Non-printed capacitor

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CPC
H05K2201/10015

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10015Non-printed capacitor

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic assembly and method for thermal balancing of surfacemoun...
- Patent number 12,171,056
- Issue date Dec 17, 2024
- MELLANOX TECHNOLOGIES LTD.
- Igor Loiferman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer ceramic electronic component, multi-layer ceramic elect...
- Patent number 12,170,174
- Issue date Dec 17, 2024
- Taiyo Yuden Co., Ltd.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Providing a lower inductance path in a routing substrate for a capa...
- Patent number 12,160,952
- Issue date Dec 3, 2024
- QUALCOMM Incorporated
- Biancun Xie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embeddable semiconductor-based capacitor
- Patent number 12,159,945
- Issue date Dec 3, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and configuration for stacking multiple printed circuit boards
- Patent number 12,156,333
- Issue date Nov 26, 2024
- Mellanox Technologies, Ltd.
- Xiuzhuang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ESD protection of chip scale package LEDS
- Patent number 12,140,297
- Issue date Nov 12, 2024
- SIGNIFY HOLDING, B.V.
- Christian Tenhumberg
- F21 - LIGHTING
Information Patent Grant
Power converter
- Patent number 12,136,884
- Issue date Nov 5, 2024
- Delta Electronics, Inc.
- Yang Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory system
- Patent number 12,131,062
- Issue date Oct 29, 2024
- Kioxia Corporation
- Fuminori Kimura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thin film capacitor and electronic circuit substrate having the same
- Patent number 12,132,078
- Issue date Oct 29, 2024
- TDK Corporation
- Yoshihiko Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor and circuit board containing the same
- Patent number 12,112,891
- Issue date Oct 8, 2024
- KYOCERA AVX Components Corporation
- Jeffrey Cain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filter device
- Patent number 12,108,527
- Issue date Oct 1, 2024
- Murata Manufacturing Co., Ltd.
- Wataru Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate structure and electronic device including the same
- Patent number 12,108,534
- Issue date Oct 1, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Eun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus and substrate
- Patent number 12,101,886
- Issue date Sep 24, 2024
- Sony Group Corporation
- Keiichi Hirano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of electronic device
- Patent number 12,089,345
- Issue date Sep 10, 2024
- INNOLUX CORPORATION
- Yi-Hung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked power supply topologies and inductor devices
- Patent number 12,088,205
- Issue date Sep 10, 2024
- Infineon Technologies Austria AG
- Kennith K. Leong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and device including same
- Patent number 12,082,354
- Issue date Sep 3, 2024
- Medtronic, Inc.
- David A. Ruben
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Ceramic electronic component, circuit substrate arrangement, and me...
- Patent number 12,068,115
- Issue date Aug 20, 2024
- Taiyo Yuden Co., Ltd.
- Anju Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module comprising antenna and RF element, and base station includin...
- Patent number 12,062,853
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Kwanghyun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter transformer module with PCBS carrying secondary-sid...
- Patent number 12,063,741
- Issue date Aug 13, 2024
- Bel Fuse (MACAO COMMERCIAL OFFSHORE) Limited
- Hangdong Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compact memory device having a backup power source
- Patent number 12,062,409
- Issue date Aug 13, 2024
- Pliops Ltd
- Naseem Jamal
- G11 - INFORMATION STORAGE
Information Patent Grant
Electrical apparatus comprising a power semiconductor module and at...
- Patent number 12,058,805
- Issue date Aug 6, 2024
- HELLA GMBH & CO. KGAA
- Joël Afanou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded structures with integrated passive component
- Patent number 12,057,383
- Issue date Aug 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component built-in substrate including multilayer ceramic electroni...
- Patent number 12,051,547
- Issue date Jul 30, 2024
- Murata Manufacturing Co., Ltd.
- Yuichiro Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power supply unit for aerosol inhaler and control method and progra...
- Patent number 12,046,941
- Issue date Jul 23, 2024
- Japan Tobacco Inc.
- Takeshi Akao
- G05 - CONTROLLING REGULATING
Information Patent Grant
Pressure sintering device and method for manufacturing an electroni...
- Patent number 12,046,576
- Issue date Jul 23, 2024
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor
- Patent number 12,033,803
- Issue date Jul 9, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Man Su Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete metal-insulator-metal (MIM) energy storage component and m...
- Patent number 12,033,797
- Issue date Jul 9, 2024
- Smoltek AB
- Vincent Desmaris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic device
- Patent number 12,033,922
- Issue date Jul 9, 2024
- Denso Corporation
- Akihiro Fukatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power supply unit for aerosol inhaler
- Patent number 12,034,326
- Issue date Jul 9, 2024
- Japan Tobacco Inc.
- Takeshi Akao
- A24 - TOBACCO CIGARS CIGARETTES SMOKERS' REQUISITES
Information Patent Grant
Carrier board and power module using same
- Patent number 12,028,969
- Issue date Jul 2, 2024
- Delta Electronics (Shanghai) Co., Ltd.
