Obliquely mounted

Industry

CPC
H05K2201/10484

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10484Obliquely mounted

Industries

Patents Grantslast 30 patents

Information Patent Grant
Spacer for surface mountable electronic components
- Patent number 10,952,324
- Issue date Mar 16, 2021
- Facebook Technologies, LLC
- Raymond Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus and method for manufacturing the same
- Patent number 10,820,417
- Issue date Oct 27, 2020
- Samsung Display Co., Ltd.
- Jinhyuk Park
- G02 - OPTICS
Information Patent Grant
Pad and printed board
- Patent number 10,791,627
- Issue date Sep 29, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Daiki Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High density multi-component packages
- Patent number 10,757,810
- Issue date Aug 25, 2020
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density multi-component packages
- Patent number 10,681,814
- Issue date Jun 9, 2020
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED light apparatus
- Patent number 10,598,343
- Issue date Mar 24, 2020
- XIAMEN ECO LIGHTING CO. LTD.
- Ping Yan
- F21 - LIGHTING
Information Patent Grant
Method of mounting electronic part, circuit substrate, and image fo...
- Patent number 10,492,304
- Issue date Nov 26, 2019
- Canon Kabushiki Kaisha
- Masayuki Sakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aircraft LED light unit
- Patent number 10,273,022
- Issue date Apr 30, 2019
- Goodrich Lighting Systems GmbH
- Anil Kumar Jha
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Grant
Mounting substrate, manufacturing method for the same, and componen...
- Patent number 9,814,139
- Issue date Nov 7, 2017
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Toshihiko Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting electronic part, circuit substrate, and image fo...
- Patent number 9,599,944
- Issue date Mar 21, 2017
- Canon Kabushiki Kaisha
- Masayuki Sakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Assembly, method of assembling, and tile for use in assembly
- Patent number 9,480,151
- Issue date Oct 25, 2016
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijkonderzoek TNO
- Margaretha Maria De Kok
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Tile, assembly of tiles with a carrier, method of manufacturing an...
- Patent number 9,402,306
- Issue date Jul 26, 2016
- Nederlandse Organisatie Voor Toegepast-Natuurewetenschappelijk Onderzoek Tno
- Jeroen Van Den Brand
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid-integrated photonic chip package with an interposer
- Patent number 9,297,971
- Issue date Mar 29, 2016
- Oracle International Corporation
- Hiren D. Thacker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid-integrated photonic chip package with an interposer
- Patent number 9,250,403
- Issue date Feb 2, 2016
- Oracle International Corporation
- Hiren D. Thacker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Assembly, component for an assembly and method of manufacturing an...
- Patent number 9,078,361
- Issue date Jul 7, 2015
- Nederlandse Organisatie voor Toegepast-Natuurwetenschappelijk Onderzoek TNO
- Gerardus Titus Van Heck
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 9,029,713
- Issue date May 12, 2015
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting board including a flat-type electrical element and capable...
- Patent number 8,618,423
- Issue date Dec 31, 2013
- SANYO Electric Co., Ltd.
- Hirotoshi Ozaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 8,431,829
- Issue date Apr 30, 2013
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED directional illumination energy-saving luminaire and manufactur...
- Patent number 8,425,083
- Issue date Apr 23, 2013
- Zhiyong Liu
- F21 - LIGHTING
Information Patent Grant
Liquid ejecting head, liquid ejecting apparatus, and actuator device
- Patent number 8,398,214
- Issue date Mar 19, 2013
- Seiko Epson Corporation
- Katsuhiro Okubo
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Printed wiring board having a substrate with higher conductor densi...
- Patent number 8,177,577
- Issue date May 15, 2012
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method of mounting electronic component on printe...
- Patent number 8,159,827
- Issue date Apr 17, 2012
- Mitsubishi Electric Company
- Hitoshi Kidokoro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Junction structure of substrate and joining method thereof
- Patent number 8,134,839
- Issue date Mar 13, 2012
- Panasonic Corporation
- Masahiro Yamazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Base element, base system and method for manufacturing another base...
- Patent number 8,116,098
- Issue date Feb 14, 2012
- Robert Bosch GmbH
- Michael Hortig
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Providing additional space between an integrated circuit and a circ...
- Patent number 8,080,874
- Issue date Dec 20, 2011
- Google Inc.
- Jeremy Werner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component adapted for being mounted on a substrate and a method of...
- Patent number 8,045,334
- Issue date Oct 25, 2011
- Koninklijke Philips Electronics N.V.
- Maurice Alexander Hugo Donners
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Indicator display assembly for a vehicle rearview mirror
- Patent number 8,033,698
- Issue date Oct 11, 2011
- Lang Mekra North America LLC
- Joseph Ivan Rodolph Boivin
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Printed circuit assembly
- Patent number 7,972,143
- Issue date Jul 5, 2011
- Tyco Electronics Corporation
- Dalibor Smejtek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module with two cooling surfaces and method
- Patent number 7,919,854
- Issue date Apr 5, 2011
- Infineon Technologies AG
- Thilo Stolze
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting assembly and method for assembling the same
- Patent number 7,897,883
- Issue date Mar 1, 2011
- TYC Brother Industrial Co., Ltd
- Yueh-Hsun Yang
- F21 - LIGHTING

