not being an ohmic electrical conductor

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H01L2924/07802

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/07802not being an ohmic electrical conductor

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Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method and electronic module with new routing possibi...
- Patent number RE49970
- Issue date May 14, 2024
- IMBERATEK, LLC
- Antti Kivikero
Information Patent Grant
Method of forming a packaged semiconductor device having enhanced w...
- Patent number 11,862,539
- Issue date Jan 2, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with sealed semiconductor chip
- Patent number 11,854,946
- Issue date Dec 26, 2023
- Kioxia Corporation
- Isao Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of room temperature covalent bonding
- Patent number 11,760,059
- Issue date Sep 19, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing an electronic module and electronic module
- Patent number 11,716,816
- Issue date Aug 1, 2023
- IMBERATEK, LLC
- Antti Iihola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device having a semiconduc...
- Patent number 11,688,659
- Issue date Jun 27, 2023
- Kioxia Corporation
- Yoshiaki Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stretchable form of single crystal silicon for high performance ele...
- Patent number 11,456,258
- Issue date Sep 27, 2022
- The Board of Trustees of the University of Illinois
- John A. Rogers
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of making flexible semiconductor device with graphene tape
- Patent number 11,456,188
- Issue date Sep 27, 2022
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with sealed semiconductor chip
- Patent number 11,424,176
- Issue date Aug 23, 2022
- Kioxia Corporation
- Isao Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a packaged semiconductor device having enhanced w...
- Patent number 11,410,916
- Issue date Aug 9, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,134,572
- Issue date Sep 28, 2021
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device
- Patent number 11,038,084
- Issue date Jun 15, 2021
- Nichia Corporation
- Toru Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical device
- Patent number 10,896,996
- Issue date Jan 19, 2021
- Rohm Co., Ltd.
- Tomoichiro Toyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with sealed semiconductor chip
- Patent number 10,872,844
- Issue date Dec 22, 2020
- TOSHIBA MEMORY CORPORATION
- Isao Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic electrically conductive film, method for producing same...
- Patent number 10,832,830
- Issue date Nov 10, 2020
- Dexerials Corporation
- Tomoyuki Ishimatsu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of forming a packaged semiconductor device having enhanced w...
- Patent number 10,825,755
- Issue date Nov 3, 2020
- Amkor Technology Singapore Holding Pte Ltd.
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 10,777,479
- Issue date Sep 15, 2020
- TOSHIBA MEMORY CORPORATION
- Yoshiaki Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curable heat radiation composition
- Patent number 10,717,896
- Issue date Jul 21, 2020
- Showa Denko K.K.
- Yoichiro Sakaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible semiconductor device with graphene tape
- Patent number 10,692,802
- Issue date Jun 23, 2020
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array and land grid array assemblies fabricated using tem...
- Patent number 10,679,931
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor packages
- Patent number 10,593,652
- Issue date Mar 17, 2020
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic electrically conductive film, method for producing same...
- Patent number 10,566,108
- Issue date Feb 18, 2020
- Dexerials Corporation
- Tomoyuki Ishimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a packaged semiconductor device having enhanced w...
- Patent number 10,529,655
- Issue date Jan 7, 2020
- Amkor Technology, Inc.
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a wafer level package
- Patent number 10,522,447
- Issue date Dec 31, 2019
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device connected by anisotropic conductive film
- Patent number 10,504,866
- Issue date Dec 10, 2019
- Kudko Chemical Co., Ltd.
- Young Woo Park
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Methods, circuits and systems for a package structure having wirele...
- Patent number 10,497,655
- Issue date Dec 3, 2019
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip modules and methods of fabrication
- Patent number 10,490,520
- Issue date Nov 26, 2019
- Invensas Corporation
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus for stacking semiconductor chips in a semiconductor package
- Patent number 10,483,150
- Issue date Nov 19, 2019
- Samsung Electronics Co., Ltd.
- Gun-Ah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip silicon substrate-less chip packaging
- Patent number 10,468,351
- Issue date Nov 5, 2019
- Xilinx, Inc.
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...
- Publication number 20240203839
- Publication date Jun 20, 2024
- Amkor Technology Singapore Holding Pte. Ltd
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIDE BANDGAP SEMICONDUCTOR DEVICE
- Publication number 20230335633
- Publication date Oct 19, 2023
- Rohm Co., Ltd.
- Yuki NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...
- Publication number 20230026949
- Publication date Jan 26, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
- Publication number 20220352053
- Publication date Nov 3, 2022
- KIOXIA Corporation
- Isao OZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
- Publication number 20220044987
- Publication date Feb 10, 2022
- Toshiba Memory Corporation
- Isao OZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
- Publication number 20210074609
- Publication date Mar 11, 2021
- Toshiba Memory Corporation
- Isao OZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...
- Publication number 20210050284
- Publication date Feb 18, 2021
- Amkor Technology Singapore Holding Pte. Ltd
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM, METHOD FOR PRODUCING SAME...
- Publication number 20200152352
- Publication date May 14, 2020
- DEXERIALS CORPORATION
- Tomoyuki ISHIMATSU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...
- Publication number 20200144164
- Publication date May 7, 2020
- Amkor Technology, Inc.
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Multi-Chip Semiconductor Power Device
- Publication number 20200083207
- Publication date Mar 12, 2020
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTNG DEVICE
- Publication number 20200044115
- Publication date Feb 6, 2020
- Nichia Corporation.
- Toru HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stretchable Form of Single Crystal Silicon for High Performance Ele...
- Publication number 20200013720
- Publication date Jan 9, 2020
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- John A. ROGERS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Die Attach Methods and Semiconductor Devices Manufactured based on...
- Publication number 20190348347
- Publication date Nov 14, 2019
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ROOM TEMPERATURE COVALENT BONDING
- Publication number 20190344534
- Publication date Nov 14, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF ROOM TEMPERATURE COVALENT BONDING
- Publication number 20190344533
- Publication date Nov 14, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
- Publication number 20190295928
- Publication date Sep 26, 2019
- Toshiba Memory Corporation
- Isao OZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A DEVICE AND LEAD FRAME USED FOR TH...
- Publication number 20190139849
- Publication date May 9, 2019
- Toshiba Memory Corporation
- Yoshiaki GOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20190115247
- Publication date Apr 18, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTICHIP MODULES AND METHODS OF FABRICATION
- Publication number 20190088607
- Publication date Mar 21, 2019
- Invensas Corporation
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LIGHT EMITTING APPARATUS
- Publication number 20190027667
- Publication date Jan 24, 2019
- Nichia Corporation.
- Ryohei YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic module with EMI protection
- Publication number 20180352689
- Publication date Dec 6, 2018
- GE EMBEDDED ELECTRONICS OY
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGES, METHODS OF FABRICATING THE SAME, AN...
- Publication number 20180331071
- Publication date Nov 15, 2018
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3-D STACKING OF ACTIVE DEVICES OVER PASSIVE DEVICES
- Publication number 20180242455
- Publication date Aug 23, 2018
- SKYWORKS SOLUTIONS, INC.
- Mark A. KUHLMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING ANISOTROPIC CONDU...
- Publication number 20180218994
- Publication date Aug 2, 2018
- DEXERIALS CORPORATION
- Kouichi SATO
- B32 - LAYERED PRODUCTS
Information Patent Application
CHIP PACKAGE AND A WAFER LEVEL PACKAGE
- Publication number 20180158759
- Publication date Jun 7, 2018
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUORO-SILICONE COMPOSITIONS AS TEMPORARY BONDING ADHESIVES
- Publication number 20180090362
- Publication date Mar 29, 2018
- Dow Corning Corporation
- Peng-Fei FU
- B32 - LAYERED PRODUCTS
Information Patent Application
Matching Inclination of Cavity Sidewall and Medium Supply Device fo...
- Publication number 20180063965
- Publication date Mar 1, 2018
- AT & S Austria Technologie & Systemtechnik Aktieng
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM, METHOD FOR PRODUCING SAME...
- Publication number 20170323701
- Publication date Nov 9, 2017
- DEXERIALS CORPORATION
- Tomoyuki ISHIMATSU
- B32 - LAYERED PRODUCTS
Information Patent Application
Multichip modules and methods of fabrication
- Publication number 20170236794
- Publication date Aug 17, 2017
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnection Structure, LED Module and Method
- Publication number 20170092631
- Publication date Mar 30, 2017
- Infineon Technologies Austria AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS

