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SEMICONDUCTOR PACKAGE
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Publication number 20250132271
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Publication date Apr 24, 2025
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Samsung Electronics Co., Ltd.
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Kyojin Hwang
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H01 - BASIC ELECTRIC ELEMENTS
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CIRCUIT BOARD SYSTEM
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Publication number 20250133658
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Publication date Apr 24, 2025
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Harman Becker Automotive Systems GmbH
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Andreas KUSKA
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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SELF-CENTERING CERAMIC WASHER
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Publication number 20250114622
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Publication date Apr 10, 2025
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Greatbatch Ltd.
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Jason Woods
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H01 - BASIC ELECTRIC ELEMENTS
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COATED ELECTRICAL ASSEMBLY
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Publication number 20250098077
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Publication date Mar 20, 2025
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HZO, Inc.
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Gianfranco Aresta
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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STORAGE DEVICE
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Publication number 20250089170
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Publication date Mar 13, 2025
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Samsung Electronics Co., Ltd.
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Suin KIM
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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WIRING BOARD AND LAMINATED WIRING BOARD
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Publication number 20250081329
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Publication date Mar 6, 2025
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Shinko Electric Industries Co., Ltd.
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Yoshihiro Kobayashi
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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PRINTED CIRCUIT BOARD
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Publication number 20250063666
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Publication date Feb 20, 2025
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Samsung Electro-Mechanics Co., Ltd.
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Dae Jung BYUN
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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SUBSTRATE WITH A CURRENT LIMITER
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Publication number 20250040027
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Publication date Jan 30, 2025
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Micron Technology, Inc.
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Byung Hoon Moon
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H01 - BASIC ELECTRIC ELEMENTS
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