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT SUB-MOUNT AND ELECTRONIC DEVICE USING THE SAME
- Publication number 20230128068
- Publication date Apr 27, 2023
- Lextar Electronics Corporation
- Ming-Jing LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210195751
- Publication date Jun 24, 2021
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Mathijs Rien DE SCHIPPER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LED LIGHT APPARATUS
- Publication number 20200056761
- Publication date Feb 20, 2020
- XIAMEN ECO LIGHTING CO. LTD.
- Ping Yan
- F21 - LIGHTING
Information Patent Application
METHOD OF MOUNTING ELECTRONIC PART, CIRCUIT SUBSTRATE, AND IMAGE FO...
- Publication number 20140319200
- Publication date Oct 30, 2014
- Canon Kabushiki Kaisha
- Masayuki Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID-INTEGRATED PHOTONIC CHIP PACKAGE WITH AN INTERPOSER
- Publication number 20140321803
- Publication date Oct 30, 2014
- Oracle International Corporation
- Hiren D. Thacker
- G02 - OPTICS
Information Patent Application
HYBRID-INTEGRATED PHOTONIC CHIP PACKAGE WITH AN INTERPOSER
- Publication number 20140321804
- Publication date Oct 30, 2014
- Oracle International Corporation
- Hiren D. Thacker
- G02 - OPTICS
Information Patent Application
WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...
- Publication number 20140116767
- Publication date May 1, 2014
- IBIDEN CO., LTD.
- Kenji SATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130213694
- Publication date Aug 22, 2013
- IBIDEN CO., LTD.
- Michimasa Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY, COMPONENT FOR AN ASSEMBLY AND METHOD OF MANUFACTURING AN...
- Publication number 20130200783
- Publication date Aug 8, 2013
- Nederlandse Organisatie voor toegepast-natuurweten schappelijk Onderzoek TNO
- Gerardus Titus Van Heck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TILE, ASSEMBLY OF TILES WITH A CARRIER, METHOD OF MANUFACTURING AN...
- Publication number 20130201636
- Publication date Aug 8, 2013
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEKTNO
- Jeroen Van Den Brand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY, METHOD OF ASSEMBLING, AND TILE FOR USE IN ASSEMBLY
- Publication number 20130201637
- Publication date Aug 8, 2013
- Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO
- Margaretha Maria De Kok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BASE ELEMENT, BASE SYSTEM AND METHOD FOR MANUFACTURING ANOTHER BASE...
- Publication number 20120174376
- Publication date Jul 12, 2012
- Michael HORTIG
- G01 - MEASURING TESTING
Information Patent Application
CONNECTION MEMBER, ELECTRIC SUBSTRATE, OPTICAL SCANNING DEVICE, AND...
- Publication number 20110206415
- Publication date Aug 25, 2011
- Keiichi SATOU
- G02 - OPTICS
Information Patent Application
CIRCUIT BOARD AND METHOD OF MOUNTING ELECTRONIC COMPONENT ON PRINTE...
- Publication number 20100315794
- Publication date Dec 16, 2010
- MITSUBISHI ELECTRIC CORPORATION
- Hitoshi Kidokoro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LED DIRECTIONAL ILLUMINATION ENERGY-SAVING LUMINAIRE AND MANUFACTUR...
- Publication number 20100302780
- Publication date Dec 2, 2010
- Zhiyong Liu
- F21 - LIGHTING
Information Patent Application
METHOD OF SOLDERING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT
- Publication number 20100230152
- Publication date Sep 16, 2010
- FUJITSU LIMITED
- Takahiro KITAGAWA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PRINTED CIRCUIT ASSEMBLY
- Publication number 20100197150
- Publication date Aug 5, 2010
- Dalibor Smejtek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MODULE WITH TWO COOLING SURFACES AND METHOD
- Publication number 20100038758
- Publication date Feb 18, 2010
- INFINEON TECHNOLOGIES AG
- Thilo Stolze
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE
- Publication number 20100032198
- Publication date Feb 11, 2010
- Hirobumi Inoue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
JUNCTION STRUCTURE OF SUBSTRATE AND JOINING METHOD THEREOF
- Publication number 20100021756
- Publication date Jan 28, 2010
- PANASONIC CORPORATION
- Masahiro YAMAZAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board and method for manufacturing the same
- Publication number 20090290318
- Publication date Nov 26, 2009
- IBIDEN CO., LTD.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board and method for manufacturing the same
- Publication number 20090283312
- Publication date Nov 19, 2009
- IBIDEN CO., LTD.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, AND ACTUATOR DEVICE
- Publication number 20090213189
- Publication date Aug 27, 2009
- SEIKO EPSON CORPORATION
- Katsuhiro OKUBO
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Indicator display assembly for a vehicle rearview mirror
- Publication number 20090201690
- Publication date Aug 13, 2009
- Joseph Ivan Rodolph Boivin
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20090190320
- Publication date Jul 30, 2009
- RENESAS TECHNOLOGY CORP.
- ICHIO SHIMIZU
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD OF CONNECTING A SERIES OF INTEGRATED DEVICES UTILIZING FLEXI...
- Publication number 20090183364
- Publication date Jul 23, 2009
- International Business Machines Corporation
- Gerald K. Bartley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING ASSEMBLY AND METHOD FOR ASSEMBLING THE SAME
- Publication number 20090141468
- Publication date Jun 4, 2009
- T.Y.C. BROTHER INDUSTRIAL CO., LTD.
- Yueh-Hsun Yang
- F21 - LIGHTING
Information Patent Application
LIGHT SOURCE DEVICE
- Publication number 20090135599
- Publication date May 28, 2009
- Industrial Technology Research Institute
- Jian-Shian Lin
- F21 - LIGHTING
Information Patent Application
BASE ELEMENT, BASE SYSTEM AND METHOD FOR MANUFACTURING ANOTHER BASE...
- Publication number 20090122503
- Publication date May 14, 2009
- Michael HORTIG
- G01 - MEASURING TESTING
Information Patent Application
SYSTEMS AND METHODS FOR A TILTED OPTICAL RECEIVER ASSEMBLY
- Publication number 20090065678
- Publication date Mar 12, 2009
- Mark Vandermeulen
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Obliquely mounted

