Non-printed capacitor

Industry

CPC
H05K2201/10015

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10015Non-printed capacitor

Industries

Patents Grantslast 30 patents

Information Patent Grant
Air bag control unit
- Patent number 11,985,771
- Issue date May 14, 2024
- Hyundai Mobis Co., Ltd.
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Power adapter
- Patent number 11,985,765
- Issue date May 14, 2024
- FSP Technology Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor, connection structure, and method for manufacturing capac...
- Patent number 11,972,909
- Issue date Apr 30, 2024
- Murata Manufacturing Co., Ltd.
- Kazutaka Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupled PCB structure to parallel power transistors
- Patent number 11,973,414
- Issue date Apr 30, 2024
- SCHNEIDER ELECTRIC IT CORPORATION
- Indra Prakash
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Capacitor assembly
- Patent number 11,968,784
- Issue date Apr 23, 2024
- PRODRIVE TECHNOLOGIES INNOVATION SERVICES B.V.
- Michel Alexander Hagenaar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 11,963,311
- Issue date Apr 16, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Woong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically functional circuit board core material
- Patent number 11,943,869
- Issue date Mar 26, 2024
- KEMET Electronics Corporation
- Brandon Summey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 11,942,260
- Issue date Mar 26, 2024
- Delta Electronics, Inc.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Firing switch for compact capacitive discharge unit
- Patent number 11,927,431
- Issue date Mar 12, 2024
- Northrop Grumman Systems Corporation
- James D. Lucas
- F42 - AMMUNITION BLASTING
Information Patent Grant
Layered body and electronic component
- Patent number 11,924,968
- Issue date Mar 5, 2024
- Murata Manufacturing Co., Ltd.
- Yutaka Senshu
- B32 - LAYERED PRODUCTS
Information Patent Grant
Structural lead frame
- Patent number 11,923,151
- Issue date Mar 5, 2024
- KEMET Electronics Corporation
- Galen W. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power supply unit for aerosol inhaler
- Patent number 11,916,421
- Issue date Feb 27, 2024
- Japan Tobacco Inc.
- Takeshi Akao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, circuit board arrangement and method of manuf...
- Patent number 11,915,879
- Issue date Feb 27, 2024
- Taiyo Yuden Co., Ltd.
- Anju Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,915,987
- Issue date Feb 27, 2024
- AISIN CORPORATION
- Takanobu Naruse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tombstone prevention for a surface mount device
- Patent number 11,917,761
- Issue date Feb 27, 2024
- Western Digital Technologies, Inc.
- Joyce Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power device assemblies having embedded PCBS and enhanced cooling a...
- Patent number 11,910,521
- Issue date Feb 20, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-density soft-matter electronics
- Patent number 11,903,139
- Issue date Feb 13, 2024
- Carnegie Mellon University
- Carmel Majidi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Circuit board
- Patent number 11,889,616
- Issue date Jan 30, 2024
- Mitsubishi Electric Corporation
- Masatoshi Toyonaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power system
- Patent number 11,881,344
- Issue date Jan 23, 2024
- Delta Electronics, Inc.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Glass core multilayer wiring board and method of producing the same
- Patent number 11,877,394
- Issue date Jan 16, 2024
- TOPPAN INC.
- Susumu Maniwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate, circuit device, and filter circuit substrate
- Patent number 11,870,412
- Issue date Jan 9, 2024
- Murata Manufacturing Co., Ltd.
- Atsushi Toujo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor and board having the same mounted thereon
- Patent number 11,869,718
- Issue date Jan 9, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Gi Sub Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit mother board and detection method thereof
- Patent number 11,871,511
- Issue date Jan 9, 2024
- WUHAN TIANMA MICRO-ELECTRONICS CO., LTD.
- Han Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging unit and endoscope
- Patent number 11,857,166
- Issue date Jan 2, 2024
- Olympus Corporation
- Hiroyuki Motohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Horizontally mounted capacitor module and electronic device includi...
- Patent number 11,856,700
- Issue date Dec 26, 2023
- Samsung Electronics Co., Ltd.
- Chunghyun Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adapter board, method for manufacturing the same and circuit board...
- Patent number 11,856,702
- Issue date Dec 26, 2023
- SHENNAN CIRCUITS CO., LTD.
- Lixiang Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer capacitor and board for mounting the same
- Patent number 11,848,159
- Issue date Dec 19, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Beom Joon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filter module for reducing differential and common mode noise and m...
- Patent number 11,849,537
- Issue date Dec 19, 2023
- Mahle International GmbH
- Juan Francisco Pardo Peris
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor light-emitting device
- Patent number 11,848,315
- Issue date Dec 19, 2023
- Rohm Co., Ltd.
- Kanako Mimori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 11,844,198
- Issue date Dec 12, 2023
- ZF Friedrichshafen AG
