of a plurality of bump connectors

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/14of a plurality of bump connectors

Industries

Patents Grantslast 30 patents

Information Patent Grant
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- Issue date Dec 17, 2024
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
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- Issue date Dec 10, 2024
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- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
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- H01 - BASIC ELECTRIC ELEMENTS
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Information Patent Grant
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Information Patent Grant
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- Henning Braunisch
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Information Patent Grant
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- Issue date Oct 8, 2024
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Information Patent Grant
Stress reduction apparatus and method
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- Yao-Chun Chuang
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Information Patent Grant
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
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Information Patent Grant
Joint structure in semiconductor package and manufacturing method t...
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an integrated fan-out package having fan-ou...
- Patent number 12,080,615
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- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit component with conductive terminals of different...
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- Issue date Aug 27, 2024
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- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
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- Issue date Aug 27, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

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LOCALIZED HIGH DENSITY SUBSTRATE ROUTING
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- Seunghun Shin
- H01 - BASIC ELECTRIC ELEMENTS

of a plurality of bump connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Metal-free frame design for silicon bridges for semiconductor packages

Display device including anisotropic conductive film (ACF)

RF devices with enhanced performance and methods of forming the same

Semiconductor package and manufacturing method of semiconductor pac...

Semiconductor device including semiconductor chip having elongated...

Bump coplanarity for semiconductor device assembly and methods of m...

Semiconductor device assembly with die support structures

Forming large chips through stitching

Guard ring design enabling in-line testing of silicon bridges for s...

Pillars as stops for precise chip-to-chip separation

Integrated fan-out package and the methods of manufacturing

Semiconductor devices and preparation methods thereof

Method for forming semiconductor package and semiconductor package

Semiconductor package including test bumps

Semiconductor bonding structures and methods

Semiconductor package

Semiconductor package and method of fabricating the same

Multi-chip package and method of providing die-to-die interconnects...

Semiconductor package and manufacturing method thereof

Stress reduction apparatus and method

Localized high density substrate routing

Multi-pin-wafer-level-chip-scale-packaging solution for high power...

Interconnection between chips by bridge chip

High density interconnect device and method

Semiconductor device assembly with surface-mount die support struct...

Bump structure having a side recess and semiconductor structure inc...

Joint structure in semiconductor package and manufacturing method t...

Method of manufacturing an integrated fan-out package having fan-ou...

Integrated circuit component with conductive terminals of different...

Metal-free frame design for silicon bridges for semiconductor packages

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGE WITH ELECTRO-OPTICAL INTERCONNECT CIRCUITRY

HIGH DENSITY INTERCONNECT DEVICE AND METHOD

LOCALIZED HIGH DENSITY SUBSTRATE ROUTING

OPTOELECTRONIC PACKAGE STRUCTURE

SYSTEM-IN PACKAGE COMPONENT, ELECTRONIC DEVICE, AND SYSTEM-IN PACKA...

SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER

SEMICONDUCTOR PACKAGE

METHOD OF FORMING PACKAGE STRUCTURE

ELECTRONIC PACKAGE AND A PACKAGING METHOD

INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING AN INTEGRATED FAN-OUT PACKAGE HAVING FAN-OU...

THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...

JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD T...

PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACT...

PACKAGE STRUCTURE WITH BRIDGE DIE AND METHOD OF FORMING THE SAME

METHODS AND APPARATUS TO MITIGATE ELECTROMIGRATION IN INTEGRATED CI...

SEMICONDUCTOR DEVICE, INTEGRATED CIRCUIT DEVICE, AND METHOD

SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...

BALL MAP PATTERN

MICROELECTRONIC ASSEMBLIES WITH DIRECT BONDING USING NANOTWINNED CO...

OPTICAL SENSOR PACKAGE WITH LIGHT SHIELDING MATERIAL

SEMICONDUCTOR PACKAGE

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

DISPLAY DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE

PACKAGING METHOD AND PACKAGING STRUCTURE OF MULTI-LAYER STACKED HIG...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

CHIP AND METHOD FOR FORMING THE SAME, AND PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE