Non-printed capacitor

Industry

CPC
H05K2201/10015

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10015Non-printed capacitor

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Thin film capacitor and electronic circuit substrate having the same
- Patent number 12,369,337
- Issue date Jul 22, 2025
- TDK Corporation
- Daiki Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic component
- Patent number 12,369,254
- Issue date Jul 22, 2025
- Murata Manufacturing Co., Ltd.
- Satoshi Yokomizo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit and connector element alignment, circuit board assemblies
- Patent number 12,369,253
- Issue date Jul 22, 2025
- Infineon Technologies Austria AG
- Eung San Cho
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Backside recess in motherboard with thermally conductive mold
- Patent number 12,363,831
- Issue date Jul 15, 2025
- Intel Corporation
- Kaladhar Radhakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module
- Patent number 12,356,538
- Issue date Jul 8, 2025
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module
- Patent number 12,349,327
- Issue date Jul 1, 2025
- Murata Manufacturing Co., Ltd.
- Shota Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component embedded substrate
- Patent number 12,349,283
- Issue date Jul 1, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Ho Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power supply apparatus, load and electronic device
- Patent number 12,342,450
- Issue date Jun 24, 2025
- Delta Electronics (Shanghai) Co., Ltd.
- Wulong Cong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and electronic device
- Patent number 12,342,452
- Issue date Jun 24, 2025
- Murata Manufacturing Co., Ltd.
- Kosuke Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitor, its manufacturing method, and electronic circu...
- Patent number 12,336,203
- Issue date Jun 17, 2025
- TDK Corporation
- Daiki Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency module and communication device
- Patent number 12,336,156
- Issue date Jun 17, 2025
- Murata Manufacturing Co., Ltd.
- Kunitoshi Hanaoka
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic component and board having the same mounted thereon
- Patent number 12,322,557
- Issue date Jun 3, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ki Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, semiconductor device, and method of manufacturing wir...
- Patent number 12,317,416
- Issue date May 27, 2025
- Kioxia Corporation
- Tomonori Kawata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power storage module
- Patent number 12,315,893
- Issue date May 27, 2025
- PRIME PLANET ENERGY & SOLUTIONS, INC.
- Takashi Inamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlocked circuit board elements and assemblies
- Patent number 12,309,928
- Issue date May 20, 2025
- Infineon Technologies Austria AG
- Darryl Galipeau
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electronic component module, sub-module, and method for manufacturi...
- Patent number 12,309,932
- Issue date May 20, 2025
- Murata Manufacturing Co., Ltd.
- Tsuyoshi Takakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High capacitance memory device
- Patent number 12,309,935
- Issue date May 20, 2025
- Innodisk Corporation
- Chih-Chieh Kao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board including bonding layer, having conductive pa...
- Patent number 12,295,100
- Issue date May 6, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sang Yoon Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metamaterial electromagnetic absorber
- Patent number 12,289,823
- Issue date Apr 29, 2025
- Hyundai Motor Company
- Seung Hyun Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-cell power converter
- Patent number 12,289,060
- Issue date Apr 29, 2025
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-centering ceramic washer that prevents misalignment when posit...
- Patent number 12,268,889
- Issue date Apr 8, 2025
- Greatbatch Ltd.
- Jason Woods
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure of electronic component
- Patent number 12,267,956
- Issue date Apr 1, 2025
- Murata Manufacturing Co., Ltd.
- Noboru Serita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor-wire-embedded wiring board
- Patent number 12,267,962
- Issue date Apr 1, 2025
- Samsung Electronics Co., Ltd.
- Soojae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module
- Patent number 12,262,519
- Issue date Mar 25, 2025
- Murata Manufacturing Co., Ltd.
- Shota Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting substrate, electronic component mount...
- Patent number 12,256,491
- Issue date Mar 18, 2025
- Sony Group Corporation
- Koji Aoyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High current surface mount toroid inductor
- Patent number 12,255,002
- Issue date Mar 18, 2025
- Steering Solutions IP Holding Corporation
- Michael C. Hallman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rapid implementation of high-temperature analog interface electronics
- Patent number 12,256,493
- Issue date Mar 18, 2025
- Ian Getreu
- G01 - MEASURING TESTING
Information Patent Grant
Self-centering polymeric washer that prevents misalignment when pos...
- Patent number 12,246,183
- Issue date Mar 11, 2025
- Greatbatch Ltd.
- Jason Woods
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor bank assembly
- Patent number 12,250,771
- Issue date Mar 11, 2025
- Rockwell Collins, Inc.
- Martin J. Jennings
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin film capacitor and electronic circuit substrate having the same
- Patent number 12,237,366
- Issue date Feb 25, 2025
- TDK Corporation
- Daiki Ishii
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Thermal Management Enhancement of Electronic Components
- Publication number 20250240867
- Publication date Jul 24, 2025
- Wolfspeed, Inc.
- Kenneth P. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR, PACKAGE, AND CIRCUIT BOARD
- Publication number 20250239408
- Publication date Jul 24, 2025
- Taiyo Yuden Co., Ltd.
- Ayumi SHIROTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250226155
- Publication date Jul 10, 2025
- Taiyo Yuden Co., Ltd.
- Maiko YAMANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUPPLY MODULE
- Publication number 20250227845
- Publication date Jul 10, 2025
- CYNTEC CO., LTD.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INVERTER-INTEGRATED ELECTRIC COMPRESSOR
- Publication number 20250215869
- Publication date Jul 3, 2025
- Sanden Corporation
- Toshimasa SHIMA
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
FLOW ENHANCED DUMMY STRUCTURE TO ENABLE CAPILLARY FLOW BASED SIDEWA...
- Publication number 20250220818
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL TRANSCEIVER EQUIPPED WITH GROUND VIA
- Publication number 20250220804
- Publication date Jul 3, 2025
- Prime World International Holdings Ltd.
- Chao-Hung TSAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THIN FILM CAPACITOR AND ELECTRONIC CIRCUIT BOARD HAVING THE SAME
- Publication number 20250218659
- Publication date Jul 3, 2025
- TDK Corporation
- Yoshiaki HAYAMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT EMBEDDED IN MOLD MATERIAL FOR MITIGATING THICKNESS MISMAT...
- Publication number 20250220819
- Publication date Jul 3, 2025
- Intel Corporation
- Pratyasha MOHAPATRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20250210272
- Publication date Jun 26, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Min Sik WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250212335
- Publication date Jun 26, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Tae Kyung LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SUPPLY UNIT WITH IMPROVED SPACE UTILIZATION AND HEAT DISSIPATION
- Publication number 20250212372
- Publication date Jun 26, 2025
- PANJIT INTERNATIONAL INC.
- CHIEN-CHUN WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT, PACKAGE BODY, AND CIRCUIT...
- Publication number 20250201476
- Publication date Jun 19, 2025
- Taiyo Yuden Co., Ltd.
- Hiroaki SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTEGRATED STACK CAPACITOR AND METHOD OF...
- Publication number 20250192121
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Jin SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFICIENT ASSEMBLY FOR ELECTROLYTIC CAPACITORS ON SOLID STATE DRIVES
- Publication number 20250194016
- Publication date Jun 12, 2025
- Western Digital Technologies, Inc.
- Dibin Gangadharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ELECTRONIC COMPONENT
- Publication number 20250191845
- Publication date Jun 12, 2025
- Murata Manufacturing Co., Ltd.
- Tatsunori YASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLOT MEMBER AND POWER ELECTRONIC DEVICE INCLUDING SAME
- Publication number 20250185172
- Publication date Jun 5, 2025
- LS ELECTRIC CO., LTD.
- Su Hyeong LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DELIVERY OF POWER TO A CHIP THROUGH A DAUGHTER BOARD USING CONNECTI...
- Publication number 20250185169
- Publication date Jun 5, 2025
- Arista Networks, Inc.
- Robert Morris Wilcox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR EMBEDDED SUBSTRATE
- Publication number 20250174405
- Publication date May 29, 2025
- Murata Manufacturing Co., Ltd.
- Shuhei YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS OF COMPRESSOR CONTROL WITH SURGE AVOIDANCE AND...
- Publication number 20250164568
- Publication date May 22, 2025
- Garrett Transportation I Inc.
- Jaroslav Pekar
- B60 - VEHICLES IN GENERAL
Information Patent Application
PRINTED CIRCUIT BOARD HAVING OPTIONAL CIRCUIT UNIT
- Publication number 20250159804
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Kihun OH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE
- Publication number 20250159811
- Publication date May 15, 2025
- KIOXIA Corporation
- Koji UENO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and Method for Improving Micro-Inverter Longevity
- Publication number 20250151199
- Publication date May 8, 2025
- AA Power Inc.
- Qun Lu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
THIN FILM CAPACITOR AND ELECTRONIC CIRCUIT BOARD HAVING THE SAME
- Publication number 20250149252
- Publication date May 8, 2025
- TDK Corporation
- Daiki ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CONFIGURABLE ANTENNA TUNER CIRCUIT BOARD
- Publication number 20250142714
- Publication date May 1, 2025
- Dell Products L.P.
- Changsoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Embedded Electronic Switch Components and a...
- Publication number 20250142713
- Publication date May 1, 2025
- AT&S Austria Technologie & Systemtechnik AG
- Gerald WEIS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD TH...
- Publication number 20250140480
- Publication date May 1, 2025
- Taiyo Yuden Co., Ltd.
- Shunya FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD SYSTEM
- Publication number 20250133658
- Publication date Apr 24, 2025
- Harman Becker Automotive Systems GmbH
- Andreas KUSKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250132271
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Kyojin Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR AND MULTILAYER CERAMIC CAPACITOR MOUNT...
- Publication number 20250132096
- Publication date Apr 24, 2025
- KYOCERA CORPORATION
- Tomohiro YANO
- H01 - BASIC ELECTRIC ELEMENTS

Non-printed capacitor

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thin film capacitor and electronic circuit substrate having the same

Method of manufacturing electronic component

Circuit and connector element alignment, circuit board assemblies

Backside recess in motherboard with thermally conductive mold

Electronic component module

Module

Electronic component embedded substrate

Power supply apparatus, load and electronic device

Circuit board and electronic device

Thin film capacitor, its manufacturing method, and electronic circu...

Radio frequency module and communication device

Electronic component and board having the same mounted thereon

Wiring board, semiconductor device, and method of manufacturing wir...

Power storage module

Interlocked circuit board elements and assemblies

Electronic component module, sub-module, and method for manufacturi...

High capacitance memory device

Printed circuit board including bonding layer, having conductive pa...

Metamaterial electromagnetic absorber

Multi-cell power converter

Self-centering ceramic washer that prevents misalignment when posit...

Mounting structure of electronic component

Capacitor-wire-embedded wiring board

Module

Electronic component mounting substrate, electronic component mount...

High current surface mount toroid inductor

Rapid implementation of high-temperature analog interface electronics

Self-centering polymeric washer that prevents misalignment when pos...

Capacitor bank assembly

Thin film capacitor and electronic circuit substrate having the same

Patents Applicationslast 30 patents

Thermal Management Enhancement of Electronic Components

MULTILAYER CERAMIC CAPACITOR, PACKAGE, AND CIRCUIT BOARD

MULTILAYER CERAMIC CAPACITOR AND METHOD FOR MANUFACTURING THE SAME

POWER SUPPLY MODULE

INVERTER-INTEGRATED ELECTRIC COMPRESSOR

FLOW ENHANCED DUMMY STRUCTURE TO ENABLE CAPILLARY FLOW BASED SIDEWA...

OPTICAL TRANSCEIVER EQUIPPED WITH GROUND VIA

THIN FILM CAPACITOR AND ELECTRONIC CIRCUIT BOARD HAVING THE SAME

COMPONENT EMBEDDED IN MOLD MATERIAL FOR MITIGATING THICKNESS MISMAT...

MULTILAYER ELECTRONIC COMPONENT

PRINTED CIRCUIT BOARD

POWER SUPPLY UNIT WITH IMPROVED SPACE UTILIZATION AND HEAT DISSIPATION

MULTILAYER CERAMIC ELECTRONIC COMPONENT, PACKAGE BODY, AND CIRCUIT...

SEMICONDUCTOR DEVICE WITH INTEGRATED STACK CAPACITOR AND METHOD OF...

EFFICIENT ASSEMBLY FOR ELECTROLYTIC CAPACITORS ON SOLID STATE DRIVES

CHIP ELECTRONIC COMPONENT

SLOT MEMBER AND POWER ELECTRONIC DEVICE INCLUDING SAME

DELIVERY OF POWER TO A CHIP THROUGH A DAUGHTER BOARD USING CONNECTI...

CAPACITOR EMBEDDED SUBSTRATE

METHODS AND SYSTEMS OF COMPRESSOR CONTROL WITH SURGE AVOIDANCE AND...

PRINTED CIRCUIT BOARD HAVING OPTIONAL CIRCUIT UNIT

SEMICONDUCTOR STORAGE DEVICE

Apparatus and Method for Improving Micro-Inverter Longevity

THIN FILM CAPACITOR AND ELECTRONIC CIRCUIT BOARD HAVING THE SAME

MULTI-CONFIGURABLE ANTENNA TUNER CIRCUIT BOARD

Component Carrier With Embedded Electronic Switch Components and a...

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD TH...

CIRCUIT BOARD SYSTEM

SEMICONDUCTOR PACKAGE

MULTILAYER CERAMIC CAPACITOR AND MULTILAYER CERAMIC CAPACITOR MOUNT...