- Shouyu Hong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...
- Publication number 20240422914
- Publication date Dec 19, 2024
- Mitsubishi Electric Corporation
- Yosuke NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERSION DEVICE
- Publication number 20240413762
- Publication date Dec 12, 2024
- Mitsubishi Electric Corporation
- Takuya NAKAMURA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240413061
- Publication date Dec 12, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Hsuan HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SNAP FIT BRACKET FOR ELECTROLYTIC CAPACITORS
- Publication number 20240412922
- Publication date Dec 12, 2024
- Western Digital Technologies, Inc.
- Shiqiang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC DEVICE, MANUFACTURING METHOD OF THE S...
- Publication number 20240412924
- Publication date Dec 12, 2024
- Taiyo Yuden Co., Ltd.
- Daisuke IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLYTIC CAPACITORS HAVING ENCLOSURES THAT ENABLE THE CAPACITOR...
- Publication number 20240407100
- Publication date Dec 5, 2024
- Western Digital Technologies, Inc.
- Fei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-BOARD CHARGER
- Publication number 20240407081
- Publication date Dec 5, 2024
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Suhua Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAYERED CERAMIC ELECTRONIC COMPONENT MOUNTING STRUCTURE
- Publication number 20240407101
- Publication date Dec 5, 2024
- Murata Manufacturing Co., Ltd.
- Toshihiro HARADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE COMPRISING ANTENNA AND RF ELEMENT, AND BASE STATION INCLUDIN...
- Publication number 20240405449
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Kwanghyun BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT SUPPORT FOR AN INTEGRATED CIRCUIT
- Publication number 20240396238
- Publication date Nov 28, 2024
- VALEO SYSTEMES D'ESSUYAGE
- Siegfried STEFANI
- B60 - VEHICLES IN GENERAL
Information Patent Application
CIRCUIT BOARD DEVICE WITH INDUCTOR(S) FOR ROUTING POWER FROM A POWE...
- Publication number 20240387345
- Publication date Nov 21, 2024
- QUALCOMM Incorporated
- Venkatesh Sadineni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR, MULTILAYER-CERAMIC-CAPACITOR MANUFACT...
- Publication number 20240387112
- Publication date Nov 21, 2024
- Murata Manufacturing Co., Ltd.
- Toshiyuki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CONTROL DEVICE
- Publication number 20240389228
- Publication date Nov 21, 2024
- Hitachi Astemo, Ltd.
- Akira ISHII
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND SUBSTRATE WITH ELECTRONIC COMPONENT EMBEDD...
- Publication number 20240387110
- Publication date Nov 21, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Ho In JUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plateable Single Layer Capacitor
- Publication number 20240381537
- Publication date Nov 14, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20240381540
- Publication date Nov 14, 2024
- Innolux Corporation
- Yi-Hung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE HAVING ELECTRONIC COMPONENT MOUNTED IN A CAVITY OF A CORE...
- Publication number 20240373561
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Jung Won PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240373558
- Publication date Nov 7, 2024
- Innolux Corporation
- Chin-Lung Ting
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NOISE FILTER CIRCUIT
- Publication number 20240372521
- Publication date Nov 7, 2024
- Mitsubishi Electric Corporation
- Satoshi Yoneda
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PACKAGE SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT MOUNTED ON C...
- Publication number 20240373560
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Seongryul CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT IN A CORE OF...
- Publication number 20240373562
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Seongryul CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING CIRCU...
- Publication number 20240365464
- Publication date Oct 31, 2024
- Canon Kabushiki Kaisha
- HIROYUKI YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH CAPACITANCE MEMORY DEVICE
- Publication number 20240357745
- Publication date Oct 24, 2024
- INNODISK CORPORATION
- CHIH-CHIEH KAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Eddy Current Mitigation for On-Chip Inductors
- Publication number 20240357734
- Publication date Oct 24, 2024
- Apple Inc.
- Behzad Biglarbegian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH CAPACITANCE MODULE
- Publication number 20240357746
- Publication date Oct 24, 2024
- INNODISK CORPORATION
- CHIH-CHIEH KAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Eddy Current Mitigation for On-Chip Inductors
- Publication number 20240357733
- Publication date Oct 24, 2024
- Apple Inc.
- Behzad Biglarbegian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE THERMAL BRIDGE INTEGRATED ON A LOW THERMAL CONDUCTI...
- Publication number 20240341026
- Publication date Oct 10, 2024
- Haedong JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE STRUCTURE, WIRE CAPACITOR, AND ELECTRONIC DEVICE INCLUDING THE...
- Publication number 20240321483
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Jaehoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUPPLY UNIT FOR AEROSOL INHALER
- Publication number 20240313564
- Publication date Sep 19, 2024
- Japan Tobacco Inc.
- Takeshi AKAO
- A24 - TOBACCO CIGARS CIGARETTES SMOKERS' REQUISITES
Information Patent Application
DECOUPLED PCB STRUCTURE TO PARALLEL POWER TRANSISTORS
- Publication number 20240305184
- Publication date Sep 12, 2024
- SCHNEIDER ELECTRIC IT CORPORATION
- Indra Prakash
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Non-printed capacitor