- Wei Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Multilayer Capacitor
- Publication number 20240145176
- Publication date May 2, 2024
- KYOCERA AVX Components Corporation
- Marianne Berolini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240147622
- Publication date May 2, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Sang Yoon LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer Capacitor
- Publication number 20240145172
- Publication date May 2, 2024
- KYOCERA AVX Components Corporation
- Marianne Berolini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUPPLY UNIT OF AEROSOL GENERATING DEVICE
- Publication number 20240138488
- Publication date May 2, 2024
- Japan Tobacco Inc.
- Minoru KITAHARA
- A24 - TOBACCO CIGARS CIGARETTES SMOKERS' REQUISITES
Information Patent Application
PRESSURE SENSITIVE BUTTON AND ELECTRONIC DEVICE
- Publication number 20240146303
- Publication date May 2, 2024
- VIVO MOBILE COMMUNICATION CO., LTD.
- Zhenxing SHANG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELECTRONIC MODULE, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURIN...
- Publication number 20240147624
- Publication date May 2, 2024
- Canon Kabushiki Kaisha
- NORITAKE TSUBOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SUBSTRATE
- Publication number 20240138058
- Publication date Apr 25, 2024
- LG Innotek Co., Ltd.
- Heun PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SUPPLY DEVICE HAVING THERMAL INSULATION FUNCTION
- Publication number 20240138049
- Publication date Apr 25, 2024
- ELEMENTS PERFORMANCE TECHNOLOGY INC.
- JERRYSON LEE
- F21 - LIGHTING
Information Patent Application
CIRCUIT MODULE
- Publication number 20240138052
- Publication date Apr 25, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20240130035
- Publication date Apr 18, 2024
- FUJIFILM CORPORATION
- Yota AKASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITOR
- Publication number 20240130046
- Publication date Apr 18, 2024
- Nippon Telegraph and Telephone Corporation
- Teruo Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGE STRUCTURE, POWER SUPPLY APPARATUS, AND ELECTRONIC...
- Publication number 20240121901
- Publication date Apr 11, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Chunyan Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE
- Publication number 20240114623
- Publication date Apr 4, 2024
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND APPARATUS FOR FACILITATING ROBUST AUTOMOTIVE ETHERNET
- Publication number 20240107660
- Publication date Mar 28, 2024
- BLACK SESAME TECHNOLOGIES (CHONGQING) CO., LTD.
- Hai Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROVIDING A LOWER INDUCTANCE PATH IN A ROUTING SUBSTRATE FOR A CAPA...
- Publication number 20240107665
- Publication date Mar 28, 2024
- QUALCOMM Incorporated
- Biancun Xie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERLOCKED CIRCUIT BOARD ELEMENTS AND ASSEMBLIES
- Publication number 20240107669
- Publication date Mar 28, 2024
- Infineon Technologies Austria AG
- Darryl Galipeau
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CIRCUIT AND CONNECTOR ELEMENT ALIGNMENT, CIRCUIT BOARD ASSEMBLIES
- Publication number 20240107674
- Publication date Mar 28, 2024
- Infineon Technologies Austria AG
- Eung San Cho
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
APPARATUS AND POWER MODULE
- Publication number 20240096543
- Publication date Mar 21, 2024
- DELTA ELECTRONICS, INC.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC COMPONENT EMBEDDED SUBSTRATE
- Publication number 20240090135
- Publication date Mar 14, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jae Ho Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING S...
- Publication number 20240090125
- Publication date Mar 14, 2024
- KIOXIA Corporation
- Takashi YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Insulating unit for circuit board
- Publication number 20240090124
- Publication date Mar 14, 2024
- HARTING Electric Stiftung & Co. KG
- Norbert KROPIEWNICKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20240079188
- Publication date Mar 7, 2024
- Murata Manufacturing Co., Ltd.
- Ryuichiro TOMINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTAMINANT SHIELD FOR AN OSCILLATOR
- Publication number 20240080986
- Publication date Mar 7, 2024
- Apple Inc.
- David A. Karol
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MODULE
- Publication number 20240071687
- Publication date Feb 29, 2024
- Murata Manufacturing Co., Ltd.
- Korekiyo ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURGE SUPPRESSION DEVICE
- Publication number 20240072535
- Publication date Feb 29, 2024
- Proterial, Ltd.
- Tsukasa KONDO
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
BLOCK COIL
- Publication number 20240055178
- Publication date Feb 15, 2024
- Murata Manufacturing Co., Ltd.
- Takayuki TANGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20240057258
- Publication date Feb 15, 2024
- TDK Corporation
- Hitoshi SAITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND CONFIGURATION FOR STACKING MULTIPLE PRINTED CIRCUIT BOARDS
- Publication number 20240049393
- Publication date Feb 8, 2024
- MELLANOX TECHNOLOGIES, LTD.
- Xiuzhuang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PHASE POWER CONVERTER
- Publication number 20240039421
- Publication date Feb 1, 2024
- Infineon Technologies Austria AG
- Thorsten MEYER
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR FABRICATING A SEMICONDUCTOR MODULE
- Publication number 20240040689
- Publication date Feb 1, 2024
- INFINEON TECHNOLOGIES AG
- Ramdas Rangnath Ugale
- H01 - BASIC ELECTRIC ELEMENTS

