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-
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SEMICONDUCTOR PACKAGE
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Publication number 20240145418
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Publication date May 2, 2024
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Samsung Electronics Co., Ltd.
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Junghoo Yun
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H01 - BASIC ELECTRIC ELEMENTS
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-
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SUBSTRATE AND PACKAGE STRUCTURE
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Publication number 20240136317
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Publication date Apr 25, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Wei-Hung Lin
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H01 - BASIC ELECTRIC ELEMENTS
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MICROELECTRONIC ASSEMBLIES
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Publication number 20240136323
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Publication date Apr 25, 2024
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Intel Corporation
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Shawna M. Liff
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H01 - BASIC ELECTRIC ELEMENTS
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-
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SEMICONDUCTOR PACKAGE
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Publication number 20240128195
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Publication date Apr 18, 2024
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Samsung Electronics Co., Ltd.
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Sangwoong Lee
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H01 - BASIC ELECTRIC ELEMENTS
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MULTI-CHIP PACKAGING
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Publication number 20240128256
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Publication date Apr 18, 2024
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Intel Corporation
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Robert L. Sankman
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H01 - BASIC ELECTRIC ELEMENTS
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-
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CHIP STRUCTURE
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Publication number 20240120277
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Publication date Apr 11, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Hong-Seng SHUE
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20240120280
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Publication date Apr 11, 2024
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Samsung Electronics Co., Ltd.
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Kyungdon Mun
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H01 - BASIC ELECTRIC ELEMENTS
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-
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Fan-Out Package with Cavity Substrate
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Publication number 20240105705
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Publication date Mar 28, 2024
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Po-Hao Tsai
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H01 - BASIC ELECTRIC ELEMENTS
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INTERPOSER CIRCUIT
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Publication number 20240094289
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Publication date Mar 21, 2024
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TEXAS INSTRUMENTS INCORPORATED
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Lee D. Whetsel
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H01 - BASIC ELECTRIC ELEMENTS