not being an ohmic electrical conductor

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method and electronic module with new routing possibi...

Method of forming a packaged semiconductor device having enhanced w...

Semiconductor device with sealed semiconductor chip

Circuit board structure and method for manufacturing a circuit boar...

Method of room temperature covalent bonding

Method for manufacturing an electronic module and electronic module

Method for manufacturing a semiconductor device having a semiconduc...

Stretchable form of single crystal silicon for high performance ele...

Method of making flexible semiconductor device with graphene tape

Semiconductor device with sealed semiconductor chip

Method of forming a packaged semiconductor device having enhanced w...

Circuit board structure and method for manufacturing a circuit boar...

Light-emitting device

Optical device

Semiconductor device with sealed semiconductor chip

Anisotropic electrically conductive film, method for producing same...

Method of forming a packaged semiconductor device having enhanced w...

Semiconductor memory device

Curable heat radiation composition

Flexible semiconductor device with graphene tape

Ball grid array and land grid array assemblies fabricated using tem...

Stacked semiconductor packages

Anisotropic electrically conductive film, method for producing same...

Method of forming a packaged semiconductor device having enhanced w...

Chip package and a wafer level package

Semiconductor device connected by anisotropic conductive film

Methods, circuits and systems for a package structure having wirele...

Multichip modules and methods of fabrication

Apparatus for stacking semiconductor chips in a semiconductor package

Multi-chip silicon substrate-less chip packaging

Patents Applicationslast 30 patents

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...

WIDE BANDGAP SEMICONDUCTOR DEVICE

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...

SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP

SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP

SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...

ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM, METHOD FOR PRODUCING SAME...

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...

Method of Manufacturing a Multi-Chip Semiconductor Power Device

LIGHT-EMITTNG DEVICE

Stretchable Form of Single Crystal Silicon for High Performance Ele...

Die Attach Methods and Semiconductor Devices Manufactured based on...

METHOD OF ROOM TEMPERATURE COVALENT BONDING

METHOD OF ROOM TEMPERATURE COVALENT BONDING

SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP

SEMICONDUCTOR PACKAGE INCLUDING A DEVICE AND LEAD FRAME USED FOR TH...

ROOM TEMPERATURE METAL DIRECT BONDING

MULTICHIP MODULES AND METHODS OF FABRICATION

LIGHT EMITTING APPARATUS

Electronic module with EMI protection

STACKED SEMICONDUCTOR PACKAGES, METHODS OF FABRICATING THE SAME, AN...

3-D STACKING OF ACTIVE DEVICES OVER PASSIVE DEVICES

ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING ANISOTROPIC CONDU...

CHIP PACKAGE AND A WAFER LEVEL PACKAGE

FLUORO-SILICONE COMPOSITIONS AS TEMPORARY BONDING ADHESIVES

Matching Inclination of Cavity Sidewall and Medium Supply Device fo...

ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM, METHOD FOR PRODUCING SAME...

Multichip modules and methods of fabrication

Interconnection Structure, LED Module and Method