of a plurality of bump connectors

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/14of a plurality of bump connectors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Semiconductor package for improving power integrity characteristics
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Fine pitch copper pillar package and method
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Information Patent Grant
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Information Patent Grant
Low cost package warpage solution
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Electronic package with varying interconnects
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Method for manufacturing display panel, display panel, and display...
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Metal-free frame design for silicon bridges for semiconductor packages
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Display device including anisotropic conductive film (ACF)
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Bump coplanarity for semiconductor device assembly and methods of m...
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Information Patent Grant
Semiconductor device assembly with die support structures
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Information Patent Grant
Forming large chips through stitching
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Information Patent Grant
Guard ring design enabling in-line testing of silicon bridges for s...
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- Issue date Nov 12, 2024
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- Arnab Sarkar
- H01 - BASIC ELECTRIC ELEMENTS

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DIRECT DIE-TWO-DIE CONNECTION THROUGH AN INTERPOSER WITHOUT VIAS
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IN-CAVITY EPOXY PLACEMENT FOR PACKAGE RELIABILITY
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SEMICONDUCTOR PACKAGE
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GLASS CORES INCLUDING PROTRUDING THROUGH GLASS VIAS AND RELATED MET...
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- Mari SAJI
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SEMICONDUCTOR PACKAGE
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- Chaein Moon
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- H01 - BASIC ELECTRIC ELEMENTS
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- TEXAS INSTRUMENTS INCORPORATED
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- Publication number 20250079354
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- STATS ChipPAC Pte Ltd.
- KyuWon Lee
- H01 - BASIC ELECTRIC ELEMENTS
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- Publication number 20250079376
- Publication date Mar 6, 2025
- Micron Technology, Inc.
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- H01 - BASIC ELECTRIC ELEMENTS
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- Hengrong SHI
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- Kei MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250070063
- Publication date Feb 27, 2025
- NUVOTON TECHNOLOGY CORPORATION JAPAN
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- H01 - BASIC ELECTRIC ELEMENTS
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- Microsoft Technology Licensing, LLC
- Rahul AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS

of a plurality of bump connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

IC device with chip to package interconnects from a copper metal in...

Semiconductor light emitting element and semiconductor light emitti...

Semiconductor package including heat dissipation layer

Integrated structure with bifunctional routing and assembly compris...

Semiconductor device and method

Alternative surfaces for conductive pad layers of silicon bridges f...

Semiconductor package including adhesive layer and method for manuf...

Multi-chip package with high density interconnects

Semiconductor die connection system and method

Semiconductor package and method of manufacturing semiconductor pac...

Barrier structures between external electrical connectors

Camera module, and photosensitive assembly and manufacturing method...

Semiconductor package for improving power integrity characteristics

Scalable embedded silicon bridge via pillars in lithographically de...

Fine pitch copper pillar package and method

Semiconductor structure comprising up-narrow and down-wide openings...

Semiconductor package having a high reliability

Semiconductor device with enhanced thermal dissipation and method f...

Low cost package warpage solution

Electronic package with varying interconnects

Method for manufacturing display panel, display panel, and display...

Metal-free frame design for silicon bridges for semiconductor packages

Display device including anisotropic conductive film (ACF)

RF devices with enhanced performance and methods of forming the same

Semiconductor package and manufacturing method of semiconductor pac...

Semiconductor device including semiconductor chip having elongated...

Bump coplanarity for semiconductor device assembly and methods of m...

Semiconductor device assembly with die support structures

Forming large chips through stitching

Guard ring design enabling in-line testing of silicon bridges for s...

Patents Applicationslast 30 patents

SELF-DIFFUSING LIQUID METAL INTERCONNECT ARCHITECTURES ENABLING SNA...

DIRECT DIE-TWO-DIE CONNECTION THROUGH AN INTERPOSER WITHOUT VIAS

IN-CAVITY EPOXY PLACEMENT FOR PACKAGE RELIABILITY

MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES

INTERLEAVED POWER DELIVERY TO 3D DIE COMPLEXES ABOVE BRIDGE CHIPLET...

CONTROLLING SUBSTRATE BUMP HEIGHT

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

GLASS CORES INCLUDING PROTRUDING THROUGH GLASS VIAS AND RELATED MET...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

INTEGRATED CIRCUITS INCLUDING STACKED THIN FILM INDUCTORS AND METHO...

SEMICONDUCTOR PACKAGE INCLUDING RESIN, AND ELECTRONIC DEVICE INCLUD...

SEMICONDUCTOR DEVICE

SCALABLE EMBEDDED SILICON BRIDGE VIA PILLARS IN LITHOGRAPHICALLY DE...

LOW COST PACKAGE WARPAGE SOLUTION

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

DOUBLE-SIDE-COOLING POWER MODULE

BUMP COPLANARITY FOR SEMICONDUCTOR DEVICE ASSEMBLY AND METHODS OF M...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

PACKAGE STRUCTURES FOR EFFICIENT HEAT DISSIPATION

LEADING POINT OF DISCHARGE STRUCTURES FOR ELECTROSTATIC DISCHARGE P...

Semiconductor Device and Method of Forming Dummy SOP Within Saw Street

SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES

PACKAGE STRUCTURE AND SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

ENABLING MICRO-BUMP ARCHITECTURES WITHOUT THE USE OF SACRIFICIAL PA...