Non-printed capacitor

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Air bag control unit

Power adapter

Capacitor, connection structure, and method for manufacturing capac...

Decoupled PCB structure to parallel power transistors

Capacitor assembly

Printed circuit board and method of manufacturing the same

Electrically functional circuit board core material

Power module

Firing switch for compact capacitive discharge unit

Layered body and electronic component

Structural lead frame

Power supply unit for aerosol inhaler

Electronic component, circuit board arrangement and method of manuf...

Semiconductor device

Tombstone prevention for a surface mount device

Power device assemblies having embedded PCBS and enhanced cooling a...

High-density soft-matter electronics

Circuit board

Power system

Glass core multilayer wiring board and method of producing the same

Multilayer substrate, circuit device, and filter circuit substrate

Multilayer capacitor and board having the same mounted thereon

Flexible circuit mother board and detection method thereof

Imaging unit and endoscope

Horizontally mounted capacitor module and electronic device includi...

Adapter board, method for manufacturing the same and circuit board...

Multilayer capacitor and board for mounting the same

Filter module for reducing differential and common mode noise and m...

Semiconductor light-emitting device

Power module

Patents Applicationslast 30 patents

Multilayer Capacitor

PRINTED CIRCUIT BOARD

Multilayer Capacitor

POWER SUPPLY UNIT OF AEROSOL GENERATING DEVICE

PRESSURE SENSITIVE BUTTON AND ELECTRONIC DEVICE

ELECTRONIC MODULE, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURIN...

ELECTRONIC SUBSTRATE

POWER SUPPLY DEVICE HAVING THERMAL INSULATION FUNCTION

CIRCUIT MODULE

ELECTRONIC APPARATUS

CAPACITOR

EMBEDDED PACKAGE STRUCTURE, POWER SUPPLY APPARATUS, AND ELECTRONIC...

HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE

SYSTEM AND APPARATUS FOR FACILITATING ROBUST AUTOMOTIVE ETHERNET

PROVIDING A LOWER INDUCTANCE PATH IN A ROUTING SUBSTRATE FOR A CAPA...

INTERLOCKED CIRCUIT BOARD ELEMENTS AND ASSEMBLIES

CIRCUIT AND CONNECTOR ELEMENT ALIGNMENT, CIRCUIT BOARD ASSEMBLIES

APPARATUS AND POWER MODULE

ELECTRONIC COMPONENT EMBEDDED SUBSTRATE

CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING S...

Insulating unit for circuit board

ELECTRONIC COMPONENT

CONTAMINANT SHIELD FOR AN OSCILLATOR

SEMICONDUCTOR DEVICE AND MODULE

SURGE SUPPRESSION DEVICE

BLOCK COIL

CIRCUIT BOARD

METHOD AND CONFIGURATION FOR STACKING MULTIPLE PRINTED CIRCUIT BOARDS

MULTI-PHASE POWER CONVERTER

SEMICONDUCTOR MODULE AND METHOD FOR FABRICATING A SEMICONDUCTOR MODULE