Non-printed capacitor

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CPC
H05K2201/10015

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10015Non-printed capacitor

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Fabric with embedded electrical components
- Patent number 12,232,270
- Issue date Feb 18, 2025
- Apple Inc.
- Daniel D. Sunshine
- D03 - WEAVING
Information Patent Grant
Power storage module and method of manufacturing same
- Patent number 12,230,771
- Issue date Feb 18, 2025
- PRIME PLANET ENERGY & SOLUTIONS, INC.
- Takashi Inamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device
- Patent number 12,232,265
- Issue date Feb 18, 2025
- Kioxia Corporation
- Koji Ueno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electro-optical device and electronic apparatus
- Patent number 12,222,614
- Issue date Feb 11, 2025
- Seiko Epson Corporation
- Shinsuke Fujikawa
- G01 - MEASURING TESTING
Information Patent Grant
Interlaced crosstalk controlled traces, vias, and capacitors
- Patent number 12,225,658
- Issue date Feb 11, 2025
- Cisco Technology, Inc.
- Shadi Ebrahimi Asl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer capacitor and board having the same mounted thereon
- Patent number 12,224,121
- Issue date Feb 11, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- A Ra Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite electronic component
- Patent number 12,224,111
- Issue date Feb 11, 2025
- TDK Corporation
- Takashi Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitor and electronic circuit substrate having the same
- Patent number 12,218,185
- Issue date Feb 4, 2025
- TDK Corporation
- Daiki Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and power module
- Patent number 12,217,899
- Issue date Feb 4, 2025
- Delta Electronics, Inc.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board and electronic device
- Patent number 12,219,712
- Issue date Feb 4, 2025
- Canon Kabushiki Kaisha
- Noritake Tsuboi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multilayer capacitor and board having the same embedded therein
- Patent number 12,211,649
- Issue date Jan 28, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Min Cheol Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular capacitor subassembly for backup power
- Patent number 12,207,409
- Issue date Jan 21, 2025
- Intel Corporation
- John Hung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Coaxial isolator
- Patent number 12,206,151
- Issue date Jan 21, 2025
- EZconn Corporation
- Ming-Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic component, substrate arrangement, and method of...
- Patent number 12,198,859
- Issue date Jan 14, 2025
- Taiyo Yuden Co., Ltd.
- Yasutomo Suga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating unit for circuit board
- Patent number 12,200,856
- Issue date Jan 14, 2025
- HARTING Electric Stiftung & Co. KG
- Norbert Kropiewnicki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component
- Patent number 12,193,147
- Issue date Jan 7, 2025
- Murata Manufacturing Co., Ltd.
- Ikuo Deguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power conversion device
- Patent number 12,184,190
- Issue date Dec 31, 2024
- Denso Corporation
- Daisuke Yamazaki
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Circuit assemblies including metallic bars
- Patent number 12,185,454
- Issue date Dec 31, 2024
- Maxim Integrated Products, Inc.
- Alexandr Ikriannikov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component embedded substrate
- Patent number 12,185,471
- Issue date Dec 31, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Ho Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal-insulator-metal (MIM) energy storage device with layered stac...
- Patent number 12,183,520
- Issue date Dec 31, 2024
- Smoltek AB
- M Shafiqul Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly and method for thermal balancing of surfacemoun...
- Patent number 12,171,056
- Issue date Dec 17, 2024
- MELLANOX TECHNOLOGIES LTD.
- Igor Loiferman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer ceramic electronic component, multi-layer ceramic elect...
- Patent number 12,170,174
- Issue date Dec 17, 2024
- Taiyo Yuden Co., Ltd.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Providing a lower inductance path in a routing substrate for a capa...
- Patent number 12,160,952
- Issue date Dec 3, 2024
- QUALCOMM Incorporated
- Biancun Xie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embeddable semiconductor-based capacitor
- Patent number 12,159,945
- Issue date Dec 3, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and configuration for stacking multiple printed circuit boards
- Patent number 12,156,333
- Issue date Nov 26, 2024
- Mellanox Technologies, Ltd.
- Xiuzhuang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ESD protection of chip scale package LEDS
- Patent number 12,140,297
- Issue date Nov 12, 2024
- SIGNIFY HOLDING, B.V.
- Christian Tenhumberg
- F21 - LIGHTING
Information Patent Grant
Power converter
- Patent number 12,136,884
- Issue date Nov 5, 2024
- Delta Electronics, Inc.
- Yang Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory system
- Patent number 12,131,062
- Issue date Oct 29, 2024
- Kioxia Corporation
- Fuminori Kimura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thin film capacitor and electronic circuit substrate having the same
- Patent number 12,132,078
- Issue date Oct 29, 2024
- TDK Corporation
- Yoshihiko Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor and circuit board containing the same
- Patent number 12,112,891
- Issue date Oct 8, 2024
- KYOCERA AVX Components Corporation
- Jeffrey Cain
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250063666
- Publication date Feb 20, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Dae Jung BYUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME
- Publication number 20250056730
