,286
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Youn-ji Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,532,736
- Issue date Dec 20, 2022
- Murata Manufacturing Co., Ltd.
- Yasunari Umemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via structure for semiconductor dies
- Patent number 11,373,968
- Issue date Jun 28, 2022
- Cirrus Logic, Inc.
- Yaoyu Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,362,052
- Issue date Jun 14, 2022
- Advanced Semiconductor Engineering, Inc.
- Chi-Chang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide semiconductor device having a step film formed betw...
- Patent number 11,245,013
- Issue date Feb 8, 2022
- Fuji Electric Co., Ltd.
- Yuichi Hashizume
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,189,583
- Issue date Nov 30, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Sheng-Chau Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS sensors and methods of forming the same
- Patent number 11,177,308
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chien Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-connection structure and manufacturing method thereof
- Patent number 11,152,319
- Issue date Oct 19, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package utilizing trace bump trace interconnection
- Patent number 11,121,108
- Issue date Sep 14, 2021
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package including under bump metal layer
- Patent number 11,107,783
- Issue date Aug 31, 2021
- Samsung Electronics Co., Ltd.
- Hyung Sun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including through-silicon-vias and methods of...
- Patent number 11,094,612
- Issue date Aug 17, 2021
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution metal and under bump metal interconnect structures a...
- Patent number 11,049,829
- Issue date Jun 29, 2021
- Avago Technologies International Sales Pte. Limited
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming interconnect structure
- Patent number 11,011,419
- Issue date May 18, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor-Zen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 11,011,482
- Issue date May 18, 2021
- Samsung Electronics Co., Ltd.
- Doo Hwan Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Mitigating process problems in hybrid bonding of vertical die stacking
- Publication number 20250118692
- Publication date Apr 10, 2025
- Marvell Asia Pte Ltd.
- Runzi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250096169
- Publication date Mar 20, 2025
- Fuji Electric Co., Ltd.
- Tohru SHIRAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP STRUCTURE
- Publication number 20250087531
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Sangjun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20240274554
- Publication date Aug 15, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL STRUCTURE
- Publication number 20240274653
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20240250047
- Publication date Jul 25, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20240234375
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240136383
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chien Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA FORMED IN A WAFER USING A FRONT-SIDE AND A BACK-SIDE PROCESS
- Publication number 20240038695
- Publication date Feb 1, 2024
- Celestial AI Inc.
- Ankur AGGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE VIA FORMED USING A PARTIAL PLUG THAT STOPS BEFORE...
- Publication number 20240038694
- Publication date Feb 1, 2024
- Celestial AI Inc.
- Ankur AGGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO CHIP AND DISPLAY APPARATUS INCLUDING THE SAME
- Publication number 20230402439
- Publication date Dec 14, 2023
- Samsung Electronics Co., Ltd.
- Kyungwook Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20230378140
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20230361062
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Huan Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE DIRECT BONDING
- Publication number 20230361074
- Publication date Nov 9, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20230299023
- Publication date Sep 21, 2023
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSING SIGNALS THROUGH MICRO DEVICE SIDEWALLS
- Publication number 20230170317
- Publication date Jun 1, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE
- Publication number 20230119548
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230060720
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220406739
- Publication date Dec 22, 2022
- KIOXIA Corporation
- Mizuki TAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220392858
- Publication date Dec 8, 2022
- Fuji Electric Co., Ltd.
- Tohru SHIRAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL STRUCTURE
- Publication number 20220359644
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURE FOR SEMICONDUCTOR DIES
- Publication number 20220285299
- Publication date Sep 8, 2022
- Cirrus Logic International Semiconductor Ltd.
- Yaoyu PANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD STRUCTURE, SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR PACKA...
- Publication number 20220084966
- Publication date Mar 17, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- PING-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE
- Publication number 20220077200
- Publication date Mar 10, 2022
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Zhongliu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220077217
- Publication date Mar 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chien Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20210384144
- Publication date Dec 9, 2021
- Samsung Electronics Co., Ltd.
- Youn-ji MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE INCLUDING UNDER BUMP METAL LAYER
- Publication number 20210358874
- Publication date Nov 18, 2021
- Samsung Electronics Co., Ltd.
- Hyung Sun JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210202413
- Publication date Jul 1, 2021
- Advanced Semiconductor Engineering, Inc.
- Chi-Chang LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210184022
- Publication date Jun 17, 2021
- Murata Manufacturing Co., Ltd.
- Yasunari UMEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE INCLUDING UNDER BUMP METAL LAYER
- Publication number 20210091026
- Publication date Mar 25, 2021
- Samsung Electronics Co., Ltd.
- Hyung Sun JANG
- H01 - BASIC ELECTRIC ELEMENTS

non conformal layer on a patterned surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of fabricating semiconductor package

Semiconductor device with composite conductive features and method...

Semiconductor device and method of forming the same

Semiconductor device with composite conductive features and method...

Semiconductor chip structure

Semiconductor device

Display panel, manufacturing method thereof, and display device

Semiconductor devices including through-silicon-vias and methods of...

Semiconductor device with composite conductive features and method...

Metal-insulator-metal structure

Semiconductor package and method of fabricating the same

Semiconductor device

Semiconductor device and method of manufacturing the same

Wafer-level package including under bump metal layer

Conductive bump of a semiconductor device and fabricating method th...

Wafer-level package including under bump metal layer

Semiconductor device and semiconductor package

Semiconductor device

Via structure for semiconductor dies

Semiconductor device package and method of manufacturing the same

Silicon carbide semiconductor device having a step film formed betw...

Semiconductor structure and manufacturing method thereof

CMOS sensors and methods of forming the same

Micro-connection structure and manufacturing method thereof

Flip chip package utilizing trace bump trace interconnection

Wafer-level package including under bump metal layer

Semiconductor devices including through-silicon-vias and methods of...

Redistribution metal and under bump metal interconnect structures a...

Method for forming interconnect structure

Fan-out semiconductor package

Patents Applicationslast 30 patents

Mitigating process problems in hybrid bonding of vertical die stacking

SEMICONDUCTOR DEVICE

SEMICONDUCTOR CHIP STRUCTURE

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

METAL-INSULATOR-METAL STRUCTURE

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

VIA FORMED IN A WAFER USING A FRONT-SIDE AND A BACK-SIDE PROCESS

THROUGH-SUBSTRATE VIA FORMED USING A PARTIAL PLUG THAT STOPS BEFORE...

MICRO CHIP AND DISPLAY APPARATUS INCLUDING THE SAME

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

LOW TEMPERATURE DIRECT BONDING

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

PASSING SIGNALS THROUGH MICRO DEVICE SIDEWALLS

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

METAL-INSULATOR-METAL STRUCTURE

VIA STRUCTURE FOR SEMICONDUCTOR DIES

BONDING PAD STRUCTURE, SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR PACKA...

DISPLAY PANEL, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

WAFER-LEVEL PACKAGE INCLUDING UNDER BUMP METAL LAYER

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

WAFER-LEVEL PACKAGE INCLUDING UNDER BUMP METAL LAYER