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic assembly and method for thermal balancing of surfacemoun...

Multi-layer ceramic electronic component, multi-layer ceramic elect...

Providing a lower inductance path in a routing substrate for a capa...

Embeddable semiconductor-based capacitor

Method and configuration for stacking multiple printed circuit boards

ESD protection of chip scale package LEDS

Power converter

Memory system

Thin film capacitor and electronic circuit substrate having the same

Multilayer capacitor and circuit board containing the same

Filter device

Substrate structure and electronic device including the same

Electronic apparatus and substrate

Manufacturing method of electronic device

Stacked power supply topologies and inductor devices

Electronic package and device including same

Ceramic electronic component, circuit substrate arrangement, and me...

Module comprising antenna and RF element, and base station includin...

Power converter transformer module with PCBS carrying secondary-sid...

Compact memory device having a backup power source

Electrical apparatus comprising a power semiconductor module and at...

Bonded structures with integrated passive component

Component built-in substrate including multilayer ceramic electroni...

Power supply unit for aerosol inhaler and control method and progra...

Pressure sintering device and method for manufacturing an electroni...

Multilayer capacitor

Discrete metal-insulator-metal (MIM) energy storage component and m...

Semiconductor device and electronic device

Power supply unit for aerosol inhaler

Carrier board and power module using same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...

POWER CONVERSION DEVICE

PACKAGE STRUCTURE

SNAP FIT BRACKET FOR ELECTROLYTIC CAPACITORS

MULTILAYER CERAMIC ELECTRONIC DEVICE, MANUFACTURING METHOD OF THE S...

ELECTROLYTIC CAPACITORS HAVING ENCLOSURES THAT ENABLE THE CAPACITOR...

ON-BOARD CHARGER

LAYERED CERAMIC ELECTRONIC COMPONENT MOUNTING STRUCTURE

MODULE COMPRISING ANTENNA AND RF ELEMENT, AND BASE STATION INCLUDIN...

CONTACT SUPPORT FOR AN INTEGRATED CIRCUIT

CIRCUIT BOARD DEVICE WITH INDUCTOR(S) FOR ROUTING POWER FROM A POWE...

MULTILAYER CERAMIC CAPACITOR, MULTILAYER-CERAMIC-CAPACITOR MANUFACT...

ELECTRONIC CONTROL DEVICE

ELECTRONIC COMPONENT AND SUBSTRATE WITH ELECTRONIC COMPONENT EMBEDD...

Plateable Single Layer Capacitor

MANUFACTURING METHOD OF ELECTRONIC DEVICE

SUBSTRATE HAVING ELECTRONIC COMPONENT MOUNTED IN A CAVITY OF A CORE...

ELECTRONIC DEVICE

NOISE FILTER CIRCUIT

PACKAGE SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT MOUNTED ON C...

PACKAGE SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT IN A CORE OF...

CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING CIRCU...

HIGH CAPACITANCE MEMORY DEVICE

Eddy Current Mitigation for On-Chip Inductors

HIGH CAPACITANCE MODULE

Eddy Current Mitigation for On-Chip Inductors

SILICON CARBIDE THERMAL BRIDGE INTEGRATED ON A LOW THERMAL CONDUCTI...

WIRE STRUCTURE, WIRE CAPACITOR, AND ELECTRONIC DEVICE INCLUDING THE...

POWER SUPPLY UNIT FOR AEROSOL INHALER

DECOUPLED PCB STRUCTURE TO PARALLEL POWER TRANSISTORS