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Spacer for surface mountable electronic components

Display apparatus and method for manufacturing the same

Pad and printed board

High density multi-component packages

High density multi-component packages

LED light apparatus

Method of mounting electronic part, circuit substrate, and image fo...

Aircraft LED light unit

Mounting substrate, manufacturing method for the same, and componen...

Method of mounting electronic part, circuit substrate, and image fo...

Assembly, method of assembling, and tile for use in assembly

Tile, assembly of tiles with a carrier, method of manufacturing an...

Hybrid-integrated photonic chip package with an interposer

Hybrid-integrated photonic chip package with an interposer

Assembly, component for an assembly and method of manufacturing an...

Printed wiring board and method for manufacturing the same

Mounting board including a flat-type electrical element and capable...

Printed wiring board and method for manufacturing the same

LED directional illumination energy-saving luminaire and manufactur...

Liquid ejecting head, liquid ejecting apparatus, and actuator device

Printed wiring board having a substrate with higher conductor densi...

Circuit board and method of mounting electronic component on printe...

Junction structure of substrate and joining method thereof

Base element, base system and method for manufacturing another base...

Providing additional space between an integrated circuit and a circ...

Component adapted for being mounted on a substrate and a method of...

Indicator display assembly for a vehicle rearview mirror

Printed circuit assembly

Semiconductor module with two cooling surfaces and method

Light emitting assembly and method for assembling the same

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT SUB-MOUNT AND ELECTRONIC DEVICE USING THE SAME

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

LED LIGHT APPARATUS

METHOD OF MOUNTING ELECTRONIC PART, CIRCUIT SUBSTRATE, AND IMAGE FO...

HYBRID-INTEGRATED PHOTONIC CHIP PACKAGE WITH AN INTERPOSER

HYBRID-INTEGRATED PHOTONIC CHIP PACKAGE WITH AN INTERPOSER

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

ASSEMBLY, COMPONENT FOR AN ASSEMBLY AND METHOD OF MANUFACTURING AN...

TILE, ASSEMBLY OF TILES WITH A CARRIER, METHOD OF MANUFACTURING AN...

ASSEMBLY, METHOD OF ASSEMBLING, AND TILE FOR USE IN ASSEMBLY

BASE ELEMENT, BASE SYSTEM AND METHOD FOR MANUFACTURING ANOTHER BASE...

CONNECTION MEMBER, ELECTRIC SUBSTRATE, OPTICAL SCANNING DEVICE, AND...

CIRCUIT BOARD AND METHOD OF MOUNTING ELECTRONIC COMPONENT ON PRINTE...

LED DIRECTIONAL ILLUMINATION ENERGY-SAVING LUMINAIRE AND MANUFACTUR...

METHOD OF SOLDERING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT

PRINTED CIRCUIT ASSEMBLY

SEMICONDUCTOR MODULE WITH TWO COOLING SURFACES AND METHOD

CIRCUIT MODULE

JUNCTION STRUCTURE OF SUBSTRATE AND JOINING METHOD THEREOF

Printed wiring board and method for manufacturing the same

Printed wiring board and method for manufacturing the same

LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, AND ACTUATOR DEVICE

Indicator display assembly for a vehicle rearview mirror

SEMICONDUCTOR DEVICE

METHOD OF CONNECTING A SERIES OF INTEGRATED DEVICES UTILIZING FLEXI...

LIGHT EMITTING ASSEMBLY AND METHOD FOR ASSEMBLING THE SAME

LIGHT SOURCE DEVICE

BASE ELEMENT, BASE SYSTEM AND METHOD FOR MANUFACTURING ANOTHER BASE...

SYSTEMS AND METHODS FOR A TILTED OPTICAL RECEIVER ASSEMBLY