- Publication date Feb 13, 2025
- USI Science and Technology (Shenzhen) Co., Ltd.
- MING CHANG TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONTROL BOARD, AIR CONDITIONER OUTDOOR UNIT, AND AIR CON...
- Publication number 20250043967
- Publication date Feb 6, 2025
- GD MIDEA AIR-CONDITIONING EQUIPMENT CO., LTD.
- Zhiguo SHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE WITH THE SAME
- Publication number 20250048555
- Publication date Feb 6, 2025
- Delta Electronics, Inc.
- Hung-Wen CHUEH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW SWITCHING LOSS INVERTER CIRCUIT BOARD
- Publication number 20250048537
- Publication date Feb 6, 2025
- Garrett Transportation I Inc.
- Ludek Zavodny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING PRINTED CIRCUIT BOARD
- Publication number 20250040038
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Minseok LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE WITH A CURRENT LIMITER
- Publication number 20250040027
- Publication date Jan 30, 2025
- Micron Technology, Inc.
- Byung Hoon Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer Capacitor and Circuit Board Containing the Same
- Publication number 20250029785
- Publication date Jan 23, 2025
- KYOCERA AVX Components Corporation
- Jeffrey Cain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUNCTIONAL SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20250029938
- Publication date Jan 23, 2025
- BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Yifan WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC MULTILAYERED CERAMIC CAPACITOR
- Publication number 20250022661
- Publication date Jan 16, 2025
- Kemet Electronics Corporation
- Miles T. Ingram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND CONFIGURATION FOR STACKING MULTIPLE PRINTED CIRCUIT BOARDS
- Publication number 20250024606
- Publication date Jan 16, 2025
- MELLANOX TECHNOLOGIES, LTD.
- Xiuzhuang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR AND ELECTRONIC DEVICE WITH THE CAPACITOR MOUNTED THEREON
- Publication number 20250014825
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Sunwoo Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUPPLY BOARDS FOR WIRELESS COMMUNICATIONS DEVICES
- Publication number 20250008646
- Publication date Jan 2, 2025
- Plume Design, Inc.
- Chiu-Wen CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FUNCTIONAL SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, AND ELE...
- Publication number 20250008662
- Publication date Jan 2, 2025
- BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Qichang AN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSFORMER AND RECTIFIER ARRAY FOR HIGH-DENSITY POWER DELIVERY
- Publication number 20250006423
- Publication date Jan 2, 2025
- Virginia Tech Intellectual Properties, Inc.
- Pranav Raj Prakash
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ASSEMBLY AND INTEGRATED POWER CONVERTER MODULE
- Publication number 20240431029
- Publication date Dec 26, 2024
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Jianhong ZENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER CERAMIC CAPACITOR AND MOUNTING STRUCTURE FOR MULTILAYER...
- Publication number 20240428994
- Publication date Dec 26, 2024
- Murata Manufacturing Co., Ltd.
- Daisuke OYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LATERALLY PLACED CAPACITOR PACKAGE ASSEMBLY AND ASSEMBLY METHOD THE...
- Publication number 20240431032
- Publication date Dec 26, 2024
- APAQ TECHNOLOGY CO., LTD.
- CHING-FENG LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...
- Publication number 20240422914
- Publication date Dec 19, 2024
- Mitsubishi Electric Corporation
- Yosuke NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERSION DEVICE
- Publication number 20240413762
- Publication date Dec 12, 2024
- Mitsubishi Electric Corporation
- Takuya NAKAMURA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240413061
- Publication date Dec 12, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Hsuan HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SNAP FIT BRACKET FOR ELECTROLYTIC CAPACITORS
- Publication number 20240412922
- Publication date Dec 12, 2024
- Western Digital Technologies, Inc.
- Shiqiang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC DEVICE, MANUFACTURING METHOD OF THE S...
- Publication number 20240412924
- Publication date Dec 12, 2024
- Taiyo Yuden Co., Ltd.
- Daisuke IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLYTIC CAPACITORS HAVING ENCLOSURES THAT ENABLE THE CAPACITOR...
- Publication number 20240407100
- Publication date Dec 5, 2024
- Western Digital Technologies, Inc.
- Fei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-BOARD CHARGER
- Publication number 20240407081
- Publication date Dec 5, 2024
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Suhua Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAYERED CERAMIC ELECTRONIC COMPONENT MOUNTING STRUCTURE
- Publication number 20240407101
- Publication date Dec 5, 2024
- Murata Manufacturing Co., Ltd.
- Toshihiro HARADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE COMPRISING ANTENNA AND RF ELEMENT, AND BASE STATION INCLUDIN...
- Publication number 20240405449
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Kwanghyun BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT SUPPORT FOR AN INTEGRATED CIRCUIT
- Publication number 20240396238
- Publication date Nov 28, 2024
- VALEO SYSTEMES D'ESSUYAGE
- Siegfried STEFANI
- B60 - VEHICLES IN GENERAL
Information Patent Application
CIRCUIT BOARD DEVICE WITH INDUCTOR(S) FOR ROUTING POWER FROM A POWE...
- Publication number 20240387345
- Publication date Nov 21, 2024
- QUALCOMM Incorporated
- Venkatesh Sadineni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR, MULTILAYER-CERAMIC-CAPACITOR MANUFACT...
- Publication number 20240387112
- Publication date Nov 21, 2024
- Murata Manufacturing Co., Ltd.
- Toshiyuki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS

Non-printed capacitor

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fabric with embedded electrical components

Power storage module and method of manufacturing same

Semiconductor storage device

Electro-optical device and electronic apparatus

Interlaced crosstalk controlled traces, vias, and capacitors

Multilayer capacitor and board having the same mounted thereon

Composite electronic component

Thin film capacitor and electronic circuit substrate having the same

Apparatus and power module

Printed circuit board and electronic device

Multilayer capacitor and board having the same embedded therein

Modular capacitor subassembly for backup power

Coaxial isolator

Ceramic electronic component, substrate arrangement, and method of...

Insulating unit for circuit board

Electronic component

Power conversion device

Circuit assemblies including metallic bars

Electronic component embedded substrate

Metal-insulator-metal (MIM) energy storage device with layered stac...

Electronic assembly and method for thermal balancing of surfacemoun...

Multi-layer ceramic electronic component, multi-layer ceramic elect...

Providing a lower inductance path in a routing substrate for a capa...

Embeddable semiconductor-based capacitor

Method and configuration for stacking multiple printed circuit boards

ESD protection of chip scale package LEDS

Power converter

Memory system

Thin film capacitor and electronic circuit substrate having the same

Multilayer capacitor and circuit board containing the same

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD

ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME

ELECTRICAL CONTROL BOARD, AIR CONDITIONER OUTDOOR UNIT, AND AIR CON...

CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE WITH THE SAME

LOW SWITCHING LOSS INVERTER CIRCUIT BOARD

ELECTRONIC DEVICE INCLUDING PRINTED CIRCUIT BOARD

SUBSTRATE WITH A CURRENT LIMITER

Multilayer Capacitor and Circuit Board Containing the Same

FUNCTIONAL SUBSTRATE AND METHOD FOR MANUFACTURING SAME

MONOLITHIC MULTILAYERED CERAMIC CAPACITOR

METHOD AND CONFIGURATION FOR STACKING MULTIPLE PRINTED CIRCUIT BOARDS

CAPACITOR AND ELECTRONIC DEVICE WITH THE CAPACITOR MOUNTED THEREON

POWER SUPPLY BOARDS FOR WIRELESS COMMUNICATIONS DEVICES

FUNCTIONAL SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, AND ELE...

TRANSFORMER AND RECTIFIER ARRAY FOR HIGH-DENSITY POWER DELIVERY

INTEGRATED ASSEMBLY AND INTEGRATED POWER CONVERTER MODULE

MULTILAYER CERAMIC CAPACITOR AND MOUNTING STRUCTURE FOR MULTILAYER...

LATERALLY PLACED CAPACITOR PACKAGE ASSEMBLY AND ASSEMBLY METHOD THE...

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...

POWER CONVERSION DEVICE

PACKAGE STRUCTURE

SNAP FIT BRACKET FOR ELECTROLYTIC CAPACITORS

MULTILAYER CERAMIC ELECTRONIC DEVICE, MANUFACTURING METHOD OF THE S...

ELECTROLYTIC CAPACITORS HAVING ENCLOSURES THAT ENABLE THE CAPACITOR...

ON-BOARD CHARGER

LAYERED CERAMIC ELECTRONIC COMPONENT MOUNTING STRUCTURE

MODULE COMPRISING ANTENNA AND RF ELEMENT, AND BASE STATION INCLUDIN...

CONTACT SUPPORT FOR AN INTEGRATED CIRCUIT

CIRCUIT BOARD DEVICE WITH INDUCTOR(S) FOR ROUTING POWER FROM A POWE...

MULTILAYER CERAMIC CAPACITOR, MULTILAYER-CERAMIC-CAPACITOR MANUFACT...