of a plurality of bump connectors

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

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H01L24/17of a plurality of bump connectors

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Patents Grantslast 30 patents

Information Patent Grant
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- Issue date Dec 17, 2024
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
Bridge interconnection with layered interconnect structures
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Information Patent Grant
Semiconductor package including test bumps
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Face-to-face through-silicon via multi-chip semiconductor apparatus...
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Information Patent Grant
Semiconductor structure and method of forming the same
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Information Patent Grant
Package structure with reinforcement structures in a redistribution...
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Information Patent Grant
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Metal bonding structure and manufacturing method thereof
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Information Patent Grant
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Information Patent Grant
Semiconductor package and manufacturing method thereof
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Information Patent Grant
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- Issue date Oct 8, 2024
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Patents Applicationslast 30 patents

Information Patent Application
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OPTICAL PACKAGING
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THREE-DIMENSIONAL INTEGRATED CIRCUIT
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
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SEMICONDUCTOR PACKAGE
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SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
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COMPUTING DEVICE AND COMPUTING SYSTEM INCLUDING THE SAME
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SEMICONDUCTOR PACKAGE IN A STACK FORM
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- Taiwan Semiconductor Manufacturing company Ltd.
- TING-YU YEH
- H01 - BASIC ELECTRIC ELEMENTS

of a plurality of bump connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Metal-free frame design for silicon bridges for semiconductor packages

Semiconductor device packages and methods of manufacturing the same

Method of manufacturing integrated circuit device with bonding stru...

Semiconductor package and method of fabricating the same

Semiconductor devices and methods of manufacturing semiconductor de...

Multi-tier IC package including processor and high bandwidth memory

Electrical interconnect bridge

Bonding structures and methods for forming the same

Active bridge enabled co-packaged photonic transceiver

Semiconductor device assembly with die support structures

Forming large chips through stitching

Multi-die ultrafine pitch patch architecture of interconnect bridge...

Nested architectures for enhanced heterogeneous integration

Semiconductor package

Integrated fan-out package and the methods of manufacturing

Integrated circuit device with embedded programmable logic

Microelectronic assemblies

Method for fabricating semiconductor package

Bridge interconnection with layered interconnect structures

Semiconductor package including test bumps

Face-to-face through-silicon via multi-chip semiconductor apparatus...

RF devices with enhanced performance and methods of forming the sam...

Chip package structure with cavity in interposer

Semiconductor structure and method of forming the same

Package structure with reinforcement structures in a redistribution...

Integrated self-aligned assembly

Metal bonding structure and manufacturing method thereof

Multi-chip package and method of providing die-to-die interconnects...

Semiconductor package and manufacturing method thereof

Microelectronic assemblies

Patents Applicationslast 30 patents

MICROELECTRONIC ASSEMBLIES INCLUDING A MOLD MATERIAL WITH A STRESS-...

APPARATUS INCLUDING TSV STRUCTURE

HIGH DENSITY INTERCONNECT DEVICE AND METHOD

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE

UNIFORM CHIP GAPS VIA INJECTION-MOLDED SOLDER PILLARS

ON DIE FLEXURE CONTROL DEVICE AND METHOD

CONDUCTIVE LINES FOR INTERCONNECTION IN STACKED DEVICE STRUCTURES

OPTICAL PACKAGING

THREE-DIMENSIONAL INTEGRATED CIRCUIT

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Multi-Die Package Structures Including Redistribution Layers

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

DISTRIBUTING ON CHIP INDUCTORS FOR MONOLITHIC VOLTAGE REGULATION

SEMICONDUCTOR PACKAGE

THREE-DIMENSIONAL INTEGRATED CIRCUIT (3DIC) SYSTEMS WITH A HEAT SPR...

SYSTEMS AND METHODS FOR ASSEMBLING PROCESSOR SYSTEMS

CIRCUIT BOARD DEVICE WITH INDUCTOR(S) FOR ROUTING POWER FROM A POWE...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

COMPUTING DEVICE AND COMPUTING SYSTEM INCLUDING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE WITH THERMAL RELAXATI...

SEMICONDUCTOR PACKAGE IN A STACK FORM

Semiconductor Device Package and Methods of Manufacture

HYBRID MICRO-BUMP INTEGRATION WITH REDISTRIBUTION LAYER

METAL BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Semiconductor Device and Method of Manufacture

METHODS AND SYSTEMS FOR MEASURING SEMICONDUCTOR DEVICES

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE